| Patent | Date |
|---|
Method for distributing pilot frequency in massive antenna system
Grant 11,445,504 - Xu , et al. September 13, 2 | 2022-09-13 |
Semiconductor Device With Reduced Stress Die Pick And Place
App 20220181208 - Tian; Xin ; et al. | 2022-06-09 |
Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging
Grant 11,289,395 - Yan , et al. March 29, 2 | 2022-03-29 |
Wire Bonding For Semiconductor Devices
App 20220052014 - Lei; Yang ; et al. | 2022-02-17 |
Detecting interference in depth images captured using overlapping depth cameras
Grant 11,240,486 - Chen , et al. February 1, 2 | 2022-02-01 |
Sloped Interconnector For Stacked Die Package
App 20210407967 - CUI; XIANLU ; et al. | 2021-12-30 |
Semiconductor Device Including Vertical Wire Bonds
App 20210366875 - Di; Xiaofeng ; et al. | 2021-11-25 |
Semiconductor device with top die positioned to reduce die cracking
Grant 11,177,241 - Yan , et al. November 16, 2 | 2021-11-16 |
Blockchain Enabled Collaborative Transaction Information Processing For A Supply Chain
App 20210158370 - Koudall; Peter ; et al. | 2021-05-27 |
A Method for Distributing Pilot Frequency in Massive Antenna System
App 20210099997 - XU; Fangmin ; et al. | 2021-04-01 |
Semiconductor Device With Top Die Positioned To Reduce Die Cracking
App 20200381401 - Yan; Junrong ; et al. | 2020-12-03 |
Aperture Structure On Semiconductor Component Backside To Alleviate Delamination In Stacked Packaging
App 20200335481 - Yan; Junrong ; et al. | 2020-10-22 |
Detecting interference in depth images captured using overlapping depth cameras
Grant 10,681,338 - Chen , et al. | 2020-06-09 |
Semiconductor device including dual pad wire bond interconnection
Grant 10,483,239 - Yan , et al. Nov | 2019-11-19 |
Semiconductor device including corner recess
Grant 10,418,334 - Zhang , et al. Sept | 2019-09-17 |
Method And System For Industrial Parts Search, Harmonization, And Rationalization Through Digital Twin Technology
App 20190236489 - KOUDAL; Peter ; et al. | 2019-08-01 |
Semiconductor device including conductive bump interconnections
Grant 10,283,485 - Yan , et al. | 2019-05-07 |
Semiconductor Device Including Conductive Bump Interconnections
App 20180337161 - Yan; Junrong ; et al. | 2018-11-22 |
Semiconductor device including die bond pads at a die edge
Grant 10,128,218 - Yan , et al. November 13, 2 | 2018-11-13 |
Method for avoiding downlink interference between indoor DAS system and small base station
Grant 10,075,216 - Pan , et al. September 11, 2 | 2018-09-11 |
Semiconductor Device Including Dual Pad Wire Bond Interconnection
App 20180190621 - Yan; Junrong ; et al. | 2018-07-05 |
Semiconductor Device Including Die Bond Pads At A Die Edge
App 20180175006 - Yan; Junrong ; et al. | 2018-06-21 |
Semiconductor Device Including Corner Recess
App 20180174983 - Zhang; Hang ; et al. | 2018-06-21 |
Method for resisting small base station uplink signal interference of indoor DAS system based on antenna selection
Grant 9,867,102 - Pan , et al. January 9, 2 | 2018-01-09 |
Method For Resisting Small Base Station Uplink Signal Interference Of Indoor Das System Based On Antenna Selection
App 20170359763 - PAN; Peng ; et al. | 2017-12-14 |
Method For Avoiding Downlink Interference Between Indoor Das System And Small Base Station
App 20170359104 - PAN; Peng ; et al. | 2017-12-14 |
Bridge Structure For Embedding Semiconductor Die
App 20170179101 - Yan; Junrong ; et al. | 2017-06-22 |
Spacer layer for embedding semiconductor die
Grant 9,462,694 - Yan , et al. October 4, 2 | 2016-10-04 |
Spacer Layer For Embedding Semiconductor Die
App 20150187421 - Yan; Junrong ; et al. | 2015-07-02 |
Bridge Structure For Embedding Semiconductor Die
App 20150155247 - Yan; Junrong ; et al. | 2015-06-04 |
| 