Yamane; Tae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yamane; Tae.The latest application filed is for "semiconductor package".
- Yamane; Tae - Tokyo JP
| Patent | Date |
|---|---|
| Semiconductor package Grant 8,653,669 - Yamane February 18, 2 | 2014-02-18 |
| Semiconductor Package App 20130221503 - Yamane; Tae | 2013-08-29 |
| Semiconductor package Grant 8,436,480 - Yamane May 7, 2 | 2013-05-07 |
| Semiconductor Package App 20120175787 - Yamane; Tae | 2012-07-12 |
| Semiconductor package Grant 8,164,168 - Yamane April 24, 2 | 2012-04-24 |
| Semiconductor device which prevents light from entering therein Grant 7,368,815 - Yamane May 6, 2 | 2008-05-06 |
| Semiconductor package App 20080054419 - Yamane; Tae | 2008-03-06 |
| CSP semiconductor device having signal and radiation bump groups Grant 7,253,520 - Yoshida , et al. August 7, 2 | 2007-08-07 |
| Semiconductor device which prevents light from entering therein App 20060125085 - Yamane; Tae | 2006-06-15 |
| Semiconductor device and fabrication method of the same Grant 7,045,899 - Yamane , et al. May 16, 2 | 2006-05-16 |
| Semiconductor device which prevents light from entering therein Grant 7,015,576 - Yamane March 21, 2 | 2006-03-21 |
| Chip-size semiconductor package Grant 6,987,323 - Yamane January 17, 2 | 2006-01-17 |
| CSP semiconductor device having signal and radiation bump groups App 20050035469 - Yoshida, Hideaki ; et al. | 2005-02-17 |
| CSP Semiconductor device having signal and radiation bump groups Grant 6,841,873 - Yoshida , et al. January 11, 2 | 2005-01-11 |
| Semiconductor device and fabrication method of the same App 20040070064 - Yamane, Tae ; et al. | 2004-04-15 |
| Semiconductor device and method of fabrication of the same App 20030197270 - Yamane, Tae | 2003-10-23 |
| Chip-size semiconductor package App 20030146504 - Yamane, Tae | 2003-08-07 |
| Semiconductor device App 20030071363 - Yoshida, Hideaki ; et al. | 2003-04-17 |
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