Yanagisawa; Kenichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yanagisawa; Kenichi.The latest application filed is for "powdered polycarbodiimide compound and ester resin composition".

Company Profile

4.10.21

Yanagisawa; Kenichi - Kokubunji JP
Yanagisawa; Kenichi - Chiba JP
YANAGISAWA; Kenichi - Chiba-shi JP
YANAGISAWA; Kenichi - Tokyo JP
YANAGISAWA; Kenichi - Hiratsuka-shi JP
Yanagisawa; Kenichi - Aichi JP
Yanagisawa; Kenichi - Utsunomiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image display control system, image display system, and image analysis device for dynamic medical imaging Grant 11,361,433 - Ando , et al. June 14, 2	2022-06-14
Carboxyl-group-containing aqueous resin composition and method for manufacturing polycarbodiimide compound Grant 11,345,776 - Banno , et al. May 31, 2	2022-05-31
Powdered Polycarbodiimide Compound And Ester Resin Composition App 20220153912 - MATSUMOTO; Nobuyuki ; et al.	2022-05-19
Radiation Image Display Apparatus And Radiation Imaging System App 20210398284 - ANDO; Takanori ; et al.	2021-12-23
Polycarbodiimide Compound, And Polyester Resin Composition And Polyester Resin Modifier In Which Same Is Used App 20210395486 - YANAGISAWA; Kenichi ; et al.	2021-12-23
Polyester Resin Modifying Agent, Method For Producing Same, And Polyester Resin Composition App 20210395428 - YANAGISAWA; Kenichi	2021-12-23
Method of manufacturing gloves, glove, and emulsion composition for gloves Grant 11,179,908 - Enomoto , et al. November 23, 2	2021-11-23
Dynamic Image Analysis Apparatus, Dynamic Image Analysis Method, And Storage Medium App 20210358118 - YANAGISAWA; Kenichi	2021-11-18
Radiation image display apparatus and radiation imaging system Grant 11,138,725 - Ando , et al. October 5, 2	2021-10-05
Polycarbodiimide Compound, Production Method Therefor, And Resin Composition App 20210139632 - NISHIKAWA; Naoki ; et al.	2021-05-13
Method For Producing Carbodiimide Compound App 20210061756 - MATSUMOTO; Nobuyuki ; et al.	2021-03-04
Resin Composition, Resin Material And Resin Crosslinked Body App 20210032454 - NAKASHIMA; Shinichi ; et al.	2021-02-04
Method For Producing Carbodiimide Compound App 20210009512 - MATSUMOTO; Nobuyuki ; et al.	2021-01-14
Metal Alkoxide, And Aqueous Resin Crosslinking Composition And Aqueous Resin Composition Which Use Same App 20200385413 - NAKASHIMA; Shinichi ; et al.	2020-12-10
Method For Producing Aqueous Carbodiimide-containing Liquid App 20200377645 - IIZUKA; Shunsuke ; et al.	2020-12-03
Resin Composition And Molded Article App 20200247991 - Kind Code	2020-08-06
Image Display Control System, Image Display System, And Image Analysis Device App 20200167918 - ANDO; Takanori ; et al.	2020-05-28
Radiographic image capturing system, image processor, and image processing method Grant 10,628,923 - Takagi , et al.	2020-04-21
Carboxyl-group-containing Aqueous Resin Composition And Method For Manufacturing Polycarbodiimide Compound App 20200017628 - BANNO; Kimiyo ; et al.	2020-01-16
Radiation Image Display Apparatus And Radiation Imaging System App 20190318477 - ANDO; Takanori ; et al.	2019-10-17
Method Of Manufacturing Gloves, Glove, And Emulsion Composition For Gloves App 20190174848 - Enomoto; Norihide ; et al.	2019-06-13
Radiographic Image Capturing Stand App 20180055465 - NAKAYAMA; Shingo ; et al.	2018-03-01
Radiographic Image Capturing System, Image Processor, And Image Processing Method App 20170372454 - TAKAGI; Tatsuya ; et al.	2017-12-28
Resin crosslinking agent Grant 8,853,442 - Yanagisawa , et al. October 7, 2	2014-10-07
Carbodiimide compound, carbodiimide composition and aqueous coating composition Grant 8,604,154 - Takahashi , et al. December 10, 2	2013-12-10
Resin Crosslinking Agent App 20120264968 - Yanagisawa; Kenichi ; et al.	2012-10-18
Resin Composition App 20110144285 - Yamada; Toshiaki ; et al.	2011-06-16
Carbodiimide Compound, Carbodiimide Composition And Aqueous Coating Composition App 20110021679 - Takahashi; Ikuo ; et al.	2011-01-27
Epoxy resin composition for semiconductor sealing Grant 5,143,951 - Ohta , et al. September 1, 1	1992-09-01

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