loadpatents
Patent applications and USPTO patent grants for YAMAMOTO; Setsuo.The latest application filed is for "wafer manufacturing apparatus".
Patent | Date |
---|---|
Wafer Manufacturing Apparatus App 20220193826 - YAMAMOTO; Setsuo | 2022-06-23 |
Porous chuck table Grant 11,315,822 - Yamamoto April 26, 2 | 2022-04-26 |
Chuck table, cutting apparatus, and method correcting chuck table Grant 11,101,162 - Yamamoto , et al. August 24, 2 | 2021-08-24 |
Chuck Table And Method Of Manufacturing Chuck Table App 20210074575 - Yamamoto; Setsuo ;   et al. | 2021-03-11 |
Gas Analyzer App 20200348237 - NAKAGAWA; Mitsugu ;   et al. | 2020-11-05 |
Chuck table and method of manufacturing suction plate of porous ceramics Grant 10,532,411 - Yamamoto Ja | 2020-01-14 |
Porous Chuck Table App 20200013664 - YAMAMOTO; Setsuo | 2020-01-09 |
Chuck Table, Cutting Apparatus, And Method Correcting Chuck Table App 20190273010 - YAMAMOTO; Setsuo ;   et al. | 2019-09-05 |
Laser Processing Apparatus And Laser Processing Method App 20190001433 - Yamamoto; Setsuo | 2019-01-03 |
Chuck Table And Method Of Manufacturing Suction Plate Of Porous Ceramics App 20180065187 - Yamamoto; Setsuo | 2018-03-08 |
Image Recognition Device App 20160260299 - YAMAMOTO; Setsuo | 2016-09-08 |
Leakage inspection apparatus and leakage inspection method Grant 9,274,021 - Yamamoto , et al. March 1, 2 | 2016-03-01 |
Leakage Inspection Apparatus And Leakage Inspection Method App 20130199274 - Yamamoto; Setsuo ;   et al. | 2013-08-08 |
Method of grinding wafer Grant 8,025,556 - Kajiyama , et al. September 27, 2 | 2011-09-27 |
Polishing tool and polishing method and apparatus using same Grant 7,736,215 - Sekiya , et al. June 15, 2 | 2010-06-15 |
Semiconductor wafer processing method Grant 7,731,567 - Sekiya , et al. June 8, 2 | 2010-06-08 |
Polishing tool Grant 7,713,107 - Sekiya , et al. May 11, 2 | 2010-05-11 |
Grinding method for wafer Grant 7,677,955 - Kajiyama , et al. March 16, 2 | 2010-03-16 |
Method Of Grinding Wafer App 20090186562 - Kajiyama; Keiichi ;   et al. | 2009-07-23 |
Grinding Apparatus And Method Of Grinding Wafer App 20090104858 - YAMAMOTO; Setsuo | 2009-04-23 |
Grinding Method For Wafer App 20090098808 - Kajiyama; Keiichi ;   et al. | 2009-04-16 |
Polishing tool and polishing method and apparatus using same App 20080085662 - Sekiya; Sinnosuke ;   et al. | 2008-04-10 |
Semiconductor wafer processing method App 20080076329 - Sekiya; Shinnosuke ;   et al. | 2008-03-27 |
Titanium alloy vacuum and vacuum part Grant 6,841,265 - Kurisu , et al. January 11, 2 | 2005-01-11 |
Magnetic recording medium and process for producing the same Grant 6,746,786 - Santoki , et al. June 8, 2 | 2004-06-08 |
Titanium alloy vacuum container and vacuum part App 20030162042 - Kurisu, Hiroki ;   et al. | 2003-08-28 |
Polishing tool and polishing method and apparatus using same App 20020173244 - Sekiya, Sinnosuke ;   et al. | 2002-11-21 |
Magnetic recording medium and process for producing the same App 20020068193 - Santoki, Teruaki ;   et al. | 2002-06-06 |
Routing method and system Grant 5,119,317 - Narikawa , et al. June 2, 1 | 1992-06-02 |
Corner holder for use with boxes Grant 4,449,662 - Okamura , et al. May 22, 1 | 1984-05-22 |
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