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Patent applications and USPTO patent grants for YAMAGISHI; TETSUTO.The latest application filed is for "semiconductor device".
Patent | Date |
---|---|
Semiconductor Device App 20210233871 - KAIZU; RYOICHI ;   et al. | 2021-07-29 |
Electronic device having sealed heat-generation element Grant 10,109,557 - Yamagishi , et al. October 23, 2 | 2018-10-23 |
Method for manufacturing electronic device, and electronic device Grant 9,832,872 - Yamagishi , et al. November 28, 2 | 2017-11-28 |
Electronic Device App 20170330818 - YAMAGISHI; Tetsuto ;   et al. | 2017-11-16 |
Method For Manufacturing Electronic Device, And Electronic Device App 20170135210 - YAMAGISHI; Tetsuto ;   et al. | 2017-05-11 |
Half-mold type mold package Grant 9,601,442 - Oka , et al. March 21, 2 | 2017-03-21 |
Mold Package App 20160293555 - OKA; Kengo ;   et al. | 2016-10-06 |
Semiconductor device with resin mold Grant 9,087,924 - Yamagishi , et al. July 21, 2 | 2015-07-21 |
Semiconductor Device And Method For Manufacturing The Same App 20140217620 - YAMAGISHI; Tetsuto ;   et al. | 2014-08-07 |
Semiconductor device with resin mold Grant 8,749,055 - Yamagishi , et al. June 10, 2 | 2014-06-10 |
Semiconductor Device And Method For Manufacturing The Same App 20120223444 - YAMAGISHI; Tetsuto ;   et al. | 2012-09-06 |
Semiconductor device with resin mold Grant 8,207,607 - Yamagishi , et al. June 26, 2 | 2012-06-26 |
Semiconductor device and method for manufacturing the same App 20090152714 - Yamagishi; Tetsuto ;   et al. | 2009-06-18 |
Light element complex hydride film and method for synthesis thereof App 20070042223 - Orimo; Shin-ichi ;   et al. | 2007-02-22 |
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