loadpatents
name:-0.015753984451294
name:-0.012829065322876
name:-0.00052618980407715
YAMASHITA; Yukihiko Patent Filings

YAMASHITA; Yukihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for YAMASHITA; Yukihiko.The latest application filed is for "copolymer, dispersant, and resin composition".

Company Profile
0.10.12
  • YAMASHITA; Yukihiko - Tokyo JP
  • Yamashita; Yukihiko - Gunma JP
  • YAMASHITA; Yukihiko - Shibukawa-city Gunma
  • Yamashita; Yukihiko - Tsukuba JP
  • Yamashita; Yukihiko - Tsukuba-shi JP
  • Yamashita; Yukihiko - Ibaraki JP
  • Yamashita; Yukihiko - Ichihara JP
  • Yamashita, Yukihiko - Ichihara-shi JP
  • Yamashita, Yukihiko - Chiba JP
  • Yamashita; Yukihiko - Hitachi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copolymer, Dispersant, And Resin Composition
App 20220186089 - TAKASAKI; Ippei ;   et al.
2022-06-16
Composition having excellent adhesiveness to polyolefins
Grant 11,072,730 - Hoshino , et al. July 27, 2
2021-07-27
Composition having excellent adhesiveness to polyolefins
Grant 11,008,486 - Hoshino , et al. May 18, 2
2021-05-18
Composition
App 20200102483 - HOSHINO; Takako ;   et al.
2020-04-02
Reflow film, solder bump formation method, solder joint formation method, and semiconductor device
Grant 9,656,353 - Miyauchi , et al. May 23, 2
2017-05-23
Reflow Film, Solder Bump Formation Method, Solder Joint Formation Method, And Semiconductor Device
App 20140252607 - Miyauchi; Kazuhiro ;   et al.
2014-09-11
Resin Composition, Resin Sheet, Cured Resin Sheet, Resin-adhered Metal Foil And Heat Dissipation Device
App 20140248504 - Song; Shihui ;   et al.
2014-09-04
Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
Grant 8,461,699 - Matsutani , et al. June 11, 2
2013-06-11
Positive-type Photosensitive Resin Composition, Method For Producing Resist Pattern, Semiconductor Device, And Electronic Device
App 20110254178 - Matsutani; Hiroshi ;   et al.
2011-10-20
Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom
Grant 7,295,376 - Yamanaka , et al. November 13, 2
2007-11-13
Film for optical component, winding laminate of film, optical component, and optical disc
App 20060104188 - Yamashita; Yukihiko ;   et al.
2006-05-18
Instruction control apparatus, function unit, program conversion apparatus, and language processing apparatus
App 20050283588 - Yamashita, Yukihiko
2005-12-22
Pseudocross-linking resin composition, molded materials, sheet or film made therefrom, and optical elements
Grant 6,903,160 - Yamashita , et al. June 7, 2
2005-06-07
Low-hygroscopicity low-birefringence resin compositions, molding material obtained therefrom, sheet or film, and optical part
Grant 6,900,273 - Yamashita , et al. May 31, 2
2005-05-31
Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom
App 20050038194 - Yamanaka, Tetsuro ;   et al.
2005-02-17
Low-hygroscopicity low-birefringence resin compositions, molding material, sheet or film obtained therefrom, and optical part
App 20040220342 - Yamashita, Yukihiko ;   et al.
2004-11-04
Pseudocross-linking resin composition, molded materials, sheet or film made therefrom, and optical elements
App 20040152839 - Yamashita, Yukihiko ;   et al.
2004-08-05
Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom
Grant 6,767,967 - Yamanaka , et al. July 27, 2
2004-07-27
Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom
App 20030232923 - Yamanaka, Tetsuro ;   et al.
2003-12-18
Electrical laminate with dibasic acid-modified epoxy (meth)acrylate
Grant 5,238,730 - Hanawa , et al. August 24, 1
1993-08-24

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