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Patent applications and USPTO patent grants for Yang; Byung Chun.The latest application filed is for "high yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability".
Patent | Date |
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High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability Grant 8,703,605 - Yang April 22, 2 | 2014-04-22 |
High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability Grant 8,207,060 - Yang June 26, 2 | 2012-06-26 |
High Yield And High Throughput Method For The Manufacture Of Integrated Circuit Devices Of Improved Integrity, Performance And Reliability App 20100301491 - Yang; Byung Chun | 2010-12-02 |
High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability App 20090197404 - Yang; Byung Chun | 2009-08-06 |
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