loadpatents
Patent applications and USPTO patent grants for Yang; Chung-Ying.The latest application filed is for "guard ring method for semiconductor devices".
Patent | Date |
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Guard ring method for semiconductor devices Grant 10,998,277 - Chen , et al. May 4, 2 | 2021-05-04 |
Guard Ring Method For Semiconductor Devices App 20190304932 - Chen; Hsien-Wei ;   et al. | 2019-10-03 |
Guard ring method for semiconductor devices Grant 10,325,864 - Chen , et al. | 2019-06-18 |
Guard Ring Method For Semiconductor Devices App 20170012005 - CHEN; Hsien-Wei ;   et al. | 2017-01-12 |
Guard ring design structure for semiconductor devices Grant 9,478,505 - Chen , et al. October 25, 2 | 2016-10-25 |
Chip package and method of manufacturing the same Grant 9,337,117 - Yang , et al. May 10, 2 | 2016-05-10 |
Methods and apparatus for heat spreader on silicon Grant 9,236,322 - Chen , et al. January 12, 2 | 2016-01-12 |
Seal ring structure for integrated circuit chips Grant 9,117,831 - Yang , et al. August 25, 2 | 2015-08-25 |
Chip Package And Method Of Manufacturing The Same App 20150206817 - YANG; Chung-Ying ;   et al. | 2015-07-23 |
Methods of making integrated circuits Grant 9,064,939 - Yang , et al. June 23, 2 | 2015-06-23 |
Chip package and method of manufacturing the same Grant 8,957,503 - Yang , et al. February 17, 2 | 2015-02-17 |
Methods Of Making Integrated Circuits App 20140315383 - YANG; Chung-Ying ;   et al. | 2014-10-23 |
Integrated circuits with leakage current test structure Grant 8,796,686 - Yang , et al. August 5, 2 | 2014-08-05 |
Chip Package And Method Of Manufacturing The Same App 20140091437 - YANG; Chung-Ying ;   et al. | 2014-04-03 |
Package-on-package structures with reduced bump bridging Grant 8,669,651 - Yang , et al. March 11, 2 | 2014-03-11 |
Wafer level chip scale package and method of manufacturing the same Grant 8,624,359 - Yang , et al. January 7, 2 | 2014-01-07 |
Guard Ring Design Structure For Semiconductor Devices App 20130270710 - CHEN; Hsien-Wei ;   et al. | 2013-10-17 |
Methods And Apparatus For Heat Spreader On Silicon App 20130270686 - Chen; Hsien-Wei ;   et al. | 2013-10-17 |
Wafer Level Chip Scale Package And Method Of Manufacturing The Same App 20130087914 - YANG; Chung-Ying ;   et al. | 2013-04-11 |
Grounded seal ring structure in semiconductor devices Grant 8,395,239 - Chen , et al. March 12, 2 | 2013-03-12 |
Integrated Circuits With Leakage Current Test Structure App 20130048980 - YANG; Chung-Ying ;   et al. | 2013-02-28 |
Seal ring structure in semiconductor devices Grant 8,253,217 - Chen , et al. August 28, 2 | 2012-08-28 |
Probe pad on a corner stress relief region in a semiconductor chip Grant 8,237,160 - Chen , et al. August 7, 2 | 2012-08-07 |
Seal Ring Structure For Integrated Circuit Chips App 20120175728 - YANG; Ching-Jung ;   et al. | 2012-07-12 |
Probe pad on a corner stress relief region in a semiconductor chip Grant 8,217,394 - Yang , et al. July 10, 2 | 2012-07-10 |
Structure to reduce etching residue Grant 8,217,499 - Yu , et al. July 10, 2 | 2012-07-10 |
Structure to Reduce Etching Residue App 20120126359 - Yu; Tsung-Yuan ;   et al. | 2012-05-24 |
Grounded Seal Ring Structure In Semiconductor Devices App 20120104594 - Chen; Hsien-Wei ;   et al. | 2012-05-03 |
Package-on-Package Structures with Reduced Bump Bridging App 20120018877 - Yang; Chung-Ying ;   et al. | 2012-01-26 |
Seal Ring Structure In Semiconductor Devices App 20110309465 - Chen; Hsien-Wei ;   et al. | 2011-12-22 |
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip App 20110284843 - Chen; Hsien-Wei ;   et al. | 2011-11-24 |
Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip App 20110266541 - Yang; Chung-Ying ;   et al. | 2011-11-03 |
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