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Yamazaki; Michihisa Patent Filings

Yamazaki; Michihisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamazaki; Michihisa.The latest application filed is for "lid, method of producing lid, and molds for forming molded pulp".

Company Profile
0.2.2
  • Yamazaki; Michihisa - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cover, method of producing cover, and secondary processing die used for producing cover
Grant 11,407,565 - Mita , et al. August 9, 2
2022-08-09
Cover, method of producing cover, and secondary processing die used for producing cover
Grant 11,370,582 - Mita , et al. June 28, 2
2022-06-28
Lid, Method Of Producing Lid, And Molds For Forming Molded Pulp
App 20220064869 - YAMAZAKI; Michihisa ;   et al.
2022-03-03
Cover, Method Of Producing Cover, And Secondary Processing Die Used For Producing Cover
App 20220055802 - MITA; Tomoko ;   et al.
2022-02-24

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