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name:-0.033006906509399
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Yamamoto; Masaharu Patent Filings

Yamamoto; Masaharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamamoto; Masaharu.The latest application filed is for "method for manufacturing hermetic sealing lid member".

Company Profile
2.22.23
  • Yamamoto; Masaharu - Suita JP
  • Yamamoto; Masaharu - Suita-shi JP
  • Yamamoto; Masaharu - Hiroshima JP
  • Yamamoto; Masaharu - Osaka JP
  • Yamamoto; Masaharu - Minamikawachi-gun N/A JP
  • Yamamoto; Masaharu - Kanan-cho N/A JP
  • Yamamoto; Masaharu - Izumi JP
  • Yamamoto; Masaharu - Izumi-shi JP
  • Yamamoto; Masaharu - Kagoshima JP
  • Yamamoto, Masaharu - Shiga JP
  • Yamamoto, Masaharu - Kanagawa JP
  • Yamamoto, Masaharu - Otsu-shi JP
  • Yamamoto; Masaharu - Nagoya JP
  • Yamamoto; Masaharu - Otsu JP
  • Yamamoto; Masaharu - Inazawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing hermetic sealing lid member
Grant 11,178,786 - Yokota , et al. November 16, 2
2021-11-16
Glass bonding material and multilayer glass
Grant 10,696,589 - Yokota , et al. June 30, 2
2020-06-30
Hermetic sealing lid member
Grant 10,595,424 - Yokota , et al.
2020-03-17
Method for manufacturing hermetic sealing lid member, and method for manufacturing electronic component housing package
Grant 10,461,001 - Yokota , et al. Oc
2019-10-29
Method For Manufacturing Hermetic Sealing Lid Member
App 20190289738 - Yokota; Masayuki ;   et al.
2019-09-19
Battery terminal, method for manufacturing battery terminal, and battery
Grant 10,193,126 - Oda , et al. Ja
2019-01-29
Symbol recognition device and traffic sign recognition device
Grant 9,959,473 - Koide , et al. May 1, 2
2018-05-01
Hermetic Sealing Lid Member And Electronic Component Housing Package
App 20170367205 - Yokota; Masayuki ;   et al.
2017-12-21
Hermetic Sealing Lid Member, Method For Manufacturing Hermetic Sealing Lid Member, And Electronic Component Housing Package
App 20170354049 - Yokota; Masayuki ;   et al.
2017-12-07
Method For Manufacturing Hermetic Sealing Lid Member, Hermetic Sealing Lid Member, And Method For Manufacturing Electronic Component Housing Package
App 20170330811 - Yokota; Masayuki ;   et al.
2017-11-16
Glass Bonding Material And Multilayer Glass
App 20170283318 - Yokota; Masayuki ;   et al.
2017-10-05
Battery terminal, method for manufacturing battery terminal, and battery
Grant 9,525,228 - Oda , et al. December 20, 2
2016-12-20
Symbol Recognition Device And Traffic Sign Recognition Device
App 20160210520 - KOIDE; Tetsushi ;   et al.
2016-07-21
Connection plate for battery terminals and method for manufacturing connection plate for battery terminals
Grant 9,350,007 - Oda , et al. May 24, 2
2016-05-24
Battery Terminal, Method For Manufacturing Battery Terminal, And Battery
App 20160118641 - Oda; Yoshimitsu ;   et al.
2016-04-28
Cover Material For Hermetic Sealing And Package For Containing Electronic Component
App 20150232244 - Yokota; Masayuki ;   et al.
2015-08-20
Battery Terminal, Method For Manufacturing Battery Terminal, And Battery
App 20150086867 - Oda; Yoshimitsu ;   et al.
2015-03-26
Connection plate for battery terminals and method for manufacturing connection plate for battery terminals
Grant 8,785,029 - Oda , et al. July 22, 2
2014-07-22
Connection Plate For Battery Terminals And Method For Manufacturing Connection Plate For Battery Terminals
App 20130316217 - Oda; Yoshimitsu ;   et al.
2013-11-28
Connection Plate For Battery Terminals And Method For Manufacturing Connection Plate For Battery Terminals
App 20130309919 - Oda; Yoshimitsu ;   et al.
2013-11-21
Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package
Grant 8,551,623 - Yamamoto , et al. October 8, 2
2013-10-08
Hermetic sealing cap
Grant 8,431,820 - Yamamoto , et al. April 30, 2
2013-04-30
Hermetic Sealing Cap
App 20110048757 - Yamamoto; Masaharu ;   et al.
2011-03-03
Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap
Grant 7,790,988 - Tanaka , et al. September 7, 2
2010-09-07
Airtightly Sealing Cap, Electronic Component Storing Package And Method For Manufacturing Electronic Component Storing Package
App 20100104887 - Yamamoto; Masaharu ;   et al.
2010-04-29
Hermetic Sealing Cap, Electronic Component Accommodation Package, And Method For Producing Hermetic Sealing Cap
App 20090301749 - Tanaka; Tsuyoshi ;   et al.
2009-12-10
Hermetic Sealing Cap, Method of Manufacturing Hermetic Sealing Cap and Electronic Component Storage Package
App 20080271908 - Yamamoto; Masaharu ;   et al.
2008-11-06
Hermetic sealing cap and method of manufacturing the same
Grant 7,173,331 - Matsubara , et al. February 6, 2
2007-02-06
Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board
Grant 6,943,102 - Yamamoto September 13, 2
2005-09-13
Hermetic sealing cap and method of manufacturing the same
App 20050023661 - Matsubara, Shigeji ;   et al.
2005-02-03
Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board
App 20040149812 - Yamamoto, Masaharu
2004-08-05
Process for producing germ extract
App 20040043088 - Endo, Yaeta ;   et al.
2004-03-04
Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board
Grant 6,677,229 - Yamamoto January 13, 2
2004-01-13
Video transmission system
App 20030101461 - Todogawa, Norifumi ;   et al.
2003-05-29
Solder bump transfer sheet, method for producing the same, and methods for fabricating semiconductor device and printed board
App 20020106883 - Yamamoto, Masaharu
2002-08-08
Evaluation method of semiconductor chargeup damage and apparatus therefor
App 20010028056 - Yamamoto, Masaharu
2001-10-11
Process for manufacturing prepregs for use as electric insulating material
Grant 5,633,042 - Nakamura , et al. May 27, 1
1997-05-27
Non-volatile memory device and transistor circuits on the same chip
Grant 5,239,197 - Yamamoto August 24, 1
1993-08-24
Solid ink
Grant 5,123,961 - Yamamoto June 23, 1
1992-06-23

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