Yang; Hee-sang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Hee-sang.The latest application filed is for "overhead hoist transfer system and factory system employing the same".

Company Profile

0.6.6

Yang; Hee-sang - Asan-si KR
Yang; Hee-Sang - Cheonan-si KR
Yang; Hee-Sang - Chungcheongnam-do KR
Yang; Hee-Sang - Cheonan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus for inspecting magazine including stopper Grant 9,562,816 - Ji , et al. February 7, 2	2017-02-07
Overhead Hoist Transfer System And Factory System Employing The Same App 20150329334 - LEE; Jae-Nam ; et al.	2015-11-19
Apparatus For Inspecting Magazine Including Stopper App 20150053595 - Ji; Chang-hwan ; et al.	2015-02-26
Automatic carrier transfer for transferring a substrate carrier in a semiconductor manufacturing post-process and method of transferring the substrate carrier using the same Grant 8,939,696 - Lee , et al. January 27, 2	2015-01-27
Automatic Carrier Transfer For Transferring A Substrate Carrier In A Semiconductor Manufacturing Post-process And Method Of Transferring The Substrate Carrier Using The Same App 20130216336 - LEE; Jae-Nam ; et al.	2013-08-22
Apparatus for locking a magazine Grant 8,317,015 - Ji , et al. November 27, 2	2012-11-27
Equipment and method for cutting package Grant 8,132,305 - Choi , et al. March 13, 2	2012-03-13
Apparatus for Locking a Magazine App 20110042242 - Ji; Chang-Hwan ; et al.	2011-02-24
Equipment And Method For Cutting Package App 20080056832 - CHOI; Tai-Kew ; et al.	2008-03-06
Solder ball attaching system and method Grant 6,974,069 - Kang , et al. December 13, 2	2005-12-13
Solder ball attaching system and method App 20030213832 - Kang, Ju-Il ; et al.	2003-11-20
Solder ball attaching system and method Grant 6,607,117 - Kang , et al. August 19, 2	2003-08-19

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