loadpatents
name:-0.016890048980713
name:-0.013530969619751
name:-0.0056388378143311
YAMAMOTO; Setsuo Patent Filings

YAMAMOTO; Setsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for YAMAMOTO; Setsuo.The latest application filed is for "wafer manufacturing apparatus".

Company Profile
5.14.18
  • YAMAMOTO; Setsuo - Tokyo JP
  • YAMAMOTO; Setsuo - Yamaguchi JP
  • Yamamoto; Setsuo - Ube N/A JP
  • Yamamoto; Setsuo - Ube-shi JP
  • Yamamoto; Setsuo - Ota-Ku JP
  • Yamamoto; Setsuo - Ashiya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wafer Manufacturing Apparatus
App 20220193826 - YAMAMOTO; Setsuo
2022-06-23
Porous chuck table
Grant 11,315,822 - Yamamoto April 26, 2
2022-04-26
Chuck table, cutting apparatus, and method correcting chuck table
Grant 11,101,162 - Yamamoto , et al. August 24, 2
2021-08-24
Chuck Table And Method Of Manufacturing Chuck Table
App 20210074575 - Yamamoto; Setsuo ;   et al.
2021-03-11
Gas Analyzer
App 20200348237 - NAKAGAWA; Mitsugu ;   et al.
2020-11-05
Chuck table and method of manufacturing suction plate of porous ceramics
Grant 10,532,411 - Yamamoto Ja
2020-01-14
Porous Chuck Table
App 20200013664 - YAMAMOTO; Setsuo
2020-01-09
Chuck Table, Cutting Apparatus, And Method Correcting Chuck Table
App 20190273010 - YAMAMOTO; Setsuo ;   et al.
2019-09-05
Laser Processing Apparatus And Laser Processing Method
App 20190001433 - Yamamoto; Setsuo
2019-01-03
Chuck Table And Method Of Manufacturing Suction Plate Of Porous Ceramics
App 20180065187 - Yamamoto; Setsuo
2018-03-08
Image Recognition Device
App 20160260299 - YAMAMOTO; Setsuo
2016-09-08
Leakage inspection apparatus and leakage inspection method
Grant 9,274,021 - Yamamoto , et al. March 1, 2
2016-03-01
Leakage Inspection Apparatus And Leakage Inspection Method
App 20130199274 - Yamamoto; Setsuo ;   et al.
2013-08-08
Method of grinding wafer
Grant 8,025,556 - Kajiyama , et al. September 27, 2
2011-09-27
Polishing tool and polishing method and apparatus using same
Grant 7,736,215 - Sekiya , et al. June 15, 2
2010-06-15
Semiconductor wafer processing method
Grant 7,731,567 - Sekiya , et al. June 8, 2
2010-06-08
Polishing tool
Grant 7,713,107 - Sekiya , et al. May 11, 2
2010-05-11
Grinding method for wafer
Grant 7,677,955 - Kajiyama , et al. March 16, 2
2010-03-16
Method Of Grinding Wafer
App 20090186562 - Kajiyama; Keiichi ;   et al.
2009-07-23
Grinding Apparatus And Method Of Grinding Wafer
App 20090104858 - YAMAMOTO; Setsuo
2009-04-23
Grinding Method For Wafer
App 20090098808 - Kajiyama; Keiichi ;   et al.
2009-04-16
Polishing tool and polishing method and apparatus using same
App 20080085662 - Sekiya; Sinnosuke ;   et al.
2008-04-10
Semiconductor wafer processing method
App 20080076329 - Sekiya; Shinnosuke ;   et al.
2008-03-27
Titanium alloy vacuum and vacuum part
Grant 6,841,265 - Kurisu , et al. January 11, 2
2005-01-11
Magnetic recording medium and process for producing the same
Grant 6,746,786 - Santoki , et al. June 8, 2
2004-06-08
Titanium alloy vacuum container and vacuum part
App 20030162042 - Kurisu, Hiroki ;   et al.
2003-08-28
Polishing tool and polishing method and apparatus using same
App 20020173244 - Sekiya, Sinnosuke ;   et al.
2002-11-21
Magnetic recording medium and process for producing the same
App 20020068193 - Santoki, Teruaki ;   et al.
2002-06-06
Routing method and system
Grant 5,119,317 - Narikawa , et al. June 2, 1
1992-06-02
Corner holder for use with boxes
Grant 4,449,662 - Okamura , et al. May 22, 1
1984-05-22

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