YAMAGUCHI; Shun
Patent Applications and Registrations
Patent applications and USPTO patent grants for YAMAGUCHI; Shun.The latest application filed is for "copper-clad laminate, wiring board, and copper foil provided with resin".
- YAMAGUCHI; Shun - Fukushima JP
- Yamaguchi; Shun - Matsumoto JP
- YAMAGUCHI; Shun - Matsumoto-city JP
- Yamaguchi; Shun - Hyogo JP
| Patent | Date |
|---|---|
| Copper-clad Laminate, Wiring Board, And Copper Foil Provided With Resin App 20220015230 - INOUE; Yuki ; et al. | 2022-01-13 |
| Metal-clad Laminate, Wiring Board, Metal Foil Provided With Resin, And Resin Composition App 20210395452 - ARISAWA; Tatsuya ; et al. | 2021-12-23 |
| Semiconductor device manufacturing method Grant 9,293,564 - Nishimura , et al. March 22, 2 | 2016-03-22 |
| Semiconductor Device Manufacturing Method App 20150364577 - NISHIMURA; Takeyoshi ; et al. | 2015-12-17 |
| Power source switching device and electronic appliance Grant 9,152,012 - Yamaguchi October 6, 2 | 2015-10-06 |
| Interchangeable lens and camera body to which interchangeable lens is mountable Grant 9,086,612 - Korekuni , et al. July 21, 2 | 2015-07-21 |
| Power Source Switching Device And Electronic Appliance App 20130272691 - YAMAGUCHI; SHUN | 2013-10-17 |
| Interchangeable Lens And Camera Body To Which Interchangeable Lens Is Mountable App 20130088632 - KOREKUNI; Jin ; et al. | 2013-04-11 |
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