Yamanaka; Yoshie
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yamanaka; Yoshie.The latest application filed is for ""lead-free solder ball"".
- Yamanaka; Yoshie - Tokyo JP
- Yamanaka; Yoshie - Adachi-ku JP
- Yamanaka, Yoshie - Kawasaki JP
| Patent | Date |
|---|---|
| "Lead-Free Solder Ball" App 20190088611 - Yamanaka; Yoshie ; et al. | 2019-03-21 |
| Lead-Free Solder Alloy App 20190076966 - Ohnishi; Tsukasa ; et al. | 2019-03-14 |
| Lead-free solder alloy Grant 10,076,808 - Ohnishi , et al. September 18, 2 | 2018-09-18 |
| Lead-Free Solder Ball App 20180005970 - Yamanaka; Yoshie ; et al. | 2018-01-04 |
| Lead-free solder alloy Grant 9,844,837 - Shimamura , et al. December 19, 2 | 2017-12-19 |
| Lead-free solder ball Grant 9,780,055 - Yamanaka , et al. October 3, 2 | 2017-10-03 |
| Lead-free solder alloy, connecting member and a method for its manufacture, and electronic part Grant 9,773,721 - Yoshikawa , et al. September 26, 2 | 2017-09-26 |
| Lead-free solder ball Grant 9,527,167 - Ohnishi , et al. December 27, 2 | 2016-12-27 |
| Lead-Free Solder Ball App 20160339543 - Ohnishi; Tsukasa ; et al. | 2016-11-24 |
| Lead-Free Solder Ball App 20150221606 - Yamanaka; Yoshie ; et al. | 2015-08-06 |
| Lead-free solder connection structure and solder ball Grant 8,975,757 - Ueshima , et al. March 10, 2 | 2015-03-10 |
| Lead-Free Solder Alloy App 20150037088 - Ohnishi; Tsukasa ; et al. | 2015-02-05 |
| Bonding material for semiconductor devices Grant 8,896,119 - Sakamoto , et al. November 25, 2 | 2014-11-25 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20140326490 - Yoshikawa; Shunsaku ; et al. | 2014-11-06 |
| Lead-Free Solder Alloy App 20140141273 - Shimamura; Masato ; et al. | 2014-05-22 |
| Lead-Free Solder Ball App 20140061287 - Ohnishi; Tsukasa ; et al. | 2014-03-06 |
| Bonding Material for Semiconductor Devices App 20130134591 - Sakamoto; Yoshitsugu ; et al. | 2013-05-30 |
| Lead-free Solder Alloy, Connecting Member And A Method For Its Manufacture, And Electronic Part App 20120199393 - Yoshikawa; Shunsaku ; et al. | 2012-08-09 |
| Lead-free Solder Connection Structure And Solder Ball App 20110115084 - Ueshima; Minoru ; et al. | 2011-05-19 |
| Confidential contents management method App 20040193546 - Tokutani, Takashi ; et al. | 2004-09-30 |
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