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Patent applications and USPTO patent grants for Yamada; Hirozi.The latest application filed is for "manufacturing method of electronic circuit including multilayer circuit board".
Patent | Date |
---|---|
Manufacturing method of electronic circuit including multilayer circuit board Grant 6,889,431 - Okabe , et al. May 10, 2 | 2005-05-10 |
Electronic circuit equipment using multilayer circuit board Grant 6,757,178 - Okabe , et al. June 29, 2 | 2004-06-29 |
Manufacturing method of electronic circuit including multilayer circuit board App 20030097750 - Okabe, Hiroshi ;   et al. | 2003-05-29 |
Electronic circuit equipment using multilayer circuit board App 20020118523 - Okabe, Hiroshi ;   et al. | 2002-08-29 |
DC-powered Josephson integrated circuit Grant 5,124,583 - Hatano , et al. June 23, 1 | 1992-06-23 |
Method of forming Josephson junction devices Grant 4,904,619 - Yamada , et al. February 27, 1 | 1990-02-27 |
Josephson junction element Grant 4,319,256 - Tarutani , et al. March 9, 1 | 1982-03-09 |
Method of forming a microscopic pattern Grant 4,288,283 - Umezaki , et al. September 8, 1 | 1981-09-08 |
Testing machine for tires on imitation roads Grant 3,977,243 - Yamada , et al. August 31, 1 | 1976-08-31 |
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