Yanagimoto; Katsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yanagimoto; Katsu.The latest application filed is for "electrically conductive body and printed wiring board and method of making the same".
- Yanagimoto; Katsu - Himeji N/A JP
- Yanagimoto; Katsu - Hyogo JP
- Yanagimoto; Katsu - Hyogo-ken JP
| Patent | Date |
|---|---|
| Lead-free jointing material and method of producing the same Grant 9,157,135 - Ikeda , et al. October 13, 2 | 2015-10-13 |
| Surface coating material for molten zinc bath member, production method thereof, and molten zinc bath member Grant 8,927,111 - Ikeda , et al. January 6, 2 | 2015-01-06 |
| Electronic apparatus produced using lead-free bonding material for soldering Grant 8,281,978 - Ikeda , et al. October 9, 2 | 2012-10-09 |
| Electrically Conductive Body And Printed Wiring Board And Method Of Making The Same App 20110100690 - Yoshimura; Hideaki ; et al. | 2011-05-05 |
| Electronic Apparatus Produced using lead-Free bonding Material for Soldering App 20100246148 - Ikeda; Hiroki ; et al. | 2010-09-30 |
| Lead-Free Jointing Material and Method of Producing the Same App 20100089498 - Ikeda; Hiroki ; et al. | 2010-04-15 |
| Surface Coating Material for Molten Zinc Bath Member, Production Method Thereof, and Molten Zinc Bath Member App 20100075133 - Ikeda; Hiroki ; et al. | 2010-03-25 |
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