loadpatents
name:-0.033555030822754
name:-0.019438028335571
name:-0.00040888786315918
YAMAMOTO; Takatoshi Patent Filings

YAMAMOTO; Takatoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for YAMAMOTO; Takatoshi.The latest application filed is for "electricity storage device".

Company Profile
0.23.27
  • YAMAMOTO; Takatoshi - Hitachinaka JP
  • Yamamoto; Takatoshi - Nagano JP
  • Yamamoto; Takatoshi - Hitachi N/A JP
  • Yamamoto; Takatoshi - Suwa JP
  • Yamamoto; Takatoshi - Nagano-ken N/A JP
  • YAMAMOTO; Takatoshi - Hitachi-shi JP
  • Yamamoto; Takatoshi - Kyoto JP
  • Yamamoto; Takatoshi - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electricity Storage Device
App 20160240902 - YAMAMOTO; Takatoshi
2016-08-18
Droplet discharge device including weight measurement device
Grant 8,816,224 - Yamamoto , et al. August 26, 2
2014-08-26
Electric storage device
Grant 8,741,472 - Yamamoto , et al. June 3, 2
2014-06-03
Liquid droplet ejection head and liquid droplet ejection apparatus
Grant 8,721,044 - Sato , et al. May 13, 2
2014-05-13
Bonding method and bonded body
Grant 8,679,283 - Yamamoto , et al. March 25, 2
2014-03-25
Bonding method and bonded body
Grant 8,617,340 - Yamamoto , et al. December 31, 2
2013-12-31
Liquid Droplet Ejection Head And Liquid Droplet Ejection Apparatus
App 20130307904 - SATO; Mitsuru ;   et al.
2013-11-21
Liquid droplet ejection head and liquid droplet ejection apparatus
Grant 8,517,519 - Sato , et al. August 27, 2
2013-08-27
Bonding Method and Bonded Body
App 20120315450 - Yamamoto; Takatoshi ;   et al.
2012-12-13
Separating method of bonded body
Grant 8,211,259 - Sato , et al. July 3, 2
2012-07-03
Electric Storage Device
App 20120082876 - YAMAMOTO; Takatoshi ;   et al.
2012-04-05
Electrical Storage Device
App 20120058368 - YAMAMOTO; Takatoshi ;   et al.
2012-03-08
Method for disassembling bonded structure
Grant 8,105,461 - Sato , et al. January 31, 2
2012-01-31
Liquid Droplet Ejection Head And Liquid Droplet Ejection Apparatus
App 20110273518 - SATO; Mitsuru ;   et al.
2011-11-10
Electric Storage Module and Electric Storage Device
App 20110244283 - SETO; Sadashi ;   et al.
2011-10-06
Liquid droplet ejection head and liquid droplet ejection apparatus
Grant 8,016,394 - Yamamoto September 13, 2
2011-09-13
Semiconductor oxidation apparatus and method of producing semiconductor element
Grant 7,981,700 - Sato , et al. July 19, 2
2011-07-19
Method of forming bonded body and bonded body
Grant 7,980,448 - Sato , et al. July 19, 2
2011-07-19
Method of forming bonded body and bonded body
Grant 7,967,185 - Sato , et al. June 28, 2
2011-06-28
Method of forming bonded body and bonded body
Grant 7,963,435 - Sato , et al. June 21, 2
2011-06-21
Droplet Discharge Device
App 20110100725 - YAMAMOTO; Takatoshi ;   et al.
2011-05-05
Weight measurement device, droplet discharge device, and weight measurement method
Grant 7,893,368 - Yamamoto , et al. February 22, 2
2011-02-22
Liquid Droplet Ejection Head And Liquid Droplet Ejection Apparatus
App 20100302312 - YAMAMOTO; Takatoshi ;   et al.
2010-12-02
Bonding Method And Bonded Structure
App 20100304157 - SATO; Mitsuru ;   et al.
2010-12-02
Bonding Method And Bonded Structure
App 20100304159 - SATO; Mitsuru ;   et al.
2010-12-02
Bonding Method And Bonded Structure
App 20100304156 - SATO; Mitsuru ;   et al.
2010-12-02
Noncontact rotation angle sensor, manufacturing method for the same, and throttle valve control device for internal combustion engine having the same
Grant 7,800,358 - Akiyama , et al. September 21, 2
2010-09-21
Molecular Beam Cell Having Purge Function
App 20100218723 - Yamamoto; Takatoshi ;   et al.
2010-09-02
Bonding Method And Bonded Structure
App 20100206474 - SATO; Mitsuru ;   et al.
2010-08-19
Bonding Method And Bonded Body
App 20100092767 - NAITO; Nobuhiro ;   et al.
2010-04-15
Bonding Method And Bonded Body
App 20100092788 - NAITO; Nobuhiro ;   et al.
2010-04-15
Base Member With Binding Film, Bonding Method, And Bonded Structure
App 20090317617 - SATO; Mitsuru ;   et al.
2009-12-24
Method For Disassembling Bonded Structure
App 20090250168 - SATO; Mitsuru ;   et al.
2009-10-08
Method Of Forming Bonded Body And Bonded Body
App 20090186215 - SATO; Mitsuru ;   et al.
2009-07-23
Method Of Forming Bonded Body And Bonded Body
App 20090186242 - SATO; Mitsuru ;   et al.
2009-07-23
Method Of Forming Bonded Body And Bonded Body
App 20090183825 - SATO; Mitsuru ;   et al.
2009-07-23
Liquid Droplet Ejection Head And Liquid Droplet Ejection Apparatus
App 20090147051 - YAMAMOTO; Takatoshi
2009-06-11
Separating Method Of Bonded Body
App 20090133820 - SATO; Mitsuru ;   et al.
2009-05-28
Bonding Method And Bonded Body
App 20090136767 - YAMAMOTO; Takatoshi ;   et al.
2009-05-28
Weight Measurement Device, Droplet Discharge Device, And Weight Measurement Method
App 20090008159 - YAMAMOTO; Takatoshi ;   et al.
2009-01-08
Semiconductor Oxidation Apparatus and Method of Producing Semiconductor Element
App 20080233017 - Sato; Shunichi ;   et al.
2008-09-25
Noncontact rotation angle sensor, manufacturing method for the same, and throttle valve control device for internal combustion engine having the same
App 20070000455 - Akiyama; Yoshiyuki ;   et al.
2007-01-04
Effusion cell for Si and molecular beam epitaxy system
Grant 6,139,643 - Yamamoto October 31, 2
2000-10-31
Air conditioning system
Grant 5,156,203 - Funakoshi , et al. October 20, 1
1992-10-20
Air conditioning apparatus, heat exchanger for use in the apparatus and apparatus control method
Grant 5,101,640 - Fukushima , et al. April 7, 1
1992-04-07

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