Yang; Chao-Ya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Chao-Ya.The latest application filed is for "electronic device and circuit board thereof".
- Yang; Chao-Ya - Taichung City TW
- Yang; Chao-Ya - Taichung TW
- Yang; Chao-Ya - Taichung Hsien TW
| Patent | Date |
|---|---|
| Electronic Device And Circuit Board Thereof App 20220225493 - Tsai; Ming-Fan ; et al. | 2022-07-14 |
| Electronic package Grant 11,069,633 - Tsai , et al. July 20, 2 | 2021-07-20 |
| Electronic Package And Method For Manufacturing The Same App 20210210435 - Tsai; Ming-Fan ; et al. | 2021-07-08 |
| Electronic package structure Grant 10,587,037 - Chiu , et al. | 2020-03-10 |
| Electronic Package App 20190214352 - Tsai; Ming-Fan ; et al. | 2019-07-11 |
| Electronic package and fabrication method thereof Grant 10,230,152 - Chiu , et al. | 2019-03-12 |
| Method for fabricating package structure Grant 9,899,335 - Chiu , et al. February 20, 2 | 2018-02-20 |
| Method For Fabricating Package Structure App 20170103953 - Chiu; Chih-Hsien ; et al. | 2017-04-13 |
| Package structure and method for fabricating the same Grant 9,508,656 - Chiu , et al. November 29, 2 | 2016-11-29 |
| Semiconductor package and fabrication method thereof Grant 9,502,377 - Chiu , et al. November 22, 2 | 2016-11-22 |
| Electronic Package App 20160155559 - Chiu; Chih-Hsien ; et al. | 2016-06-02 |
| Package Structure App 20160081234 - Chiu; Chih-Hsien ; et al. | 2016-03-17 |
| Package Structure And Method For Fabricating The Same App 20160027740 - Chiu; Chih-Hsien ; et al. | 2016-01-28 |
| Semiconductor package and fabrication method thereof Grant 8,963,299 - Lin , et al. February 24, 2 | 2015-02-24 |
| Packaging structure and method of fabricating the same Grant 8,912,959 - Chiu , et al. December 16, 2 | 2014-12-16 |
| Semiconductor Package And Fabrication Method Thereof App 20140353850 - Chiu; Chih-Hsien ; et al. | 2014-12-04 |
| Electronic Package And Fabrication Method Thereof App 20140210687 - CHIU; CHIH-HSIEN ; et al. | 2014-07-31 |
| Electronic Package Structure App 20140210672 - Chiu; Chih-Hsien ; et al. | 2014-07-31 |
| Semiconductor Package And Fabrication Method Thereof App 20130320513 - Lin; Chien-Cheng ; et al. | 2013-12-05 |
| Packaging Structure And Method Of Fabricating The Same App 20130093629 - Chiu; Chih-Hsien ; et al. | 2013-04-18 |
| Package structure with ESD and EMI preventing functions Grant 8,264,070 - Tsai , et al. September 11, 2 | 2012-09-11 |
| Package Structure With Esd And Emi Preventing Functions App 20120074538 - Tsai; Tsung-Hsien ; et al. | 2012-03-29 |
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