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Yamakawa; Yumika Patent Filings

Yamakawa; Yumika

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamakawa; Yumika.The latest application filed is for "method of evaluating skin conditions and method of estimating skin thickness".

Company Profile
0.1.2
  • Yamakawa; Yumika - Yokohama JP
  • Yamakawa; Yumika - Yokohama-shi JP
  • Yamakawa; Yumika - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of evaluating skin conditions and method of estimating skin thickness
Grant 7,820,972 - Miyamae , et al. October 26, 2
2010-10-26
Method Of Evaluating Skin Conditions And Method Of Estimating Skin Thickness
App 20090134331 - Miyamae; Yuta ;   et al.
2009-05-28
Method of judging degree of hair damage
App 20060281994 - Miyamae; Yuta ;   et al.
2006-12-14

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