| Patent | Date |
|---|
Semiconductor device and method of forming an integrated SiP module with embedded inductor or package
Grant 11,367,690 - Yang , et al. June 21, 2 | 2022-06-21 |
Semiconductor device and method of forming protrusion e-bar for 3D SiP
Grant 11,342,294 - Yang , et al. May 24, 2 | 2022-05-24 |
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App 20220115332 - Lee; HunTeak ; et al. | 2022-04-14 |
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App 20220052025 - Yang; DeokKyung ; et al. | 2022-02-17 |
Method and device for reducing metal burrs when sawing semiconductor packages
Grant 11,244,908 - Lee , et al. February 8, 2 | 2022-02-08 |
Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
Grant 11,189,598 - Yang , et al. November 30, 2 | 2021-11-30 |
Integrated circuit packaging system with shielding and method of manufacture thereof
Grant 11,145,603 - Han , et al. October 12, 2 | 2021-10-12 |
Integrated circuit packaging system with shielding and method of manufacture thereof
Grant 11,024,585 - Han , et al. June 1, 2 | 2021-06-01 |
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App 20210151386 - Yang; DeokKyung ; et al. | 2021-05-20 |
Molded laser package with electromagnetic interference shield and method of making
Grant 10,937,741 - Yang , et al. March 2, 2 | 2021-03-02 |
System-in-Package with Double-Sided Molding
App 20200402955 - Yang; DeokKyung ; et al. | 2020-12-24 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20200373289 - Yang; DeokKyung ; et al. | 2020-11-26 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,797,039 - Yang , et al. October 6, 2 | 2020-10-06 |
System-in-package with double-sided molding
Grant 10,797,024 - Yang , et al. October 6, 2 | 2020-10-06 |
Semiconductor device and method of forming a 3D integrated system-in-package module
Grant 10,790,268 - Yang , et al. September 29, 2 | 2020-09-29 |
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App 20200286835 - Yang; DeokKyung ; et al. | 2020-09-10 |
System-in-Package with Double-Sided Molding
App 20200219847 - Yang; DeokKyung ; et al. | 2020-07-09 |
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
App 20200219859 - Yang; DeokKyung ; et al. | 2020-07-09 |
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App 20200219835 - Yang; DeokKyung ; et al. | 2020-07-09 |
Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
Grant 10,700,011 - Yang , et al. | 2020-06-30 |
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App 20200161252 - Yang; DeokKyung ; et al. | 2020-05-21 |
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App 20200144198 - Lee; HunTeak ; et al. | 2020-05-07 |
Semiconductor device and method of forming a 3D integrated system-in-package module
Grant 10,636,774 - Yang , et al. | 2020-04-28 |
Semiconductor device and method of forming protrusion E-bar for 3D SIP
Grant 10,636,756 - Yang , et al. | 2020-04-28 |
System-in-package with double-sided molding
Grant 10,636,765 - Yang , et al. | 2020-04-28 |
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App 20200013738 - Yang; DeokKyung ; et al. | 2020-01-09 |
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App 20200006295 - Yang; DeokKyung ; et al. | 2020-01-02 |
Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
Grant 10,468,384 - Yang , et al. No | 2019-11-05 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,388,637 - Kim , et al. A | 2019-08-20 |
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App 20190088621 - Yang; DeokKyung ; et al. | 2019-03-21 |
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
App 20190074267 - Yang; DeokKyung ; et al. | 2019-03-07 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20180294235 - Han; Byung Joon ; et al. | 2018-10-11 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20180294236 - Han; Byung Joon ; et al. | 2018-10-11 |
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
Grant 10,083,903 - Yoon , et al. September 25, 2 | 2018-09-25 |
System -in-Package with Double-Sided Molding
App 20180269181 - Yang; DeokKyung ; et al. | 2018-09-20 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20180261569 - Yang; DeokKyung ; et al. | 2018-09-13 |
Integrated circuit packaging system with shielding and method of manufacturing thereof
Grant 9,997,468 - Han , et al. June 12, 2 | 2018-06-12 |
Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
App 20180158768 - Kim; OhHan ; et al. | 2018-06-07 |
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App 20180158779 - Yang; DeokKyung ; et al. | 2018-06-07 |
Interposer substrate designs for semiconductor packages
Grant 9,905,491 - Yoon , et al. February 27, 2 | 2018-02-27 |
Integrated circuit packaging system with conductive pillars and method of manufacture thereof
Grant 9,748,203 - Yang , et al. August 29, 2 | 2017-08-29 |
Integrated Circuit Packaging System With Shielding And Method Of Manufacture Thereof
App 20160300799 - Han; Byung Joon ; et al. | 2016-10-13 |
Integrated circuit packaging system with molded laser via interposer and method of manufacture thereof
Grant 9,385,066 - Yoon , et al. July 5, 2 | 2016-07-05 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof
Grant 9,230,898 - Shin , et al. January 5, 2 | 2016-01-05 |
Integrated circuit packaging system with connection structure and method of manufacture thereof
Grant 9,202,715 - Kim , et al. December 1, 2 | 2015-12-01 |
Methods of mitigating defects for semiconductor packages
Grant 9,184,067 - Kim , et al. November 10, 2 | 2015-11-10 |
Integrated circuit packaging system with coreless substrate and method of manufacture thereof
Grant 9,171,739 - Roh , et al. October 27, 2 | 2015-10-27 |
Integrated circuit package system having cavity
Grant 8,823,160 - Ha , et al. September 2, 2 | 2014-09-02 |
Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposer
Grant 8,765,525 - Yoon , et al. July 1, 2 | 2014-07-01 |
Integrated circuit packaging system with interposer and method of manufacture thereof
Grant 8,699,232 - Choi , et al. April 15, 2 | 2014-04-15 |
Method of manufacturing integrated circuit packaging system with support structure
Grant 8,633,100 - Yang , et al. January 21, 2 | 2014-01-21 |
Integrated circuit packaging system with dual side mold and method of manufacture thereof
Grant 8,603,859 - Yang , et al. December 10, 2 | 2013-12-10 |
Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof
Grant 8,592,973 - Park , et al. November 26, 2 | 2013-11-26 |
Integrated circuit packaging system with dielectric support and method of manufacture thereof
Grant 8,546,957 - Ko , et al. October 1, 2 | 2013-10-01 |
Integrated circuit packaging system with stackable package and method of manufacture thereof
Grant 8,518,752 - Yang , et al. August 27, 2 | 2013-08-27 |
Semiconductor packaging system with an aligned interconnect and method of manufacture thereof
Grant 8,497,575 - Yoon , et al. July 30, 2 | 2013-07-30 |
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof
App 20130154092 - Yang; DeokKyung ; et al. | 2013-06-20 |
Integrated Circuit Packaging System With Interposer And Method Of Manufacture Thereof
App 20130070438 - Choi; A Leam ; et al. | 2013-03-21 |
Integrated Circuit Packaging System With Dual Side Mold And Method Of Manufacture Thereof
App 20130069240 - Yang; DeokKyung ; et al. | 2013-03-21 |
Integrated Circuit Packaging System With Support Structure And Method Of Manufacture Thereof
App 20120319286 - Yang; DeokKyung ; et al. | 2012-12-20 |
Integrated Circuit Packaging System With Molded Laser Via Interposer And Method Of Manufacture Thereof
App 20120319265 - Yoon; In Sang ; et al. | 2012-12-20 |
Integrated Circuit Packaging System With Leads And Method Of Manufacture Thereof
App 20120223435 - Choi; A Leam ; et al. | 2012-09-06 |
Integrated circuit package system with step mold recess
Grant 8,247,894 - Yoon , et al. August 21, 2 | 2012-08-21 |
Integrated Circuit Packaging System With Dielectric Support And Method Of Manufacture Thereof
App 20120146246 - Ko; WonJun ; et al. | 2012-06-14 |
Integrated Circuit Packaging System With Connection Structure And Method Of Manufacture Thereof
App 20120119360 - Kim; YoungChul ; et al. | 2012-05-17 |
Integrated circuit package system
Grant 8,102,666 - Park , et al. January 24, 2 | 2012-01-24 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
Grant 8,093,100 - Choi , et al. January 10, 2 | 2012-01-10 |
Integrated circuit packaging system with exposed conductor and method of manufacture thereof
Grant 8,067,306 - Yang , et al. November 29, 2 | 2011-11-29 |
Semiconductor package system with through silicon via interposer
Grant 8,063,475 - Choi , et al. November 22, 2 | 2011-11-22 |
Integrated Circuit Packaging System With Exposed Conductor And Method Of Manufacture Thereof
App 20110210437 - Yang; DeokKyung ; et al. | 2011-09-01 |
Semiconductor Packaging System With An Aligned Interconnect And Method Of Manufacture Thereof
App 20110204508 - Yoon; In Sang ; et al. | 2011-08-25 |
Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof
Grant 7,994,625 - Choi , et al. August 9, 2 | 2011-08-09 |
Integrated Circuit Packaging System With Stackable Package And Method Of Manufacture Thereof
App 20110127662 - Yang; DeokKyung ; et al. | 2011-06-02 |
Integrated Circuit Packaging System With Package-on-package Stacking And Method Of Manufacture Thereof
App 20110089552 - Park; HyungSang ; et al. | 2011-04-21 |
Integrated Circuit Packaging System Having Through Silicon Via With Direct Interconnects And Method Of Manufacture Thereof
App 20110062591 - Choi; A Leam ; et al. | 2011-03-17 |
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof
App 20110037157 - Shin; HanGil ; et al. | 2011-02-17 |
Integrated circuit with step molded inner stacking module package in package system
Grant 7,875,967 - Yang , et al. January 25, 2 | 2011-01-25 |
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
Grant 7,859,099 - Choi , et al. December 28, 2 | 2010-12-28 |
Integrated Circuit Packaging System Having Through Silicon Via With Direct Interconnects And Method Of Manufacture Thereof
App 20100148354 - Choi; A Leam ; et al. | 2010-06-17 |
Integrated Circuit Packaging System Having An Internal Structure Protrusion And Method Of Manufacture Thereof
App 20100123232 - Choi; DaeSik ; et al. | 2010-05-20 |
Semiconductor Package System With Through Silicon Via Interposer
App 20100078789 - Choi; DaeSik ; et al. | 2010-04-01 |
Integrated circuit package-on-package system with central bond wires
Grant 7,687,920 - Yang , et al. March 30, 2 | 2010-03-30 |
Integrated Circuit Package System Having Cavity
App 20100044878 - Ha; Jong-Woo ; et al. | 2010-02-25 |
Integrated Circuit Package System
App 20100046183 - Park; HyungSang ; et al. | 2010-02-25 |
Integrated Circuit Package-on-package System With Central Bond Wires
App 20090256267 - Yang; DeokKyung ; et al. | 2009-10-15 |
Integrated Circuit Package System With Step Mold Recess
App 20090236720 - Yoon; In Sang ; et al. | 2009-09-24 |
Integrated Circuit With Step Molded Inner Stacking Module Package In Package System
App 20090224390 - Yang; DeokKyung ; et al. | 2009-09-10 |
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