YAMAUCHI; Shinichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for YAMAUCHI; Shinichi.The latest application filed is for "bonded body and method for manufacturing same".

Company Profile

1.4.6

YAMAUCHI; Shinichi - Ageo JP
YAMAUCHI; Shinichi - Ageo-shi Saitama
Yamauchi; Shinichi - Saitama JP
Yamauchi; Shinichi - Yokkaichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonded Body And Method For Manufacturing Same App 20220139865 - ANAI; Kei ; et al.	2022-05-05
Composition For Pressure Bonding, And Bonded Structure Of Conductive Bodies And Production Method Therefor App 20220118546 - ANAI; Kei ; et al.	2022-04-21
Bonding Composition, Conductor Bonding Structure, And Method For Producing Same App 20210138541 - ANAI; Kei ; et al.	2021-05-13
Copper foil, negative electrode current collector and negative electrode material for non-aqueous secondary battery Grant 10,396,363 - Miyake , et al. A	2019-08-27
Bonding junction structure Grant 10,340,154 - Kamikoriyama , et al.	2019-07-02
Bonding Junction Structure App 20180269074 - KAMIKORIYAMA; Yoichi ; et al.	2018-09-20
Conductor Connection Structure, Method For Producing Same, Conductive Composition, And Electronic Component Module App 20170140847 - KAMIKORIYAMA; Yoichi ; et al.	2017-05-18
Copper Foil, Negative Electrode Current Collector And Negative Electrode Material For Non-aqueous Secondary Battery App 20150132658 - Miyake; Koichi ; et al.	2015-05-14
Polyhydroxyphenylene ether resin and process for preparing the same Grant 5,202,409 - Tsukahara , et al. April 13, 1	1993-04-13
Resin composition Grant 4,985,495 - Nishio , et al. January 15, 1	1991-01-15

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