Yang; Che-Chia
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Che-Chia.The latest application filed is for "semiconductor device and method".
- Yang; Che-Chia - Taipei City TW
- Yang; Che-Chia - Taipei TW
| Patent | Date |
|---|---|
| Semiconductor Device And Method App 20220181298 - Hsu; Chia-Kuei ; et al. | 2022-06-09 |
| Semiconductor Device Package Having Dummy Dies And Method Of Forming The Same App 20220157777 - Yang; Che-Chia ; et al. | 2022-05-19 |
| Chip bonded to a redistribution structure with curved conductive lines Grant 11,264,359 - Hsu , et al. March 1, 2 | 2022-03-01 |
| Package Structure And Method App 20220037243 - Yeh; Shu-Shen ; et al. | 2022-02-03 |
| Stacking Via Structures for Stress Reduction App 20220020700 - Yeh; Shu-Shen ; et al. | 2022-01-20 |
| Eccentric Via Structures for Stress Reduction App 20220020693 - Yeh; Shu-Shen ; et al. | 2022-01-20 |
| Semiconductor Device and Method App 20210335753 - Hsu; Chia-Kuei ; et al. | 2021-10-28 |
| Chip Package Structure With Ring Structure And Method For Forming The Same App 20210217676 - YEH; Shu-Shen ; et al. | 2021-07-15 |
| Method for forming package structure Grant 10,790,164 - Lin , et al. September 29, 2 | 2020-09-29 |
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