Yang; Chaur-Chin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Chaur-Chin.The latest application filed is for "flip chip on leadframe package and method for manufacturing the same".
- Yang; Chaur-Chin - Tainan TW
- Yang; Chaur-Chin - Kaohsiung TW
- Yang, Chaur-Chin - Nantz Chiu TW
- Yang, Chaur-Chin - Shi Chiu TW
| Patent | Date |
|---|---|
| Flip-chip package Grant 7,473,989 - Yang , et al. January 6, 2 | 2009-01-06 |
| Stack type flip-chip package Grant 7,034,388 - Yang , et al. April 25, 2 | 2006-04-25 |
| Flip chip on leadframe package and method for manufacturing the same App 20050287705 - Yang, Chaur-Chin | 2005-12-29 |
| Flip-chip package App 20050046039 - Yang, Chaur-Chin ; et al. | 2005-03-03 |
| Multi-chip stack flip-chip package Grant 6,861,761 - Yang , et al. March 1, 2 | 2005-03-01 |
| Stack type flip-chip package App 20040251531 - Yang, Chaur-Chin ; et al. | 2004-12-16 |
| Thin type ball grid array package App 20040173903 - Yang, Chaur-Chin ; et al. | 2004-09-09 |
| Signal transmission plate used in an assembly package App 20040145035 - Yang, Chaur-Chin | 2004-07-29 |
| Stack type flip-chip package Grant 6,768,190 - Yang , et al. July 27, 2 | 2004-07-27 |
| Multi-chip stack flip-chip package App 20040124539 - Yang, Chaur-Chin ; et al. | 2004-07-01 |
| Assembly package with stacked dies and signal transmission plate Grant 6,717,253 - Yang April 6, 2 | 2004-04-06 |
| Stacked package App 20030141583 - Yang, Chaur-Chin | 2003-07-31 |
| Stack type flip-chip package App 20030141582 - Yang, Chaur-Chin ; et al. | 2003-07-31 |
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