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name:-0.012526035308838
name:-0.00050187110900879
Yamada; Mitsutaka Patent Filings

Yamada; Mitsutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yamada; Mitsutaka.The latest application filed is for "immersion tank and electronic apparatus".

Company Profile
0.10.9
  • Yamada; Mitsutaka - Atsugi JP
  • Yamada; Mitsutaka - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Immersion tank and electronic apparatus
Grant 11,178,790 - Aoki , et al. November 16, 2
2021-11-16
Immersion Tank And Electronic Apparatus
App 20200337176 - AOKI; Michimasa ;   et al.
2020-10-22
Cooling jacket and electronic apparatus
Grant 10,499,542 - Takemura , et al. De
2019-12-03
Cooling Jacket And Electronic Apparatus
App 20190166720 - Takemura; Keizou ;   et al.
2019-05-30
Information processing apparatus and heat exchanger
Grant 10,108,235 - Kikuchi , et al. October 23, 2
2018-10-23
Semiconductor module and electronic device
Grant 10,083,938 - Yamada , et al. September 25, 2
2018-09-25
Information processing device and cooling unit
Grant 10,014,239 - Takemura , et al. July 3, 2
2018-07-03
Information Processing Apparatus And Heat Exchanger
App 20180113494 - Kikuchi; Shunichi ;   et al.
2018-04-26
Information Processing Device And Cooling Unit
App 20180005921 - Takemura; Keizou ;   et al.
2018-01-04
Semiconductor Module And Electronic Device
App 20170207144 - YAMADA; Mitsutaka ;   et al.
2017-07-20
Method for manufacturing component built-in substrate
Grant 9,653,380 - Suwada , et al. May 16, 2
2017-05-16
Method For Manufacturing Component Built-in Substrate
App 20160351471 - SUWADA; MAKOTO ;   et al.
2016-12-01
Heatsink And Board Unit
App 20150351283 - Yamada; Mitsutaka ;   et al.
2015-12-03
Substrate Unit And Electronic Device
App 20140340847 - IWAKIRI; Yoshihisa ;   et al.
2014-11-20
Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
Grant 6,787,711 - Kikuchi , et al. September 7, 2
2004-09-07
Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device
App 20030111262 - Kikuchi, Shunichi ;   et al.
2003-06-19
Immersion cooling coolant
Grant 6,193,905 - Yamada , et al. February 27, 2
2001-02-27
Immersion cooling coolant and electronic device using this coolant
Grant 5,349,499 - Yamada , et al. September 20, 1
1994-09-20
Production and use of coolant in cryogenic devices
Grant 5,038,571 - Yokouchi , et al. August 13, 1
1991-08-13

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