Yang; Ching-Hsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Ching-Hsu.The latest application filed is for "high heat dissipation flip chip package structure".
- Yang; Ching-Hsu - Kaoshiung TW
- Yang; Ching-Hsu - Taichung TW
- Yang; Ching Hsu - Taichung City TW
| Patent | Date |
|---|---|
| Cavity-down multiple-chip package Grant 7,446,409 - Yang November 4, 2 | 2008-11-04 |
| Thermal enhance package with universal heat spreader Grant 7,224,057 - Yang May 29, 2 | 2007-05-29 |
| High heat dissipation flip chip package structure App 20060091528 - Yang; Ching-Hsu | 2006-05-04 |
| Cavity-down thermally enhanced package App 20060091531 - Yang; Ching-Hsu | 2006-05-04 |
| Cavity-down multiple-chip package App 20060087009 - Yang; Ching-Hsu | 2006-04-27 |
| Chip package having a heat spreader and method for packaging the same App 20060043553 - Yang; Ching Hsu ; et al. | 2006-03-02 |
| Flip chip package with thermometer Grant 6,972,489 - Wu , et al. December 6, 2 | 2005-12-06 |
| Cavity-down semiconductor package with heat spreader App 20050087864 - Yang, Ching-Hsu ; et al. | 2005-04-28 |
| Thermal enhance package with universal heat spreader App 20040084763 - Yang, Ching-Hsu | 2004-05-06 |
| Flip chip package with thermometer App 20040032025 - Wu, Jeng Da ; et al. | 2004-02-19 |
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