Patent | Date |
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Method of forming a mask design having advanced oriented assist features for integrated circuit hole patterns Grant 7,858,273 - Yang December 28, 2 | 2010-12-28 |
Reel-type package of flexible printed circuit boards and method for supplying thereof Grant 7,686,909 - Cheng , et al. March 30, 2 | 2010-03-30 |
Advanced Oriented Assist Features For Integrated Circuit Hole Patterns App 20100009139 - Yang; Chin Chen | 2010-01-14 |
Method of optically transferring a pattern from a mask having advanced oriented assist features for integrated circuit hole patterns Grant 7,575,852 - Yang August 18, 2 | 2009-08-18 |
Image sensor with a protection layer Grant 7,525,139 - Yang , et al. April 28, 2 | 2009-04-28 |
Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP Grant 7,400,037 - Yang , et al. July 15, 2 | 2008-07-15 |
Reel-type package of flexible printed circuit borads and method for supplying thereof App 20070295444 - Cheng; Ping-Chin ;   et al. | 2007-12-27 |
FBGA and COB package structure for image sensor Grant 7,279,782 - Yang , et al. October 9, 2 | 2007-10-09 |
Manually operated switch for a faucet Grant 7,258,322 - Yang August 21, 2 | 2007-08-21 |
Liquid crystal display module Grant 7,142,262 - Chen , et al. November 28, 2 | 2006-11-28 |
FBGA and COB package structure for image sensor App 20060145325 - Yang; Wen-Kun ;   et al. | 2006-07-06 |
Filling paste structure and process for WL-CSP App 20060145364 - Yang; Wen-Kun ;   et al. | 2006-07-06 |
Bump layout on silicon chip Grant 7,061,117 - Yang , et al. June 13, 2 | 2006-06-13 |
Method Of Forming A Light Guide Plate Insert Mold App 20060073421 - Chen; Irene ;   et al. | 2006-04-06 |
Advanced oriented assist features for integrated circuit hole patterns App 20060040189 - Yang; Chin Chen | 2006-02-23 |
Method of fabricating a stamper by half-tone technology Grant 6,994,951 - Chen , et al. February 7, 2 | 2006-02-07 |
Imagine sensor with a protection layer App 20050242409 - Yang, Wen-Kun ;   et al. | 2005-11-03 |
Method For Fabricating Metallic Structure App 20050208435 - Chen, Irene ;   et al. | 2005-09-22 |
Liquid crystal display module App 20050083444 - Chen, Hui-Chang ;   et al. | 2005-04-21 |
Display panel with bypassing lines Grant 6,844,629 - Chen , et al. January 18, 2 | 2005-01-18 |
Reel-type package of flexible printed circuit boards and method for supplying thereof App 20040177919 - Cheng, Ping-Chin ;   et al. | 2004-09-16 |
[bump Layout On Silicon Chip] App 20040169291 - Yang, Wen-Chih ;   et al. | 2004-09-02 |
Display panel with bypassing lines App 20040056331 - Chen, Shan-Te ;   et al. | 2004-03-25 |
Metal bump Grant 6,608,382 - Liu , et al. August 19, 2 | 2003-08-19 |
Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB Grant 6,556,268 - Lee , et al. April 29, 2 | 2003-04-29 |
Bump layout on silicon chip App 20030034168 - Yang, Wen-Chih ;   et al. | 2003-02-20 |
Metal bump App 20020109227 - Liu, I-Ming ;   et al. | 2002-08-15 |
Repairable TFT-LCD assembly and method for making in which a separation tape positioned between two anisotropic conductive films Grant 6,373,545 - Yang , et al. April 16, 2 | 2002-04-16 |
Multiple-shaft pen kit Grant 5,927,881 - Yang July 27, 1 | 1999-07-27 |
Pen Grant D392,315 - Yang March 17, 1 | 1998-03-17 |