Yamamoto; Syouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamamoto; Syouji.The latest application filed is for "manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same".

Company Profile

0.4.5

Yamamoto; Syouji - Ibaraki N/A JP
Yamamoto; Syouji - Osaka JP
Yamamoto; Syouji - Ibaraki-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method of laser processed parts, and pressure-sensitive adhesive sheet for laser processing used for the same Grant 8,778,118 - Urairi , et al. July 15, 2	2014-07-15
Manufacturing Method Of Laser Processed Parts, And Pressure-sensitive Adhesive Sheet For Laser Processing Used For The Same App 20100273313 - Urairi; Masakatsu ; et al.	2010-10-28
Protective sheet for laser processing and manufacturing method of laser processed parts Grant 7,586,060 - Urairi , et al. September 8, 2	2009-09-08
Protective sheet for laser processing and manufacturing method of laser processed parts App 20070181543 - Urairi; Masakatsu ; et al.	2007-08-09
Dicing adhesive sheet and dicing method Grant 7,183,007 - Yamamoto February 27, 2	2007-02-27
Pressure-sensitive Adhesive Sheet For Use In Dicing And Method Of Processing Products Worked With It App 20060257651 - Shintani; Toshio 1-1-2, Shimohozumi ; et al.	2006-11-16
Method of producing laser-processed product and adhesive sheet, for laser processing used therefor App 20060246279 - Urairi; Masakatsu ; et al.	2006-11-02
Dicing adhesive sheet and dicing method App 20050000638 - Yamamoto, Syouji	2005-01-06

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