Yang; Charles Chiun-Chieh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yang; Charles Chiun-Chieh.The latest application filed is for "method for the preparation of an epitaxial silicon wafer with intrinsic gettering".

Company Profile

0.6.5

Yang; Charles Chiun-Chieh - Gilbert AZ
Yang; Charles Chiun-Chieh - St. Peters MO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing pad window for a chemical-mechanical polishing tool Grant 6,878,039 - Yang , et al. April 12, 2	2005-04-12
Method for the preparation of an epitaxial silicon wafer with intrinsic gettering Grant 6,666,915 - Yang , et al. December 23, 2	2003-12-23
Modified susceptor for use in chemical vapor deposition process Grant 6,652,650 - Yang , et al. November 25, 2	2003-11-25
Method for the preparation of an epitaxial silicon wafer with intrinsic gettering App 20030159650 - Yang, Charles Chiun-Chieh ; et al.	2003-08-28
Polishing pad window for a chemical-mechanical polishing tool App 20030143925 - Yang, Charles Chiun-Chieh ; et al.	2003-07-31
Method and apparatus for forming a silicon wafer with a denuded zone Grant 6,599,815 - Yang July 29, 2	2003-07-29
Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof Grant 6,596,095 - Ries , et al. July 22, 2	2003-07-22
Method For The Preparation Of An Epitaxial Silicon Wafer With Intrinsic Gettering App 20030051656 - YANG, CHARLES CHIUN-CHIEH ; et al.	2003-03-20
Modified susceptor for use in chemical vapor deposition process App 20030041799 - Yang, Charles Chiun-Chieh ; et al.	2003-03-06
Modified susceptor for use in chemical vapor deposition process Grant 6,444,027 - Yang , et al. September 3, 2	2002-09-03
Epitaxial silicon wafer free from autodoping and backside halo and a method and apparatus for the preparation thereof App 20010037761 - Ries, Michael J. ; et al.	2001-11-08

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