Yamazaki; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamazaki; Takao.The latest application filed is for "steel wire for spring".

Company Profile

0.43.46

Yamazaki; Takao - Itami JP
Yamazaki; Takao - Itami-shi JP
Yamazaki; Takao - Tokyo JP
YAMAZAKI; Takao - Minato-ku JP
Yamazaki; Takao - Cupertino CA
Yamazaki; Takao - Saratoga CA
Yamazaki; Takao - Osaka JP
Yamazaki; Takao - Kawasaki JP
Yamazaki, Takao - Osaka-shi JP
Yamazaki; Takao - Kanagawa JP
Yamazaki; Takao - Saitama-ken JP
Yamazaki; Takao - Yokohama JP
Yamazaki; Takao - Goleta CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Steel wire for spring Grant 11,143,257 - Uwano , et al. October 12, 2	2021-10-12
Steel Wire For Spring App 20190101176 - Uwano; Takafumi ; et al.	2019-04-04
Method of manufacturing a three-dimensional packaging semiconductor device Grant 8,956,915 - Yamazaki , et al. February 17, 2	2015-02-17
Infrared sensor package and electronic device equipped therewith Grant 8,785,853 - Yamazaki , et al. July 22, 2	2014-07-22
Vacuum Sealed Package, Printed Circuit Board Having Vacuum Sealed Package, Electronic Device, And Method For Manufacturing Vacuum Sealed Package App 20140022718 - YAMAZAKI; TAKAO ; et al.	2014-01-23
Infrared Ray Sensor Package, Infrared Ray Sensor Module, And Electronic Device App 20130306868 - YAMAZAKI; Takao ; et al.	2013-11-21
Encapsulating Package, Printed Circuit Board, Electronic Device And Method For Manufacturing Encapsulating Package App 20130291380 - YAMAZAKI; TAKAO ; et al.	2013-11-07
Semiconductor Device And Method Of Manufacturing Same, Wiring Board And Method Of Manufacturing Same, Semiconductor Package, And Electronic Device App 20130234295 - Sogawa; Yoshimichi ; et al.	2013-09-12
Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package Grant 8,525,323 - Yamazaki , et al. September 3, 2	2013-09-03
Electronic device package, module, and electronic device Grant 8,411,450 - Yamazaki , et al. April 2, 2	2013-04-02
Semiconductor Device App 20130078764 - YAMAZAKI; Takao ; et al.	2013-03-28
Semiconductor device Grant 8,338,940 - Yamazaki , et al. December 25, 2	2012-12-25
Semiconductor device and manufacturing method thereof Grant 8,236,616 - Yamazaki August 7, 2	2012-08-07
Three-dimensionally Integrated Semiconductor Device And Electronic Device Incorporation By Reference App 20120181683 - YAMAZAKI; TAKAO ; et al.	2012-07-19
Infrared Sensor Package And Electronic Device Equipped Therewith App 20120138803 - YAMAZAKI; TAKAO ; et al.	2012-06-07
Vacuum Sealed Package, Printed Circuit Board Having Vacuum Sealed Package, Electronic Device, And Method For Manufacturing Vacuum Sealed Package App 20120106085 - Yamazaki; Takao ; et al.	2012-05-03
Mounting structure of semiconductor device and electronic apparatus using thereof Grant 8,130,503 - Watanabe , et al. March 6, 2	2012-03-06
Device having electronic components mounted therein and method for manufacturing such device Grant 8,120,921 - Yamazaki , et al. February 21, 2	2012-02-21
Semiconductor Device And Manufacturing Method Thereof App 20120028419 - YAMAZAKI; TAKAO	2012-02-02
Semiconductor device and manufacturing method thereof Grant 8,093,709 - Yamazaki January 10, 2	2012-01-10
Mounting structure of semiconductor device and electronic apparatus using same Grant 8,093,706 - Watanabe , et al. January 10, 2	2012-01-10
Semiconductor Device And Manufacturing Method Thereof, Wiring Board And Manufacturing Method Thereof, Semiconductor Package, And Electronic Apparatus App 20110304029 - Sogawa; Yoshimichi ; et al.	2011-12-15
Semiconductor Device And Manufacturing Method Thereof App 20110140264 - YAMAZAKI; TAKAO	2011-06-16
Encapsulating Package, Printed Circuit Board, Electronic Device And Method For Manufacturing Encapsulating Package App 20110114840 - Yamazaki; Takao ; et al.	2011-05-19
Semiconductor device and manufacturing method thereof Grant 7,928,556 - Yamazaki April 19, 2	2011-04-19
Semiconductor Device, Semiconductor Device Manufacturing Method, Printed Circuit Board And Electronic Device App 20110031610 - Yamazaki; Takao ; et al.	2011-02-10
Electronic package device, module, and electronic apparatus Grant 7,812,440 - Yamazaki , et al. October 12, 2	2010-10-12
Electronic Device Package, Module, And Electronic Device App 20100246144 - Yamazaki; Takao ; et al.	2010-09-30
Vacuum package and manufacturing process thereof Grant 7,795,585 - Sogawa , et al. September 14, 2	2010-09-14
Device Having Electronic Components Mounted Therein And Method For Manufacturing Such Device App 20100188821 - Yamazaki; Takao ; et al.	2010-07-29
Method of real time MPEG-4 texture decoding for a multiprocessor environment Grant 7,724,820 - Youn , et al. May 25, 2	2010-05-25
Semiconductor Device And Manufacturing Method Thereof App 20100025844 - Yamazaki; Takao	2010-02-04
Mounting Structure Of Semiconductor Device And Electronic Apparatus Using Same App 20090243075 - WATANABE; Shinji ; et al.	2009-10-01
Mounting Structure Of Semiconductor Device And Electronic Apparatus Using Thereof App 20090244860 - Watanabe; Shinji ; et al.	2009-10-01
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus Grant 7,594,644 - Yamazaki , et al. September 29, 2	2009-09-29
Electronic Component, Semiconductor Package, And Electronic Device App 20090174052 - Sogawa; Yoshimichi ; et al.	2009-07-09
Vacuum Package And Manufacturing Process Thereof App 20090140146 - SOGAWA; Yoshimichi ; et al.	2009-06-04
Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheet Grant 7,504,701 - Moribayashi , et al. March 17, 2	2009-03-17
Electronic Package Device, Module, and Electronic Apparatus App 20090065921 - Yamazaki; Takao ; et al.	2009-03-12
Optical transceiver module and method for manufacturing same App 20090010296 - Shimada; Yasuhei ; et al.	2009-01-08
Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device App 20080224271 - Sogawa; Yoshimichi ; et al.	2008-09-18
Fast codebook selection method in audio encoding Grant 7,426,462 - Young , et al. September 16, 2	2008-09-16
Methods of evaluating phosphatase inhibitors Grant 7,402,406 - Morita , et al. July 22, 2	2008-07-22
Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus App 20080001288 - Sogawa; Yoshimichi ; et al.	2008-01-03
Optical unit featuring both photoelectric conversion chip and semiconductor chip wrapped with flexible sheet App 20070210400 - Moribayashi; Shigeru ; et al.	2007-09-13
System and method for high quality AVC encoding App 20070199011 - Zhang; Ximin ; et al.	2007-08-23
Semiconductor package and laminated semiconductor package Grant 7,230,328 - Hazeyama , et al. June 12, 2	2007-06-12
Remedy for cerebral neurodegenerative diseases using ppar agonist App 20070037882 - Kita; Yasuhiro ; et al.	2007-02-15
Method of performing sub-pixel based edge-directed image interpolation Grant 7,136,541 - Zhang , et al. November 14, 2	2006-11-14
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus App 20060055053 - Yamazaki; Takao ; et al.	2006-03-16
Semiconductor package and laminated semiconductor package App 20060049495 - Hazeyama; Ichiro ; et al.	2006-03-09
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus Grant 6,998,704 - Yamazaki , et al. February 14, 2	2006-02-14
Method of real time MPEG-4 texture decoding for a multiprocessor environment App 20050238097 - Youn, Jeongnam ; et al.	2005-10-27
Methods of eavaluating phosphatase inhibitors App 20050214888 - Morita, Masahiko ; et al.	2005-09-29
Semiconductor device with decoupling capacitors mounted on conductors Grant 6,949,815 - Yamazaki , et al. September 27, 2	2005-09-27
Method of real time MPEG-4 texture decoding for a multiprocessor environment Grant 6,931,061 - Youn , et al. August 16, 2	2005-08-16
Fast codebook selection method in audio encoding App 20050075888 - Young, Jeongnam ; et al.	2005-04-07
Semiconductor device and method for packaging same App 20040135264 - Yamazaki, Takao ; et al.	2004-07-15
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus App 20040115920 - Yamazaki, Takao ; et al.	2004-06-17
Method of real time MPEG-4 texture decoding for a multiprocessor environment App 20040091052 - Youn, Jeongnam ; et al.	2004-05-13
Method of performing sub-pixel based edge-directed image interpolation App 20040076343 - Zhang, Huipin ; et al.	2004-04-22
Semiconductor device and method for packaging same Grant 6,703,705 - Yamazaki , et al. March 9, 2	2004-03-09
Semiconductor device, and thin film capacitor Grant 6,524,905 - Yamamichi , et al. February 25, 2	2003-02-25
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same Grant 6,515,324 - Shibuya , et al. February 4, 2	2003-02-04
Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same App 20020088977 - Mori, Toru ; et al.	2002-07-11
Semiconductor device and method for packaging same App 20020074643 - Yamazaki, Takao ; et al.	2002-06-20
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same App 20020070400 - Shibuya, Akinobu ; et al.	2002-06-13
Semiconductor device, manufacturing method therefor, and thin film capacitor App 20020025623 - Yamamichi, Shintaro ; et al.	2002-02-28
Three-dimensional semiconductor device and method of manufacturing the same App 20020022303 - Senba, Naoji ; et al.	2002-02-21
Multilayer capacitor, semiconductor device, and electrical circuit board App 20020017700 - Mori, Toru ; et al.	2002-02-14
Semiconductor device and method of fabricating the same App 20010054762 - Yamazaki, Takao ; et al.	2001-12-27
Signal processing apparatus Grant 6,038,350 - Iwase , et al. March 14, 2	2000-03-14
Parallel processor apparatus Grant 5,850,268 - Ohki , et al. December 15, 1	1998-12-15
Parallel processor apparatus having means for processing signals of different lengths Grant 5,666,169 - Ohki , et al. September 9, 1	1997-09-09
Automatic disc changer for a disc reproducing system Grant 5,615,202 - Enomoto , et al. March 25, 1	1997-03-25
Linear arrayed disc changer with shiftable guide projections Grant 5,550,801 - Enomoto , et al. August 27, 1	1996-08-27
Multiplying circuit Grant 5,521,855 - Yamazaki May 28, 1	1996-05-28
Sampling rate converter Grant 5,389,923 - Iwata , et al. February 14, 1	1995-02-14
Stirring apparatus and stirring tower type apparatus for polmerization reactions Grant 5,145,255 - Shimada , et al. September 8, 1	1992-09-08
Digital adder circuit Grant 5,134,579 - Oki , et al. July 28, 1	1992-07-28
Digital filter Grant 4,862,403 - Iwase , et al. August 29, 1	1989-08-29
IIR digital filter Grant 4,751,663 - Yamazaki June 14, 1	1988-06-14
Digital multiplying circuit Grant 4,706,211 - Yamazaki , et al. November 10, 1	1987-11-10
Digital time base corrector Grant 4,677,499 - Shirota , et al. June 30, 1	1987-06-30

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