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Patent applications and USPTO patent grants for YAMAHA; Takashi.The latest application filed is for "electrical overlay measurement methods and structures for wafer-to-wafer bonding".
Patent | Date |
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Electrical Overlay Measurement Methods And Structures For Wafer-to-wafer Bonding App 20220285234 - YOKOMIZO; Ikue ;   et al. | 2022-09-08 |
Bonded Assembly Containing Side Bonding Structures And Methods Of Manufacturing The Same App 20200321324 - Sano; Michiaki ;   et al. | 2020-10-08 |
Bonded assembly containing side bonding structures and methods of manufacturing the same Grant 10,797,035 - Sano , et al. October 6, 2 | 2020-10-06 |
Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer Grant 10,790,296 - Yamaha , et al. September 29, 2 | 2020-09-29 |
Three-dimensional Modeling Apparatus, Three-dimensional Modeling Method And Computer-readable Recording Medium Storing Three-dimensional Modeling Program App 20120257016 - NAKAJIMA; Mitsuyasu ;   et al. | 2012-10-11 |
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