Yang; Chih-Kuai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Chih-Kuai.The latest application filed is for "electronic package and method for fabricating the same".
- Yang; Chih-Kuai - Hsinchu County TW
| Patent | Date |
|---|---|
| Method of fabricating packaging substrate Grant 11,031,329 - Hu , et al. June 8, 2 | 2021-06-08 |
| Electronic package having heat dissipating element and method for fabricating the same Grant 10,896,882 - Hsu , et al. January 19, 2 | 2021-01-19 |
| Electronic Package And Method For Fabricating The Same App 20190214349 - Hsu; Shih-Ping ; et al. | 2019-07-11 |
| Package substrate Grant 10,062,649 - Hsu , et al. August 28, 2 | 2018-08-28 |
| Packaging Substrate And Method Of Fabricating The Same App 20180240748 - Hu; Chu-Chin ; et al. | 2018-08-23 |
| Packaging Substrate And Method Of Fabricating The Same App 20180240747 - Hu; Chu-Chin ; et al. | 2018-08-23 |
| Packaging substrate and method of fabricating the same Grant 10,002,823 - Hu , et al. June 19, 2 | 2018-06-19 |
| Method of fabricating package substrates Grant 9,831,217 - Hu , et al. November 28, 2 | 2017-11-28 |
| Packaging Substrate And Method Of Fabricating The Same App 20170338174 - Hu; Chu-Chin ; et al. | 2017-11-23 |
| Substrate structure and manufacturing method thereof Grant 9,805,996 - Hsu , et al. October 31, 2 | 2017-10-31 |
| Method Of Fabricating Package Substrates App 20170301652 - HU; CHU-CHIN ; et al. | 2017-10-19 |
| Package Substrate App 20170207173 - HSU; SHIH-PING ; et al. | 2017-07-20 |
| Substrate Structure and Manufacturing Method Thereof App 20170019995 - Hsu; Shih-Ping ; et al. | 2017-01-19 |
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