Yamashita; Atsunari

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamashita; Atsunari.The latest application filed is for "method of manufacturing printed wiring board with built-in electronic component".

Company Profile

0.10.7

Yamashita; Atsunari - Ogaki N/A JP
Yamashita; Atsunari - Gifu JP
Yamashita; Atsunari - Ogaki-shi JP
Yamashita; Atsunari - Ibi-gun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed wiring board with capacitor Grant 8,730,647 - Mano , et al. May 20, 2	2014-05-20
Method of manufacturing printed wiring board with built-in electronic component Grant 8,613,136 - Tanaka , et al. December 24, 2	2013-12-24
Semiconductor device and fabrication method therefor Grant 8,415,791 - Tsukada , et al. April 9, 2	2013-04-09
Method of manufacturing printed wiring board with built-in electronic component Grant 8,336,205 - Tanaka , et al. December 25, 2	2012-12-25
Semiconductor device and production method thereof Grant 8,278,753 - Tsukada , et al. October 2, 2	2012-10-02
Method Of Manufacturing Printed Wiring Board With Built-in Electronic Component App 20110289773 - Tanaka; Hironori ; et al.	2011-12-01
Method of manufacturing printed wiring board with built-in electronic component Grant 8,024,858 - Tanaka , et al. September 27, 2	2011-09-27
Semiconductor Device And Fabrication Method Therefor App 20110121450 - Tsukada; Kiyotaka ; et al.	2011-05-26
Semiconductor Device And Production Method Thereof App 20110121448 - TSUKADA; Kiyotaka ; et al.	2011-05-26
Method of manufacturing printed wiring board with built-in electronic component Grant 7,935,893 - Tanaka , et al. May 3, 2	2011-05-03
Method Of Manufacturing Printed Wiring Board With Built-in Electronic Component App 20100043942 - Tanaka; Hironori ; et al.	2010-02-25
Method Of Manufacturing Printed Wiring Board With Built-in Electronic Component App 20090205859 - Tanaka; Hironori ; et al.	2009-08-20
Method Of Manufacturing Printed Wiring Board With Built-in Electronic Component App 20090205202 - Tanaka; Hironori ; et al.	2009-08-20
Printed Wiring Board With Capacitor App 20090200073 - Mano; Yasuhiko ; et al.	2009-08-13

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