Yang; Chin-Hao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Chin-Hao.The latest application filed is for "hardware trojan immunity device and operation method thereof".

Company Profile

0.7.7

Yang; Chin-Hao - New Taipei City TW
Yang; Chin-Hao - New Taipei TW
Yang; Chin-Hao - Taipei TW
Yang, Chin-Hao - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Hardware Trojan Immunity Device And Operation Method Thereof App 20210271754 - Ho; Ying-Chieh ; et al.	2021-09-02
Hard disk quick release unit and hard disk replacement module Grant 9,823,714 - Yang , et al. November 21, 2	2017-11-21
Hard Disk Quick Release Unit And Hard Disk Replacement Module App 20170228000 - YANG; CHIN-HAO ; et al.	2017-08-10
Removable hard drive storage device Grant 9,064,511 - Yang , et al. June 23, 2	2015-06-23
Removable hard disk drive holder Grant 8,976,520 - Yang , et al. March 10, 2	2015-03-10
Collapsible cable management arm Grant 8,882,055 - Yang , et al. November 11, 2	2014-11-11
Base assembly for server computer hard drive drawer Grant 8,845,042 - Yang , et al. September 30, 2	2014-09-30
Removable Hard Disk Drive Holder App 20140022723 - YANG; CHIN-HAO ; et al.	2014-01-23
Base Assembly For Server Computer Hard Drive Drawer App 20130342092 - YANG; CHIN-HAO ; et al.	2013-12-26
Collapsible Cable Management Arm App 20130341471 - YANG; CHIN-HAO ; et al.	2013-12-26
Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer Grant 7,141,269 - Liu , et al. November 28, 2	2006-11-28
Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition Grant 6,838,116 - Liu , et al. January 4, 2	2005-01-04
Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer App 20040222558 - Liu, Don-Gey ; et al.	2004-11-11
Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition App 20040108221 - Liu, Don-Gey ; et al.	2004-06-10

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