Yamada; Shingetsu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamada; Shingetsu.The latest application filed is for "metal substrate and light source device".

Company Profile

0.9.9

Yamada; Shingetsu - Nagahama N/A JP
Yamada; Shingetsu - Shiga JP
Yamada; Shingetsu - Nagahama-shi JP
Yamada; Shingetsu - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal substrate and light source device Grant 8,742,432 - Sato , et al. June 3, 2	2014-06-03
Metal Substrate And Light Source Device App 20120138990 - SATO; Yoshihito ; et al.	2012-06-07
Metal laminated body, LED-mounted substrate, and white film Grant 8,169,129 - Matsui , et al. May 1, 2	2012-05-01
Multilayer printed circuit board Grant 8,044,304 - Yamada October 25, 2	2011-10-25
Multilayer Wiring Substrate Having Cavity Portion App 20110042124 - Matsui; Jun ; et al.	2011-02-24
Metal Laminated Body, Led-mounted Substrate, And White Film App 20100301725 - Matsui; Jun ; et al.	2010-12-02
Multilayer Printed Circuit Board App 20090020319 - Yamada; Shingetsu	2009-01-22
Method of Manufacturing Multilayer Wiring Board App 20080116611 - Ogawa; Minoru ; et al.	2008-05-22
Method of manufacturing multilayer wiring board Grant 7,334,324 - Ogawa , et al. February 26, 2	2008-02-26
Semiconductor device integrated multilayer wiring board Grant 7,022,399 - Ogawa , et al. April 4, 2	2006-04-04
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board App 20050025944 - Ogawa, Minoru ; et al.	2005-02-03
Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrate Grant 6,824,884 - Taniguchi , et al. November 30, 2	2004-11-30
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board Grant 6,797,367 - Ogawa , et al. September 28, 2	2004-09-28
Polyarlketone resin film and a laminate thereof with metal App 20040096678 - Taniguchi, Kouichirou ; et al.	2004-05-20
Semiconductor device built-in multilayer wiring board and method of manufacturing same App 20030178726 - Ogawa, Minoru ; et al.	2003-09-25
Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board App 20030180510 - Ogawa, Minoru ; et al.	2003-09-25
Method of manufacturing three-dimensional printed wiring board Grant 6,499,217 - Yamada , et al. December 31, 2	2002-12-31

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