Yamano; Takaharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamano; Takaharu.The latest application filed is for "semiconductor device and semiconductor device array".

Company Profile

0.63.67

Yamano; Takaharu - Nagano JP
YAMANO; Takaharu - Nagano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and semiconductor device array Grant 11,322,478 - Yamano , et al. May 3, 2	2022-05-03
Semiconductor Device And Semiconductor Device Array App 20200365556 - YAMANO; Takaharu ; et al.	2020-11-19
Electronic part embedded substrate and method of producing an electronic part embedded substrate Grant 10,134,680 - Yamano , et al. November 20, 2	2018-11-20
Electronic Part Embedded Substrate And Method Of Producing An Electronic Part Embedded Substrate App 20170365559 - YAMANO; Takaharu ; et al.	2017-12-21
Electronic part embedded substrate and method of producing an electronic part embedded substrate Grant 9,768,122 - Yamano , et al. September 19, 2	2017-09-19
Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package Grant 9,564,364 - Yamano February 7, 2	2017-02-07
Electronic Part Embedded Substrate And Method Of Producing An Electronic Part Embedded Substrate App 20160358858 - YAMANO; Takaharu ; et al.	2016-12-08
Chip embedded substrate and method of producing the same Grant 9,451,702 - Yamano , et al. September 20, 2	2016-09-20
Semiconductor device and method for manufacturing semiconductor device Grant 9,048,225 - Ichikawa , et al. June 2, 2	2015-06-02
Chip Embedded Substrate And Method Of Producing The Same App 20140313681 - YAMANO; Takaharu ; et al.	2014-10-23
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20140239508 - Ichikawa; Sumihiro ; et al.	2014-08-28
Chip embedded substrate and method of producing the same Grant 8,793,868 - Yamano , et al. August 5, 2	2014-08-05
Semiconductor package having a silicon reinforcing member embedded in resin Grant 8,779,573 - Miki , et al. July 15, 2	2014-07-15
Semiconductor device with reinforcement plate and method of forming same Grant 8,564,116 - Yamano October 22, 2	2013-10-22
Semiconductor device having a multilayer structure Grant 8,415,796 - Yamano April 9, 2	2013-04-09
Method of manufacturing an electronic parts packaging structure Grant 8,402,644 - Gomyo , et al. March 26, 2	2013-03-26
Semiconductor Device, Semiconductor Package, Method For Manufacturing Semiconductor Device, And Method For Manufacturing Semiconductor Package App 20130037943 - Yamano; Takaharu	2013-02-14
Manufacturing method of substrate with through electrode Grant 8,349,733 - Yamano January 8, 2	2013-01-08
Semiconductor device and method of manufacturing the same Grant 8,299,586 - Yamano , et al. October 30, 2	2012-10-30
Semiconductor package and stacked layer type semiconductor package Grant 8,253,229 - Yamano , et al. August 28, 2	2012-08-28
Semiconductor-device mounted board and method of manufacturing the same Grant 8,232,639 - Kobayashi , et al. July 31, 2	2012-07-31
Semiconductor device and manufacturing method thereof Grant 8,211,754 - Yamano July 3, 2	2012-07-03
Semiconductor Device And Method For Manufacturing The Same App 20120153507 - MIKI; Syota ; et al.	2012-06-21
Semiconductor device and manufacturing method therefor Grant 8,193,617 - Yamano June 5, 2	2012-06-05
Wiring board and method of manufacturing the same Grant 8,183,469 - Sunohara , et al. May 22, 2	2012-05-22
Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor device Grant 8,129,259 - Harayama , et al. March 6, 2	2012-03-06
Electronic device manufacturing method and electronic device Grant 8,102,048 - Yamano , et al. January 24, 2	2012-01-24
Manufacturing Method Of Semiconductor Packages And A Semiconductor Package App 20110316152 - MIKI; Syota ; et al.	2011-12-29
Semiconductor Device App 20110309498 - YAMANO; Takaharu	2011-12-22
Chip Embedded Substrate And Method Of Producing The Same App 20110256662 - YAMANO; Takaharu ; et al.	2011-10-20
Substrate with built-in electronic component and method for manufacturing the same Grant 7,994,431 - Yamano , et al. August 9, 2	2011-08-09
Chip embedded substrate and method of producing the same Grant 7,989,707 - Yamano , et al. August 2, 2	2011-08-02
Manufacturing method for semiconductor device embedded substrate Grant 7,985,619 - Kobayashi , et al. July 26, 2	2011-07-26
Manufacturing method for semiconductor device embedded substrate Grant 7,981,724 - Kobayashi , et al. July 19, 2	2011-07-19
Method of manufacturing semiconductor device Grant 7,964,493 - Yamano June 21, 2	2011-06-21
Method for forming wiring on insulating resin layer Grant 7,955,454 - Yamano , et al. June 7, 2	2011-06-07
Semiconductor-device Mounted Board And Method Of Manufacturing The Same App 20110127656 - KOBAYASHI; Toshio ; et al.	2011-06-02
Method of manufacturing wiring board Grant 7,937,828 - Yamano May 10, 2	2011-05-10
Semiconductor Device And Method Of Manufacturing The Same App 20110095404 - YAMANO; Takaharu ; et al.	2011-04-28
Semiconductor device and its manufacturing method Grant 7,919,843 - Yamano April 5, 2	2011-04-05
Manufacturing method for semiconductor device embedded substrate Grant 7,915,078 - Kobayashi , et al. March 29, 2	2011-03-29
Semiconductor device and manufacturing method thereof Grant 7,906,833 - Yamano , et al. March 15, 2	2011-03-15
Electronic parts packaging structure and method of manufacturing the same App 20110039370 - Gomyo; Toshio ; et al.	2011-02-17
Wiring board and method of manufacturing the same Grant 7,884,484 - Yamano , et al. February 8, 2	2011-02-08
Semiconductor device and manufacturing method thereof Grant 7,884,453 - Yamano February 8, 2	2011-02-08
Method of manufacturing a stacked semiconductor apparatus Grant 7,875,499 - Yamano January 25, 2	2011-01-25
Manufacturing Method Of Semiconductor Device App 20110003433 - HARAYAMA; Yoichi ; et al.	2011-01-06
Semiconductor Device With Reinforcement Plate And Method Of Forming Same App 20100320594 - YAMANO; Takaharu	2010-12-23
Semiconductor package and manufacturing method thereof Grant 7,847,384 - Kobayashi , et al. December 7, 2	2010-12-07
Electronic parts packaging structure Grant 7,843,059 - Gomyo , et al. November 30, 2	2010-11-30
Method of manufacturing semiconductor device Grant 7,811,857 - Yamano , et al. October 12, 2	2010-10-12
Electronic device manufacturing method and electronic device Grant 7,795,127 - Yamano September 14, 2	2010-09-14
Plating method Grant 7,790,359 - Yamano September 7, 2	2010-09-07
Semiconductor device and method for manufacturing the same Grant 7,786,580 - Machida , et al. August 31, 2	2010-08-31
Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same Grant 7,772,118 - Yamano August 10, 2	2010-08-10
Semiconductor package with a conductive post and wiring pattern Grant 7,772,689 - Kobayashi , et al. August 10, 2	2010-08-10
Semiconductor device and manufacturing method therefor Grant 7,763,977 - Yamano July 27, 2	2010-07-27
Method of forming wiring Grant 7,752,750 - Yamano July 13, 2	2010-07-13
Manufacturing method of semiconductor device Grant 7,749,889 - Yamano , et al. July 6, 2	2010-07-06
Wiring board and method for manufacturing the same Grant 7,732,712 - Yamano June 8, 2	2010-06-08
Manufacturing Method For Semiconductor Device Embedded Substrate App 20100112804 - KOBAYASHI; Toshio ; et al.	2010-05-06
Manufacturing Method For Semiconductor Device Embedded Substrate App 20100112759 - KOBAYASHI; Toshio ; et al.	2010-05-06
Manufacturing Method For Semiconductor Device Embedded Substrate App 20100112802 - Kobayashi; Toshio ; et al.	2010-05-06
Semiconductor Device And Manufacturing Method Thereof App 20100041183 - Yamano; Takaharu	2010-02-18
Electronic apparatus and manufacturing method thereof App 20100022035 - Yamano; Takaharu	2010-01-28
Semiconductor Device And Its Manufacturing Method App 20090321896 - YAMANO; Takaharu	2009-12-31
Semiconductor Device And Manufacturing Method Therefor App 20090302471 - YAMANO; Takaharu	2009-12-10
Wiring Board And Method Of Manufacturing The Same App 20090183911 - SUNOHARA; Masahiro ; et al.	2009-07-23
Method Of Manufacturing Semiconductor Device App 20090170307 - Yamano; Takaharu	2009-07-02
Semiconductor Device And Manufacturing Method Thereof App 20090127665 - Yamano; Takaharu ; et al.	2009-05-21
Manufacturing method of chip integrated substrate Grant 7,521,283 - Machida , et al. April 21, 2	2009-04-21
Electronic Apparatus And Manufacturing Method Thereof App 20090085222 - YAMANO; Takaharu	2009-04-02
Through electrode and method for forming the same Grant 7,498,259 - Yamano , et al. March 3, 2	2009-03-03
Chip Embedded Substrate And Method Of Producing The Same App 20090008765 - Yamano; Takaharu ; et al.	2009-01-08
Semiconductor Device And Method For Manufacturing The Same App 20090001569 - Machida; Yoshihiro ; et al.	2009-01-01
Electronic Device And Method Of Manufacturing The Same App 20090001570 - YAMANO; Takaharu	2009-01-01
Electronic Device Manufacturing Method And Electronic Device App 20080315414 - Yamano; Takaharu	2008-12-25
Electronic Device Manufacturing Method And Electronic Device App 20080315413 - YAMANO; Takaharu ; et al.	2008-12-25
Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side Grant 7,468,292 - Yamano December 23, 2	2008-12-23
Manufacturing Method Of Substrate With Through Electrode App 20080299768 - Yamano; Takaharu	2008-12-04
Method of manufacturing semiconductor device and support structure for semiconductor substrate Grant 7,459,343 - Yamano December 2, 2	2008-12-02
Semiconductor package and stacked layer type semiconductor package App 20080290491 - Yamano; Takaharu ; et al.	2008-11-27
Substrate Having High Electrical Connection Reliability Of A Penetrating Via Connected To Wirings And A Method For Manufacturing The Same App 20080261396 - YAMANO; Takaharu	2008-10-23
Semiconductor device and method for manufacturing the same App 20080230921 - Yamano; Takaharu	2008-09-25
Semiconductor device and method of fabricating the same Grant 7,417,311 - Yamano August 26, 2	2008-08-26
Semiconductor device and manufacturing method therefor App 20080128917 - Yamano; Takaharu	2008-06-05
Semiconductor package Grant 7,378,732 - Yamano , et al. May 27, 2	2008-05-27
Wiring board manufacturing method Grant 7,370,411 - Yamano May 13, 2	2008-05-13
Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same Grant 7,365,436 - Yamano April 29, 2	2008-04-29
Substrate with built-in electronic component and method for manufacturing the same App 20080089048 - Yamano; Takaharu ; et al.	2008-04-17
Semiconductor Device And Manufacturing Method Thereof App 20080073798 - Yamano; Takaharu	2008-03-27
Manufacturing Method Of Semiconductor Device App 20080076207 - Yamano; Takaharu ; et al.	2008-03-27
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same Grant 7,312,536 - Yamano , et al. December 25, 2	2007-12-25
Laminated semiconductor package Grant 7,288,841 - Yamano October 30, 2	2007-10-30
Method of forming wiring App 20070224809 - Yamano; Takaharu	2007-09-27
Method of fabricating a built-in chip type substrate Grant 7,250,329 - Yamano , et al. July 31, 2	2007-07-31
Method for forming wiring on insulating resin layer App 20070051459 - Yamano; Takaharu ; et al.	2007-03-08
Semiconductor Package And Manufacturing Method Thereof App 20070052083 - Kobayashi; Tsuyoshi ; et al.	2007-03-08
Semiconductor Package And Manufacturing Method Thereof App 20070052071 - Kobayashi; Tsuyoshi ; et al.	2007-03-08
Laminated Product In Structure Including Glass-cloth Contained Resin Layer And Method For Manufacturing The Same App 20070045811 - Machida; Yoshihiro ; et al.	2007-03-01
Method of manufacturing wiring board App 20070044303 - Yamano; Takaharu	2007-03-01
Semiconductor device and method of fabricating the same App 20070032066 - Yamano; Takaharu	2007-02-08
Electronic parts packaging structure and method of manufacturing the same App 20070018313 - Gomyo; Toshio ; et al.	2007-01-25
Laminated Semiconductor Package App 20060278968 - Yamano; Takaharu	2006-12-14
Wiring Board And Method For Manufacturing The Same App 20060272854 - Yamano; Takaharu	2006-12-07
Through electrode and method for forming the same App 20060267210 - Yamano; Takaharu ; et al.	2006-11-30
Wiring board manufacturing method App 20060207088 - Yamano; Takaharu	2006-09-21
Wiring board and method of manufacturing the same App 20060208356 - Yamano; Takaharu ; et al.	2006-09-21
Method of manufacturing semiconductor device Grant 7,105,423 - Yamano , et al. September 12, 2	2006-09-12
Method of manufacturing semiconductor device and support structure for semiconductor substrate App 20060128063 - Yamano; Takaharu	2006-06-15
Manufacturing method of chip integrated substrate App 20060121718 - Machida; Yoshihiro ; et al.	2006-06-08
Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same App 20060096781 - Yamano; Takaharu	2006-05-11
Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same App 20060097378 - Yamano; Takaharu	2006-05-11
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same App 20060087045 - Yamano; Takaharu ; et al.	2006-04-27
Method of manufacturing semiconductor device App 20060014320 - Yamano; Takaharu ; et al.	2006-01-19
Through electrode and method for forming the same App 20060001173 - Yamano; Takaharu ; et al.	2006-01-05
Method of fabricating a built-in chip type substrate App 20050266609 - Yamano, Takaharu ; et al.	2005-12-01
Method of manufacturing semiconductor device App 20050255686 - Yamano, Takaharu ; et al.	2005-11-17
Plating method App 20050202346 - Yamano, Takaharu	2005-09-15
Semiconductor device and method of fabricating the same App 20050112800 - Yamano, Takaharu	2005-05-26
Method of plating electrode formation App 20040253802 - Yamano, Takaharu	2004-12-16
Semiconductor package and production method App 20040207082 - Yamano, Takaharu ; et al.	2004-10-21
Semiconductor device and method for manufacturing same App 20030094686 - Iijima, Takahiro ; et al.	2003-05-22

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