Yamasaki; Kozo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamasaki; Kozo.The latest application filed is for "wiring board with built-in component and method for manufacturing the same".

Company Profile

0.10.3

Yamasaki; Kozo - Gifu JP
Yamasaki; Kozo - Kani JP
Yamasaki; Kozo - Cifu JP
Yamasaki; Kozo - Nagoya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring board with built-in component and method for manufacturing the same Grant 7,936,567 - Takashima , et al. May 3, 2	2011-05-03
Wiring Board With Built-in Component And Method For Manufacturing The Same App 20080277150 - Takashima; Tsuneaki ; et al.	2008-11-13
Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel Grant 6,976,415 - Suzuki , et al. December 20, 2	2005-12-20
Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel App 20050155789 - Suzuki, Tomoe ; et al.	2005-07-21
Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel Grant 6,872,436 - Suzuki , et al. March 29, 2	2005-03-29
Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel App 20040018373 - Suzuki, Tomoe ; et al.	2004-01-29
Multilayer-wiring substrate and method for fabricating same Grant 6,674,017 - Yamasaki , et al. January 6, 2	2004-01-06
Method of making laminate ceramic substrate with domed pads Grant 6,224,703 - Yamasaki , et al. May 1, 2	2001-05-01
Connecting board for connection between base plate and mounting board Grant 6,148,900 - Yamasaki , et al. November 21, 2	2000-11-21
Connecting board with oval-shaped protrusions Grant 6,080,936 - Yamasaki , et al. June 27, 2	2000-06-27
Wired board with improved bonding pads Grant 6,018,197 - Saiki , et al. January 25, 2	2000-01-25
Connecting board for connection between base plate and mounting board Grant 5,859,407 - Saiki , et al. January 12, 1	1999-01-12
Ceramic package main body Grant 5,621,190 - Yamasaki , et al. April 15, 1	1997-04-15

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.