Yamada; Tomiho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamada; Tomiho.The latest application filed is for "polishing cloth and method of manufacturing semiconductor device".

Company Profile

0.4.4

Yamada; Tomiho - Ohbu JP
Yamada; Tomiho - Aichi-ken JP
Yamada; Tomiho - Ohbu-shi JP
Yamada; Tomiho - Obun JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing cloth and method of manufacturing semiconductor device Grant 7,884,020 - Hirabayashi , et al. February 8, 2	2011-02-08
Prepreg and conductive layer-laminated substrate for printed wiring board Grant 7,820,274 - Ohta , et al. October 26, 2	2010-10-26
Polishing Cloth And Method Of Manufacturing Semiconductor Device App 20080032504 - HIRABAYASHI; Hideaki ; et al.	2008-02-07
Prepreg And Conductive Layer-laminated Substrate For Printed Wiring Board App 20070281566 - Ohta; Toshihiro ; et al.	2007-12-06
Resin Composition For Printed Wiring Board Film And Use Thereof App 20070281142 - Ohta; Toshihiro ; et al.	2007-12-06
Polishing cloth and method of manufacturing semiconductor device Grant 7,291,188 - Hirabayashi , et al. November 6, 2	2007-11-06
Polishing cloth and method of manufacturing semiconductor device App 20050148185 - Hirabayashi, Hideaki ; et al.	2005-07-07
Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom Grant 6,420,476 - Yamada , et al. July 16, 2	2002-07-16

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