loadpatents
name:-0.011519908905029
name:-0.0069749355316162
name:-0.0064280033111572
Yamada; Tasuku Patent Filings

Yamada; Tasuku

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamada; Tasuku.The latest application filed is for "epoxy resin composition".

Company Profile
5.6.12
  • Yamada; Tasuku - Osaka JP
  • YAMADA; Tasuku - Shiga JP
  • Yamada; Tasuku - Kariya JP
  • YAMADA; Tasuku - Kariya-city JP
  • Yamada; Tasuku - Mishima-gun Osaka
  • YAMADA; Tasuku - Kariya-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
Grant 10,961,411 - Tanikawa , et al. March 30, 2
2021-03-30
Epoxy Resin Composition
App 20210040304 - TATENO; Shiori ;   et al.
2021-02-11
Starter for internal combustion engine
Grant 10,895,238 - Fujita , et al. January 19, 2
2021-01-19
Epoxy Adhesive Composition
App 20210002528 - YAMADA; Tasuku ;   et al.
2021-01-07
Starter
Grant 10,337,482 - Fujita , et al.
2019-07-02
Curable composition for inkjet, and method for manufacturing electronic component
Grant 10,259,773 - Tanikawa , et al.
2019-04-16
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component
App 20190092963 - Tanikawa; Mitsuru ;   et al.
2019-03-28
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
Grant 10,202,519 - Tanikawa , et al. Feb
2019-02-12
Inkjet adhesive, manufacturing method for semiconductor device, and electronic component
Grant 10,066,118 - Tanikawa , et al. September 4, 2
2018-09-04
Starter For Internal Combustion Engine
App 20180149130 - FUJITA; Tatsuya ;   et al.
2018-05-31
Starter
App 20180135584 - FUJITA; Tatsuya ;   et al.
2018-05-17
Curable Composition For Inkjet, And Method For Manufacturing Electronic Component
App 20170298005 - Tanikawa; Mitsuru ;   et al.
2017-10-19
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component
App 20170233615 - Tanikawa; Mitsuru ;   et al.
2017-08-17
Inkjet Adhesive, Manufacturing Method For Semiconductor Device, And Electronic Component
App 20170233599 - Tanikawa; Mitsuru ;   et al.
2017-08-17
Starter
App 20150247483 - IMANISHI; Tomoya ;   et al.
2015-09-03
Starter
App 20150204297 - YAMADA; Tasuku ;   et al.
2015-07-23
Sealing Agent For Optical Semiconductor Devices, And Optical Semiconductor Device
App 20140175505 - Yamazaki; Ryosuke ;   et al.
2014-06-26

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