Patent | Date |
---|
Interconnect Substrate And Method Of Making The Same App 20210125953 - FUKASAWA; Ryo ;   et al. | 2021-04-29 |
Probe guide plate having a silicon oxide layer formed on surfaces and on an inner wall of a through hole thereof, and a protective insulating layer formed on the silicon oxide layer, and probe apparatus including the probe guide plate Grant 10,261,110 - Shimizu , et al. | 2019-04-16 |
Wiring substrate Grant 9,780,032 - Yamasaki , et al. October 3, 2 | 2017-10-03 |
Wiring Substrate App 20170186684 - YAMASAKI; TOMOO ;   et al. | 2017-06-29 |
Probe Guide Plate And Probe Apparatus App 20170146569 - Shimizu; Yuichiro ;   et al. | 2017-05-25 |
Wiring substrate, its manufacturing method, and semiconductor device Grant 9,006,586 - Horiuchi , et al. April 14, 2 | 2015-04-14 |
Wiring substrate and method of manufacturing the same Grant 8,878,077 - Ito , et al. November 4, 2 | 2014-11-04 |
Wiring substrate and method of manufacturing the same Grant 8,729,401 - Yamasaki , et al. May 20, 2 | 2014-05-20 |
Capacitor containing a large number of filamentous conductors and method of manufacturing the same Grant 8,638,542 - Horiuchi , et al. January 28, 2 | 2014-01-28 |
Wiring Substrate, Its Manufacturing Method, And Semiconductor Device App 20120327626 - Horiuchi; Michio ;   et al. | 2012-12-27 |
Wiring board and manufacturing method thereof Grant 8,288,659 - Yamasaki October 16, 2 | 2012-10-16 |
Wiring board having piercing linear conductors and semiconductor device using the same Grant 8,242,612 - Horiuchi , et al. August 14, 2 | 2012-08-14 |
Wiring Substrate And Method Of Manufacturing The Same App 20120103667 - ITO; Takashi ;   et al. | 2012-05-03 |
Semiconductor device and method of manufacturing semiconductor device Grant 8,138,609 - Horiuchi , et al. March 20, 2 | 2012-03-20 |
Manufacturing method of wiring board Grant 8,066,862 - Yamasaki , et al. November 29, 2 | 2011-11-29 |
Wiring Substrate And Method Of Manufacturing The Same App 20110220404 - Yamasaki; Tomoo ;   et al. | 2011-09-15 |
Wiring Board And Manufacturing Method Thereof App 20110061916 - Yamasaki; Tomoo | 2011-03-17 |
Wiring Board And Semiconductor Device App 20110018144 - Horiuchi; Michio ;   et al. | 2011-01-27 |
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20110012266 - HORIUCHI; Michio ;   et al. | 2011-01-20 |
Capacitor And Method Of Manufacturing The Same App 20110013340 - HORIUCHI; Michio ;   et al. | 2011-01-20 |
Wiring Substrate And Method For Manufacturing The Same App 20090200072 - Yamasaki; Tomoo | 2009-08-13 |
Manufacturing Method of Wiring Board App 20090188806 - Yamasaki; Tomoo ;   et al. | 2009-07-30 |
Method of manufacturing wiring substrate to which semiconductor chip is mounted Grant 7,536,780 - Shimizu , et al. May 26, 2 | 2009-05-26 |
Method of manufacturing capacitor device Grant 7,531,011 - Yamasaki May 12, 2 | 2009-05-12 |
Wiring Board And Method Of Manufacturing The Same App 20080239684 - Yamasaki; Tomoo | 2008-10-02 |
Capacitor parts Grant 7,403,370 - Oi , et al. July 22, 2 | 2008-07-22 |
Method of manufacturing wiring board Grant 7,375,022 - Oi , et al. May 20, 2 | 2008-05-20 |
Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate Grant 7,352,060 - Shimizu , et al. April 1, 2 | 2008-04-01 |
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device Grant 7,341,919 - Yamasaki , et al. March 11, 2 | 2008-03-11 |
Method for manufacturing wiring board Grant 7,284,307 - Yamasaki , et al. October 23, 2 | 2007-10-23 |
Thin-film capacitor device, mounting module for the same, and method for fabricating the same Grant 7,282,419 - Yamasaki , et al. October 16, 2 | 2007-10-16 |
Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device App 20070119616 - Horikawa; Yasuyoshi ;   et al. | 2007-05-31 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device Grant 7,223,652 - Ooi , et al. May 29, 2 | 2007-05-29 |
Coil Structure, Method For Manufacturing The Same And Semiconductor Package App 20070040238 - Yamasaki; Tomoo ;   et al. | 2007-02-22 |
Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element Grant 7,161,242 - Yamasaki , et al. January 9, 2 | 2007-01-09 |
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device Grant 7,115,931 - Yamasaki , et al. October 3, 2 | 2006-10-03 |
Capacitor Parts App 20060197184 - OI; Kiyoshi ;   et al. | 2006-09-07 |
Substrate fabrication method and substrate Grant 7,078,269 - Yamasaki , et al. July 18, 2 | 2006-07-18 |
Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device Grant 7,079,371 - Yamasaki July 18, 2 | 2006-07-18 |
Capacitor device and method of manufacturing the same Grant 7,072,168 - Horikawa , et al. July 4, 2 | 2006-07-04 |
Method of manufacturing wiring board App 20060141764 - Oi; Kiyoshi ;   et al. | 2006-06-29 |
Method of manufacturing wiring substrate to which semiconductor chip is mounted App 20060131069 - Shimizu; Noriyoshi ;   et al. | 2006-06-22 |
Method for manufacturing wiring board App 20060130303 - Yamasaki; Tomoo ;   et al. | 2006-06-22 |
Capacitor and method of producing same Grant 7,038,904 - Ooi , et al. May 2, 2 | 2006-05-02 |
Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device App 20060061936 - Yamasaki; Tomoo | 2006-03-23 |
Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board Grant 6,999,299 - Shimizu , et al. February 14, 2 | 2006-02-14 |
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device App 20060008579 - Yamasaki; Tomoo ;   et al. | 2006-01-12 |
Thin-film capacitor device, mounting module for the same, and method for fabricating the same Grant 6,979,854 - Yamasaki , et al. December 27, 2 | 2005-12-27 |
Multilayer wiring substrate and method of manufacturing multilayer wiring substrate App 20050253248 - Shimizu, Noriyoshi ;   et al. | 2005-11-17 |
Thin-film capacitor device, mounting module for the same, and method for fabricating the same App 20050181573 - Yamasaki, Tomoo ;   et al. | 2005-08-18 |
Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device App 20050141169 - Yamasaki, Tomoo | 2005-06-30 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device App 20050130368 - Ooi, Kiyoshi ;   et al. | 2005-06-16 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device Grant 6,897,544 - Ooi , et al. May 24, 2 | 2005-05-24 |
Capacitor and method of producing same App 20050088800 - Ooi, Kiyoshi ;   et al. | 2005-04-28 |
Thin-film capacitor and method of producing the capacitor App 20050056939 - Ooi, Kiyoshi ;   et al. | 2005-03-17 |
Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board App 20050052822 - Shimizu, Noriyoshi ;   et al. | 2005-03-10 |
Capacitor device and method of manufacturing the same App 20050013088 - Horikawa, Yasuyoshi ;   et al. | 2005-01-20 |
Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element App 20040183187 - Yamasaki, Tomoo ;   et al. | 2004-09-23 |
Substrate fabrication method and substrate App 20040180540 - Yamasaki, Tomoo ;   et al. | 2004-09-16 |
Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device App 20040164337 - Yamasaki, Tomoo ;   et al. | 2004-08-26 |
Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device App 20040104451 - Ooi, Kiyoshi ;   et al. | 2004-06-03 |
Thin-film capacitor device, mounting module for the same, and method for fabricating the same App 20040075127 - Yamasaki, Tomoo ;   et al. | 2004-04-22 |