Yamamichi; Shintaro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamamichi; Shintaro.The latest application filed is for "method of forming a solder bump on a substrate".

Company Profile

0.75.84

Yamamichi; Shintaro - Kanagawa JP
Yamamichi; Shintaro - Kunitachi JP
Yamamichi; Shintaro - Kawasaki JP
Yamamichi; Shintaro - Tokyo N/A JP
YAMAMICHI; Shintaro - Minato-ku JP
YAMAMICHI; SHINTARO - Kawasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device Grant 10,098,179 - Yamamichi , et al. October 9, 2	2018-10-09
Method of forming a solder bump on a substrate Grant 9,520,375 - Aoki , et al. December 13, 2	2016-12-13
Method of Forming a Solder Bump on a Substrate App 20160322319 - Aoki; Toyohiro ; et al.	2016-11-03
Semiconductor device Grant 9,362,262 - Yamamichi , et al. June 7, 2	2016-06-07
Semiconductor device Grant 9,362,263 - Yamamichi , et al. June 7, 2	2016-06-07
Semiconductor device including a plurality of magnetic shields Grant 9,324,663 - Watanabe , et al. April 26, 2	2016-04-26
Semiconductor Device App 20150333048 - Yamamichi; Shintaro ; et al.	2015-11-19
Semiconductor device Grant 9,172,028 - Watanabe , et al. October 27, 2	2015-10-27
Semiconductor device Grant 9,165,879 - Yamamichi , et al. October 20, 2	2015-10-20
Semiconductor device Grant 9,117,814 - Yamamichi , et al. August 25, 2	2015-08-25
Semiconductor Device App 20150171066 - YAMAMICHI; Shintaro ; et al.	2015-06-18
Semiconductor device manufacturing method Grant 8,975,150 - Mori , et al. March 10, 2	2015-03-10
Functional Element Built-in Substrate And Wiring Substrate App 20150053474 - NAKASHIMA; Yoshiki ; et al.	2015-02-26
Functional element built-in substrate and wiring substrate Grant 8,929,090 - Nakashima , et al. January 6, 2	2015-01-06
Semiconductor Device App 20140367863 - YAMAMICHI; SHINTARO ; et al.	2014-12-18
Semiconductor Device App 20140361410 - Yamamichi; Shintaro ; et al.	2014-12-11
Semiconductor Device App 20140361411 - Yamamichi; Shintaro ; et al.	2014-12-11
Method For Fabricating A Metal-insulator-metal (mim) Capacitor Having Capacitor Dielectric Layer Formed By Atomic Layer Deposition (ald) App 20140327064 - IIZUKA; Toshihiro ; et al.	2014-11-06
Electronic Device App 20140329476 - YAMAMICHI; Shintaro ; et al.	2014-11-06
Method for manufacturing semiconductor device Grant 8,872,334 - Yamamichi , et al. October 28, 2	2014-10-28
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20140239425 - WATANABE; TAKAHITO ; et al.	2014-08-28
Method for fabricating a metal-insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD) Grant 8,815,678 - Iizuka , et al. August 26, 2	2014-08-26
Semiconductor element-embedded substrate, and method of manufacturing the substrate Grant 8,810,008 - Mori , et al. August 19, 2	2014-08-19
Wiring board with built-in semiconductor element Grant 8,766,440 - Kikuchi , et al. July 1, 2	2014-07-01
Semiconductor device and method of manufacturing semiconductor device Grant 8,749,033 - Watanabe , et al. June 10, 2	2014-06-10
Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer Grant 8,710,669 - Mori , et al. April 29, 2	2014-04-29
Semiconductor element-embedded wiring substrate Grant 8,710,639 - Kikuchi , et al. April 29, 2	2014-04-29
Wiring board capable of containing functional element and method for manufacturing same Grant 8,692,135 - Funaya , et al. April 8, 2	2014-04-08
Semiconductor device and method for manufacturing the same Grant 8,692,364 - Kikuchi , et al. April 8, 2	2014-04-08
Semiconductor Device And Manufacturing Method Thereof App 20140024177 - MORI; KENTARO ; et al.	2014-01-23
Semiconductor device and manufacturing method thereof Grant 8,569,892 - Mori , et al. October 29, 2	2013-10-29
Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device Grant 8,552,570 - Kikuchi , et al. October 8, 2	2013-10-08
Semiconductor device and method for manufacturing the same Grant 8,536,691 - Kikuchi , et al. September 17, 2	2013-09-17
Semiconductor Device Built-in Substrate App 20130127037 - Mori; Kentaro ; et al.	2013-05-23
Substrate With Built-in Functional Element App 20130088841 - Ohshima; Daisuke ; et al.	2013-04-11
Multimedia Providing Service App 20130087927 - YAMAMICHI; Shintaro ; et al.	2013-04-11
Method of manufacturing a wiring board Grant 8,389,414 - Kikuchi , et al. March 5, 2	2013-03-05
Functional Device-embedded Substrate App 20130050967 - Ohshima; Daisuke ; et al.	2013-02-28
Semiconductor Element-embedded Wiring Substrate App 20130026632 - Kikuchi; Katsumi ; et al.	2013-01-31
Method For Manufacturing Semiconductor Device App 20130026653 - Yamamichi; Shintaro ; et al.	2013-01-31
Semiconductor Element-embedded Substrate, And Method Of Manufacturing The Substrate App 20130009325 - Mori; Kentaro ; et al.	2013-01-10
Semiconductor device Grant 8,344,498 - Yamamichi , et al. January 1, 2	2013-01-01
Wiring Board With Built-in Semiconductor Element App 20120319254 - Kikuchi; Katsumi ; et al.	2012-12-20
Functional Element Built-in Substrate And Wiring Substrate App 20120300425 - Nakashima; Yoshiki ; et al.	2012-11-29
Semiconductor device and method for manufacturing the same Grant 8,304,915 - Mori , et al. November 6, 2	2012-11-06
Semiconductor Device Having A Thin Film Capacitor And Method For Fabricating The Same App 20120261735 - IIZUKA; Toshihiro ; et al.	2012-10-18
Semiconductor device having a thin film capacitor of a MIM (metal-insulator-metal) structure Grant 8,212,299 - Iizuka , et al. July 3, 2	2012-07-03
Semiconductor Device And Manufacturing Method Thereof App 20120153501 - Murai; Hideya ; et al.	2012-06-21
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 8,198,140 - Murai , et al. June 12, 2	2012-06-12
Semiconductor Device And Method For Manufacturing The Same App 20120133052 - Kikuchi; Katsumi ; et al.	2012-05-31
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20120119338 - Watanabe; Takahito ; et al.	2012-05-17
Metal-insulator-metal (MIM) capacitor having capacitor dielectric material selected from a group consisting of ZRO2, HFO2, (ZRX, HF1-X)O2 (0<x<1), (ZRy, Ti (O<y<1), (Hfz, Ti-z)O2 (O<z<1) and (Zrk, Ti1, Hfm)O2 (O<K, 1, m<1, K+1+m=1) Grant 8,169,013 - Iizuka , et al. May 1, 2	2012-05-01
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20120068359 - Mori; Kentaro ; et al.	2012-03-22
Positive-type Photosensitive Insulating Resin Composition, And Pattern Forming Method Using Same App 20120021357 - Maeda; Katsumi ; et al.	2012-01-26
Semiconductor device and method of manufacturing same Grant 8,072,073 - Kikuchi , et al. December 6, 2	2011-12-06
Semiconductor Device Manufacturing Method App 20110281401 - MORI; Kentaro ; et al.	2011-11-17
Wiring board, semiconductor device, and method of manufacturing the same Grant 8,050,050 - Yamamichi , et al. November 1, 2	2011-11-01
Semiconductor device including an LSI chip and a method for manufacturing the same Grant 8,043,953 - Murai , et al. October 25, 2	2011-10-25
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same Grant 8,039,756 - Kikuchi , et al. October 18, 2	2011-10-18
Semiconductor device and method for manufacturing same Grant 8,035,217 - Mori , et al. October 11, 2	2011-10-11
Semiconductor device and method of manufacturing the same Grant 8,030,201 - Soejima , et al. October 4, 2	2011-10-04
Semiconductor Element-embedded Wiring Substrate App 20110215478 - YAMAMICHI; Shintaro ; et al.	2011-09-08
Semiconductor device and fabrication method Grant 8,004,074 - Mori , et al. August 23, 2	2011-08-23
Semiconductor device and method of manufacturing semiconductor device Grant 8,004,085 - Yamamichi , et al. August 23, 2	2011-08-23
Semiconductor device and method of manufacturing same Grant 7,999,401 - Murai , et al. August 16, 2	2011-08-16
Semiconductor Device And Manufacturing Method Thereof App 20110175213 - Mori; Kentaro ; et al.	2011-07-21
Wiring Board Capable Of Containing Functional Element And Method For Manufacturing Same App 20110155433 - Funaya; Takuo ; et al.	2011-06-30
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ; et al.	2011-06-09
Semiconductor Device And Method For Manufacturing The Same App 20110121445 - Mori; Kentaro ; et al.	2011-05-26
Wiring Board, Semiconductor Device, And Method Of Manufacturing The Same App 20110075389 - YAMAMICHI; Shintaro ; et al.	2011-03-31
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2	2011-03-22
Wiring board, semiconductor device, and method of manufacturing the same Grant 7,889,514 - Yamamichi , et al. February 15, 2	2011-02-15
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Grant 7,880,295 - Kikuchi , et al. February 1, 2	2011-02-01
Wiring Substrate For Mounting Semiconductors, Method Of Manufacturing The Same, And Semiconductor Package App 20110003472 - MURAI; Hideya ; et al.	2011-01-06
Semiconductor Device And Method For Producing The Same App 20100314778 - Murai; Hideya ; et al.	2010-12-16
Wiring Board, Semiconductor Device, And Method For Manufacturing Wiring Board And Semiconductor Device App 20100295191 - Kikuchi; Katsumi ; et al.	2010-11-25
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2	2010-11-23
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Grant 7,816,782 - Murai , et al. October 19, 2	2010-10-19
Semiconductor Device App 20100244231 - Yamamichi; Shintaro ; et al.	2010-09-30
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ; et al.	2010-09-16
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same Grant 7,791,186 - Kikuchi , et al. September 7, 2	2010-09-07
Interconnecting substrate and semiconductor device Grant 7,745,736 - Ogawa , et al. June 29, 2	2010-06-29
Wiring Boad, Semiconductor Device In Which Wiring Board Is Used, And Method For Manufaturing The Same App 20100127405 - KIKUCHI; Katsumi ; et al.	2010-05-27
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20100117228 - Yamamichi; Shintaro ; et al.	2010-05-13
Functional-device-embedded Circuit Board, Method For Manufacturing The Same, And Electronic Equipment App 20100103634 - Funaya; Takuo ; et al.	2010-04-29
Method of manufacturing a wiring substrate and semiconductor device Grant 7,701,726 - Tsukano , et al. April 20, 2	2010-04-20
Semiconductor Device And Method Of Manufacturing The Same App 20100087058 - SOEJIMA; Koji ; et al.	2010-04-08
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2	2010-03-09
Circuit Substrate, An Electronic Device Arrangement And A Manufacturing Process For The Circuit Substrate App 20100044845 - Funaya; Takuo ; et al.	2010-02-25
Semiconductor device and method of manufacturing the same Grant 7,652,375 - Soejima , et al. January 26, 2	2010-01-26
Wiring substrate, semiconductor device, and method of manufacturing the same Grant 7,649,749 - Tsukano , et al. January 19, 2	2010-01-19
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ; et al.	2009-12-24
Semiconductor Device And Method For Manufacturing The Same App 20090294951 - Murai; Hideya ; et al.	2009-12-03
Semiconductor Device And Method For Manufacturing The Same App 20090283895 - Kikuchi; Katsumi ; et al.	2009-11-19
Method Of Manufacturing A Wiring Substrate And Semiconductor Device App 20090137085 - TSUKANO; Jun ; et al.	2009-05-28
Semiconductor Device And Method Of Manufacturing Same App 20090072404 - Kikuchi; Katsumi ; et al.	2009-03-19
Wiring Board For Mounting Semiconductor Device, Manufacturing Method Of The Same, And Wiring Board Assembly App 20090046441 - Funaya; Takuo ; et al.	2009-02-19
Semiconductor Device And Method Of Manufacturing Same App 20090026636 - MURAI; Hideya ; et al.	2009-01-29
Semiconductor Package and Method for Producing Same App 20090001604 - Tanaka; Daisuke ; et al.	2009-01-01
Semiconductor Device And Method For Manufacturing Same App 20080303136 - Mori; Kentaro ; et al.	2008-12-11
Semiconductor Device And Fabrication Method App 20080284001 - Mori; Kentaro ; et al.	2008-11-20
Semiconductor device and method of manufacturing the same App 20080136020 - Soejima; Koji ; et al.	2008-06-12
Semiconductor device Grant 7,348,673 - Kikuchi , et al. March 25, 2	2008-03-25
Method For Fabricating A Metal-insulator-metal (mim) Capacitor Having Capacitor Dielectric Layer Formed By Atomic Layer Deposition (ald) App 20080064147 - IIZUKA; Toshihiro ; et al.	2008-03-13
Wiring substrate, semiconductor device, and method of manufacturing the same App 20080012140 - Tsukano; Jun ; et al.	2008-01-17
Method for fabricating a metal insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD) App 20070152256 - Iizuka; Toshihiro ; et al.	2007-07-05
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same App 20070079986 - Kikuchi; Katsumi ; et al.	2007-04-12
Wiring board, semiconductor device, and method of manufacturing the same App 20070079987 - Yamamichi; Shintaro ; et al.	2007-04-12
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same App 20070080439 - Kikuchi; Katsumi ; et al.	2007-04-12
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ; et al.	2006-12-21
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ; et al.	2006-12-21
Interconnecting substrate and semiconductor device App 20060192287 - Ogawa; Kenta ; et al.	2006-08-31
Semiconductor device App 20060012029 - Kikuchi; Katsumi ; et al.	2006-01-19
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package App 20060012048 - Murai; Hideya ; et al.	2006-01-19
Semiconductor device with decoupling capacitors mounted on conductors Grant 6,949,815 - Yamazaki , et al. September 27, 2	2005-09-27
Semiconductor device having a thin film capacitor and method for fabricating the same App 20050051824 - Iizuka, Toshihiro ; et al.	2005-03-10
Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same Grant 6,818,469 - Mori , et al. November 16, 2	2004-11-16
Semiconductor device and method for packaging same App 20040135264 - Yamazaki, Takao ; et al.	2004-07-15
Semiconductor device and method for packaging same Grant 6,703,705 - Yamazaki , et al. March 9, 2	2004-03-09
Thin film capacitor, method for manufacturing the same and printed circuit board incorporating the same App 20030219956 - Mori, Toru ; et al.	2003-11-27
Semiconductor device, and thin film capacitor Grant 6,524,905 - Yamamichi , et al. February 25, 2	2003-02-25
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same Grant 6,515,324 - Shibuya , et al. February 4, 2	2003-02-04
Semiconductor device having a thin film capacitor and method for fabricating the same App 20020190294 - Iizuka, Toshihiro ; et al.	2002-12-19
Semiconductor memory device and method of manufacturing the same App 20020175358 - Yamamichi, Shintaro	2002-11-28
Semiconductor device and method for packaging same App 20020074643 - Yamazaki, Takao ; et al.	2002-06-20
Capacitor, capacitor mounting structure, method for manufacturing same, semiconductor device, and method for manufacturing same App 20020070400 - Shibuya, Akinobu ; et al.	2002-06-13
Semiconductor device, manufacturing method therefor, and thin film capacitor App 20020025623 - Yamamichi, Shintaro ; et al.	2002-02-28
Multilayer capacitor, semiconductor device, and electrical circuit board App 20020017700 - Mori, Toru ; et al.	2002-02-14
Thin film capacitor and method of fabricating the same App 20020001165 - Yamamichi, Shintaro	2002-01-03
Semiconductor Memory Device And Method Of Manufacturing The Same App 20020000590 - YAMAMICHI, SHINTARO	2002-01-03
Method of manufacturing thin film capacitor Grant 6,225,133 - Yamamichi , et al. May 1, 2	2001-05-01
Method of forming highly-integrated thin film capacitor with high dielectric constant layer Grant 5,943,547 - Yamamichi , et al. August 24, 1	1999-08-24
Semiconductor device having a thin film capacitor and a resistance measuring element Grant 5,847,423 - Yamamichi December 8, 1	1998-12-08
Thin film capacitor with small leakage current and method for fabricating the same Grant 5,530,279 - Yamamichi , et al. June 25, 1	1996-06-25
Method for fabricating a thin film capacitor Grant 5,366,920 - Yamamichi , et al. November 22, 1	1994-11-22
Thin film capacitor Grant 5,262,920 - Sakuma , et al. November 16, 1	1993-11-16

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