loadpatents
Patent applications and USPTO patent grants for Yang; Chih-Kai.The latest application filed is for "memory device".
Patent | Date |
---|---|
Memory Device App 20220302168 - Yang; Chih-Kai ;   et al. | 2022-09-22 |
Wafer Positioning Method and Apparatus App 20220293448 - Chen; Chia-Cheng ;   et al. | 2022-09-15 |
Memory device with sub-slits Grant 11,411,020 - Yang , et al. August 9, 2 | 2022-08-09 |
Heat dissipation system Grant 11,397,453 - Lu , et al. July 26, 2 | 2022-07-26 |
Card Shaped Mobile Payment Device And Operation Method Thereof App 20220164800 - CHENG; MENG-JEN ;   et al. | 2022-05-26 |
Three-dimensional Memory Device And Method Of Manufacturing The Same App 20220165747 - YANG; Chih-Kai ;   et al. | 2022-05-26 |
Card Shaped Mobile Payment Device And Operation Method Thereof App 20220164624 - CHENG; MENG-JEN ;   et al. | 2022-05-26 |
Server device Grant 11,337,317 - Yang , et al. May 17, 2 | 2022-05-17 |
Electrical Connector Assembly Including A Back Plate Having A Curved Inner Region And A Flat Outer Region App 20220131292 - CHENG; SHAN-YONG ;   et al. | 2022-04-28 |
System And Method For Multiple Step Directional Patterning App 20220102139 - YANG; Chih-Kai ;   et al. | 2022-03-31 |
Etch Apparatus For Compensating Shifted Overlayers App 20220102118 - Chang; Chun-Yen ;   et al. | 2022-03-31 |
Foldable Electronic Device App 20220075409 - Yang; Chih-Kai ;   et al. | 2022-03-10 |
3d Recording And Playing Method And Laptop With Function Of 3d Recording And Playing App 20220078571 - TING; Kuo-Chi ;   et al. | 2022-03-10 |
Server Device App 20220071028 - YANG; Chih-Kai ;   et al. | 2022-03-03 |
Memory Device And Method Of Manufacturing The Same App 20210335801 - Yang; Chih-Kai ;   et al. | 2021-10-28 |
L1-SINR measurement period based on channel measurement resource (CMR) and interference measurement resource (IMR) App 20210321279 - Yang; Chih-Kai ;   et al. | 2021-10-14 |
Heat pipe structure Grant 11,131,510 - Cheng , et al. September 28, 2 | 2021-09-28 |
Three-dimensional memory device and manufacturing method thereof Grant 11,127,756 - Yang , et al. September 21, 2 | 2021-09-21 |
Heat Pipe Structure App 20210278140 - CHENG; Yi-Lun ;   et al. | 2021-09-09 |
Antenna assembly with compact layout traces Grant 11,088,445 - Su , et al. August 10, 2 | 2021-08-10 |
Heat Dissipation System App 20210149463 - LU; Jyun-Ji ;   et al. | 2021-05-20 |
Heat Dissipation System App 20210080196 - HSIEN; Shin-Hsin ;   et al. | 2021-03-18 |
Centrifugal Fan App 20210084792 - HSIEN; Shin-Hsin ;   et al. | 2021-03-18 |
Heat dissipation system Grant 10,948,246 - Hsien , et al. March 16, 2 | 2021-03-16 |
Cooling fan and heat dissipating module including the same Grant 10,921,062 - Yang , et al. February 16, 2 | 2021-02-16 |
Heat dissipation assembly and portable electronic device Grant 10,901,471 - Yang , et al. January 26, 2 | 2021-01-26 |
Three-dimensional Memory Device And Manufacturing Method Thereof App 20210020650 - YANG; CHIH-KAI ;   et al. | 2021-01-21 |
Cooling Fan And Heat Dissipating Module Including The Same App 20200378688 - YANG; Chih-Kai ;   et al. | 2020-12-03 |
Heat Dissipation Assembly And Portable Electronic Device App 20200319685 - YANG; Chih-Kai ;   et al. | 2020-10-08 |
Thermal Insulation Structure App 20200269543 - YANG; Chih-Kai ;   et al. | 2020-08-27 |
Antenna Assembly With Compact Layout Traces App 20190326683 - SU; De-Chang ;   et al. | 2019-10-24 |
Method For Enhancing Sound Volume And System For Enhancing Sound Volume App 20190158956 - CHENG; Yi-Lun ;   et al. | 2019-05-23 |
Noise cancellation device and noise cancellation method Grant 10,262,649 - Cheng , et al. | 2019-04-16 |
Noise Cancellation Device And Noise Cancellation Method App 20190108828 - CHENG; Yi-Lun ;   et al. | 2019-04-11 |
Storage box using cushion package structure Grant 9,896,262 - Yang , et al. February 20, 2 | 2018-02-20 |
Catalysts for thermochemical fuel production and method of producing fuel using thermochemical fuel production Grant 9,873,109 - Yamazaki , et al. January 23, 2 | 2018-01-23 |
Plug connector insertable in two orientations and having a metallic shield plate with arms with hook structures Grant 9,762,009 - Little , et al. September 12, 2 | 2017-09-12 |
Flippable electrical connector Grant 9,755,380 - Little , et al. September 5, 2 | 2017-09-05 |
Non-volatile semiconductor memory Grant 9,748,332 - Yang , et al. August 29, 2 | 2017-08-29 |
Electronic apparatus Grant 9,740,253 - Cheng , et al. August 22, 2 | 2017-08-22 |
Portable electronic apparatus Grant 9,727,090 - Cheng , et al. August 8, 2 | 2017-08-08 |
Electrical connector with grounding plate retained therein Grant 9,705,267 - Cheng , et al. July 11, 2 | 2017-07-11 |
Flippable Electrical Connector App 20170170613 - LITTLE; TERRANCE F. ;   et al. | 2017-06-15 |
Electronic Apparatus App 20170153677 - CHENG; Yi-Lun ;   et al. | 2017-06-01 |
Portable Electronic Apparatus App 20170153673 - CHENG; Yi-Lun ;   et al. | 2017-06-01 |
Flippable electrical connector Grant 9,608,391 - Little , et al. March 28, 2 | 2017-03-28 |
Flippable Electrical Connector App 20170033519 - LITTLE; TERRANCE F. ;   et al. | 2017-02-02 |
Flippable electrical connector Grant 9,502,821 - Little , et al. November 22, 2 | 2016-11-22 |
Heat dissipation module Grant 9,482,219 - Cheng , et al. November 1, 2 | 2016-11-01 |
Flippable electrical connector Grant 9,472,910 - Little , et al. October 18, 2 | 2016-10-18 |
Flippable Electrical Connector App 20160268744 - LITTLE; TERRANCE F. ;   et al. | 2016-09-15 |
Electrical Connector With Grounding Plate Retained Therein App 20160233630 - CHENG; CHIH-PI ;   et al. | 2016-08-11 |
Fan blade structure Grant 9,382,919 - Cheng , et al. July 5, 2 | 2016-07-05 |
Fin Assembly App 20160153721 - CHENG; Yi-Lun ;   et al. | 2016-06-02 |
Heat Dissipation Fin Set App 20160153725 - Cheng; Yi-Lun ;   et al. | 2016-06-02 |
Electronic Device App 20160150679 - CHENG; Yi-Lun ;   et al. | 2016-05-26 |
Electrical connector having a receptacle with a shielding plate and a mating plug with metallic side arms Grant 9,350,126 - Little , et al. May 24, 2 | 2016-05-24 |
Cushion Package Structure App 20160122111 - Yang; Chih-Kai ;   et al. | 2016-05-05 |
Electrical connector having an improved stiffener Grant 9,332,666 - Yeh , et al. May 3, 2 | 2016-05-03 |
Carrier and carrier assembly used thereof for positioning IC package Grant 9,270,035 - Yeh , et al. February 23, 2 | 2016-02-23 |
Holding device used for electrical connector Grant 9,214,754 - Yeh , et al. December 15, 2 | 2015-12-15 |
Electronic device including a jet flow generator Grant 9,131,626 - Wang , et al. September 8, 2 | 2015-09-08 |
Electronic device Grant 9,119,323 - Wang , et al. August 25, 2 | 2015-08-25 |
Flippable Electrical Connector App 20150194770 - LITTLE; TERRANCE F. ;   et al. | 2015-07-09 |
Flippable Electrical Connector App 20150171561 - LITTLE; TERRANCE F. ;   et al. | 2015-06-18 |
Flippable Electrical Connector App 20150171573 - LITTLE; TERRANCE F. ;   et al. | 2015-06-18 |
Electronic Device App 20150156916 - CHENG; Yi-Lun ;   et al. | 2015-06-04 |
Heat Dissipation Module App 20150152858 - CHENG; YI-LUN ;   et al. | 2015-06-04 |
Phosphor Material and Manufacturing Method Thereof App 20150129804 - Yang; Su-Hua ;   et al. | 2015-05-14 |
Electronic device Grant 9,029,696 - Wang , et al. May 12, 2 | 2015-05-12 |
Catalysts For Thermochemical Fuel Production And Method Of Producing Fuel Using Thermochemical Fuel Production App 20150125383 - YAMAZAKI; Yoshihiro ;   et al. | 2015-05-07 |
Electronic device and heat dissipation module thereof Grant 8,897,012 - Wang , et al. November 25, 2 | 2014-11-25 |
Electrical Connector App 20140342611 - YEH; CHENG-CHI ;   et al. | 2014-11-20 |
Holding Device Used For Electrical Connector App 20140329404 - YEH; CHENG-CHI ;   et al. | 2014-11-06 |
Carrier And Carrier Assembly Used Thereof For Positioning Ic Package App 20140328037 - YEH; CHENG-CHI ;   et al. | 2014-11-06 |
Fan Blade Structure App 20140127022 - Cheng; Yi-Lun ;   et al. | 2014-05-08 |
Heat Dissipation Module App 20140116655 - Cheng; Yi-Lun ;   et al. | 2014-05-01 |
Electronic Device App 20140083655 - Wang; Feng-Ku ;   et al. | 2014-03-27 |
Electronic Device App 20140085819 - Wang; Feng-Ku ;   et al. | 2014-03-27 |
Electronic Device And Heat Conduction Element Thereof App 20140085825 - Wang; Feng-Ku ;   et al. | 2014-03-27 |
Network audio testing system and network audio testing method thereof Grant 8,675,821 - Yang , et al. March 18, 2 | 2014-03-18 |
Network Audio Testing System And Network Audio Testing Method Thereof App 20140037073 - YANG; Chih-Kai ;   et al. | 2014-02-06 |
Method for testing heat pipes Grant 8,641,271 - Wang , et al. February 4, 2 | 2014-02-04 |
Electronic Device And Heat Dissipation Module Thereof App 20130294030 - Wang; Feng-Ku ;   et al. | 2013-11-07 |
Catalysts For Thermochemical Fuel Production And Method Of Producing Fuel Using Thermochemical Fuel Production App 20130252808 - YAMAZAKI; Yoshihiro ;   et al. | 2013-09-26 |
Electronic Device App 20130240182 - Wang; Feng-Ku ;   et al. | 2013-09-19 |
Circuit module and electronic device using the same Grant 8,363,400 - Wang , et al. January 29, 2 | 2013-01-29 |
Contact for electric connector and method of making the same Grant 8,262,419 - Chen , et al. September 11, 2 | 2012-09-11 |
Circuit Module And Electronic Device Using The Same App 20120134112 - WANG; Feng-Ku ;   et al. | 2012-05-31 |
Contact For Electric Connector And Method Of Making The Same App 20120015565 - CHEN; KE-HAO ;   et al. | 2012-01-19 |
Contact terminal for test socket Grant 8,033,872 - Yang , et al. October 11, 2 | 2011-10-11 |
IC socket having individual latch hinge Grant 8,033,854 - Gattuso , et al. October 11, 2 | 2011-10-11 |
Contact Terminal For Test Socket App 20110171839 - YANG; CHIH-KAI ;   et al. | 2011-07-14 |
Heat dissipation module Grant 7,954,541 - Wang , et al. June 7, 2 | 2011-06-07 |
Method For Testing Heat Pipes App 20110122915 - Wang; Feng Ku ;   et al. | 2011-05-26 |
Automatic coating device Grant 7,757,627 - Cheng , et al. July 20, 2 | 2010-07-20 |
Folding protective cover for heat-conductive medium Grant 7,589,969 - Wang , et al. September 15, 2 | 2009-09-15 |
Heatsink Module Having Fin Assembly Structure Corresponding To Heat Pipe App 20090211737 - WANG; Feng-Ku ;   et al. | 2009-08-27 |
Retaining Device App 20090201646 - YANG; Chih-Kai ;   et al. | 2009-08-13 |
Chassis Of Portable Electronic Apparatus App 20090201639 - WANG; Feng-Ku ;   et al. | 2009-08-13 |
Heat-dissipating module Grant 7,564,686 - Wang , et al. July 21, 2 | 2009-07-21 |
Heat-dissipating module and electronic apparatus Grant 7,558,062 - Wang , et al. July 7, 2 | 2009-07-07 |
Heat Dissipation Module App 20090056925 - Wang; Feng-Ku ;   et al. | 2009-03-05 |
Heat-dissipating Module App 20090034195 - Wang; Feng-Ku ;   et al. | 2009-02-05 |
Heat-dissipating Module App 20090034196 - Wang; Feng-Ku ;   et al. | 2009-02-05 |
Heat-dissipating Module App 20090034193 - Wang; Feng-Ku ;   et al. | 2009-02-05 |
Heat-dissipating Module And Electronic Apparatus App 20090016020 - Wang; Feng-Ku ;   et al. | 2009-01-15 |
Heatsink apparatus Grant 7,463,484 - Wang , et al. December 9, 2 | 2008-12-09 |
Heatsink module Grant 7,457,119 - Wang , et al. November 25, 2 | 2008-11-25 |
Heat sink fixing assembly Grant 7,436,673 - Wang , et al. October 14, 2 | 2008-10-14 |
Heat Sink Module For Dual Heat Sources App 20080198550 - Wang; Feng-Ku ;   et al. | 2008-08-21 |
Heatsink module App 20080192434 - Wang; Feng-Ku ;   et al. | 2008-08-14 |
Heatsink apparatus App 20080186675 - Wang; Feng-Ku ;   et al. | 2008-08-07 |
Heat sink module for dual heat sources Grant 7,405,937 - Wang , et al. July 29, 2 | 2008-07-29 |
Fastening structure Grant 7,400,507 - Wang , et al. July 15, 2 | 2008-07-15 |
Heat plate fixing structure Grant 7,388,747 - Yang , et al. June 17, 2 | 2008-06-17 |
Heat Dissipation Module App 20080135210 - Wang; Frank ;   et al. | 2008-06-12 |
Fixing structure of heat conduction pad App 20080130240 - Wang; Feng-Ku ;   et al. | 2008-06-05 |
Heat-dissipation Device Having Dust-disposal Mechanism App 20080121374 - Wang; Frank ;   et al. | 2008-05-29 |
Heat-dissipation Apparatus For Hard Disk App 20080123291 - Wang; Frank ;   et al. | 2008-05-29 |
Heat-dissipation Device With Dust-disposal Function App 20080121373 - Wang; Frank ;   et al. | 2008-05-29 |
Recyclable protective cover for a heat-conductive medium Grant 7,319,592 - Wang , et al. January 15, 2 | 2008-01-15 |
Folding protective cover for heat-conductive medium App 20070243345 - Wang; Feng-Ku ;   et al. | 2007-10-18 |
Injector with a coating head App 20070240639 - Wang; Frank ;   et al. | 2007-10-18 |
Recyclable protective cover for a heat-conductive medium App 20070237896 - Wang; Frank ;   et al. | 2007-10-11 |
Heat conducting medium protection device App 20070235177 - Wang; Feng-Ku ;   et al. | 2007-10-11 |
Heat plate fixing structure App 20070236886 - Yang; Chih-Kai ;   et al. | 2007-10-11 |
Heat sink conduction apparatus Grant 7,277,293 - Yang , et al. October 2, 2 | 2007-10-02 |
Supporting plate Grant 7,274,572 - Wang , et al. September 25, 2 | 2007-09-25 |
Chipset coupling apparatus Grant 7,265,990 - Wang , et al. September 4, 2 | 2007-09-04 |
Fool-proof device on heatsink thermal module for the notebook computer Grant 7,248,474 - Cheng , et al. July 24, 2 | 2007-07-24 |
Automatic coating device App 20070137565 - Cheng; Yi-Lun ;   et al. | 2007-06-21 |
Heat sink module of a notebook computer App 20070121291 - Wang; Frank ;   et al. | 2007-05-31 |
Integrated heat sink device Grant 7,212,404 - Wang , et al. May 1, 2 | 2007-05-01 |
Fastening structure App 20070086169 - Wang; Frank ;   et al. | 2007-04-19 |
Chipset coupling apparatus App 20060264078 - Wang; Frank ;   et al. | 2006-11-23 |
Supporting plate App 20060238976 - Wang; Frank ;   et al. | 2006-10-26 |
Integrated heat sink device App 20060232933 - Wang; Frank ;   et al. | 2006-10-19 |
Heat sink conduction apparatus App 20060227509 - Yang; Chih-Kai ;   et al. | 2006-10-12 |
Heatsink assembly App 20060196639 - Yang; Chih-Kai ;   et al. | 2006-09-07 |
Fool-proof device on heatsink thermal module for the notebook computer App 20060082968 - Cheng; Yi-Lun ;   et al. | 2006-04-20 |
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