YAMAOKA; Koichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for YAMAOKA; Koichi.The latest application filed is for "semiconductor device".
- YAMAOKA; Koichi - Kanagawa-ken JP
- Yamaoka; Koichi - Matsuyama JP
- Yamaoka; Koichi - Ehime JP
| Patent | Date |
|---|---|
| Semiconductor Device App 20130093057 - YAMAOKA; Koichi | 2013-04-18 |
| Semiconductor Device And Method For Manufacturing Same App 20120228703 - YAMAOKA; Koichi | 2012-09-13 |
| Solution containing flame-resistant polymer and carbon molding Grant 8,043,693 - Higuchi , et al. October 25, 2 | 2011-10-25 |
| Flame resistant fiber, carbon fiber and production method thereof Grant 7,976,945 - Kawakami , et al. July 12, 2 | 2011-07-12 |
| Solution Containing Flame-resistant Polymer And Carbon Molding App 20100086762 - Higuchi; Tetsunori ; et al. | 2010-04-08 |
| Solution containing flame-resistant polymer and carbon molding Grant 7,655,716 - Higuchi , et al. February 2, 2 | 2010-02-02 |
| Flame Resistant Fiber, Carbon Fiber and Production Method Thereof App 20080299389 - Kawakami; Daisuke ; et al. | 2008-12-04 |
| Solution containing flame-resistant polymer and carbon molding App 20070142515 - Higuchi; Tetsunori ; et al. | 2007-06-21 |
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