loadpatents
name:-0.020438194274902
name:-0.017382144927979
name:-0.015596151351929
Yang; Chung-Ying Patent Filings

Yang; Chung-Ying

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Chung-Ying.The latest application filed is for "guard ring method for semiconductor devices".

Company Profile
1.23.20
  • Yang; Chung-Ying - Taoyuan TW
  • Yang; Chung-Ying - Taoyuan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Guard ring method for semiconductor devices
Grant 10,998,277 - Chen , et al. May 4, 2
2021-05-04
Guard Ring Method For Semiconductor Devices
App 20190304932 - Chen; Hsien-Wei ;   et al.
2019-10-03
Guard ring method for semiconductor devices
Grant 10,325,864 - Chen , et al.
2019-06-18
Guard Ring Method For Semiconductor Devices
App 20170012005 - CHEN; Hsien-Wei ;   et al.
2017-01-12
Guard ring design structure for semiconductor devices
Grant 9,478,505 - Chen , et al. October 25, 2
2016-10-25
Chip package and method of manufacturing the same
Grant 9,337,117 - Yang , et al. May 10, 2
2016-05-10
Methods and apparatus for heat spreader on silicon
Grant 9,236,322 - Chen , et al. January 12, 2
2016-01-12
Seal ring structure for integrated circuit chips
Grant 9,117,831 - Yang , et al. August 25, 2
2015-08-25
Chip Package And Method Of Manufacturing The Same
App 20150206817 - YANG; Chung-Ying ;   et al.
2015-07-23
Methods of making integrated circuits
Grant 9,064,939 - Yang , et al. June 23, 2
2015-06-23
Chip package and method of manufacturing the same
Grant 8,957,503 - Yang , et al. February 17, 2
2015-02-17
Methods Of Making Integrated Circuits
App 20140315383 - YANG; Chung-Ying ;   et al.
2014-10-23
Integrated circuits with leakage current test structure
Grant 8,796,686 - Yang , et al. August 5, 2
2014-08-05
Chip Package And Method Of Manufacturing The Same
App 20140091437 - YANG; Chung-Ying ;   et al.
2014-04-03
Package-on-package structures with reduced bump bridging
Grant 8,669,651 - Yang , et al. March 11, 2
2014-03-11
Wafer level chip scale package and method of manufacturing the same
Grant 8,624,359 - Yang , et al. January 7, 2
2014-01-07
Guard Ring Design Structure For Semiconductor Devices
App 20130270710 - CHEN; Hsien-Wei ;   et al.
2013-10-17
Methods And Apparatus For Heat Spreader On Silicon
App 20130270686 - Chen; Hsien-Wei ;   et al.
2013-10-17
Wafer Level Chip Scale Package And Method Of Manufacturing The Same
App 20130087914 - YANG; Chung-Ying ;   et al.
2013-04-11
Grounded seal ring structure in semiconductor devices
Grant 8,395,239 - Chen , et al. March 12, 2
2013-03-12
Integrated Circuits With Leakage Current Test Structure
App 20130048980 - YANG; Chung-Ying ;   et al.
2013-02-28
Seal ring structure in semiconductor devices
Grant 8,253,217 - Chen , et al. August 28, 2
2012-08-28
Probe pad on a corner stress relief region in a semiconductor chip
Grant 8,237,160 - Chen , et al. August 7, 2
2012-08-07
Seal Ring Structure For Integrated Circuit Chips
App 20120175728 - YANG; Ching-Jung ;   et al.
2012-07-12
Probe pad on a corner stress relief region in a semiconductor chip
Grant 8,217,394 - Yang , et al. July 10, 2
2012-07-10
Structure to reduce etching residue
Grant 8,217,499 - Yu , et al. July 10, 2
2012-07-10
Structure to Reduce Etching Residue
App 20120126359 - Yu; Tsung-Yuan ;   et al.
2012-05-24
Grounded Seal Ring Structure In Semiconductor Devices
App 20120104594 - Chen; Hsien-Wei ;   et al.
2012-05-03
Package-on-Package Structures with Reduced Bump Bridging
App 20120018877 - Yang; Chung-Ying ;   et al.
2012-01-26
Seal Ring Structure In Semiconductor Devices
App 20110309465 - Chen; Hsien-Wei ;   et al.
2011-12-22
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip
App 20110284843 - Chen; Hsien-Wei ;   et al.
2011-11-24
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip
App 20110266541 - Yang; Chung-Ying ;   et al.
2011-11-03

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