Yalamanchili; Madhava Rao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yalamanchili; Madhava Rao.The latest application filed is for "wafer dicing using femtosecond-based laser and plasma etch".

Company Profile

6.50.80

Yalamanchili; Madhava Rao - Morgan Hill CA
Yalamanchili; Madhava Rao - Eagle ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20210134676 - Lei; Wei-Sheng ; et al.	2021-05-06
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,910,271 - Lei , et al. February 2, 2	2021-02-02
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20200286787 - Lei; Wei-Sheng ; et al.	2020-09-10
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,714,390 - Lei , et al.	2020-07-14
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20200118880 - Lei; Wei-Sheng ; et al.	2020-04-16
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,566,238 - Lei , et al. Feb	2020-02-18
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20190088549 - Lei; Wei-Sheng ; et al.	2019-03-21
Wafer dicing using femtosecond-based laser and plasma etch Grant 10,163,713 - Lei , et al. Dec	2018-12-25
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch Grant 9,620,379 - Lei , et al. April 11, 2	2017-04-11
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20160141210 - Lei; Wei-Sheng ; et al.	2016-05-19
Water soluble mask for substrate dicing by laser and plasma etch Grant 9,263,308 - Lei , et al. February 16, 2	2016-02-16
Multi-layer Mask Including Non-photodefinable Laser Energy Absorbing Layer For Substrate Dicing By Laser And Plasma Etch App 20160035577 - LEI; Wei-Sheng ; et al.	2016-02-04
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application Grant 9,252,057 - Chowdhury , et al. February 2, 2	2016-02-02
Wafer dicing using femtosecond-based laser and plasma etch Grant 9,245,802 - Lei , et al. January 26, 2	2016-01-26
Laser and plasma etch wafer dicing using water-soluble die attach film Grant 9,224,625 - Lei , et al. December 29, 2	2015-12-29
Hybrid laser and plasma etch wafer dicing using substrate carrier Grant 9,218,992 - Singh , et al. December 22, 2	2015-12-22
Method of coating water soluble mask for laser scribing and plasma etch Grant 9,177,864 - Lei , et al. November 3, 2	2015-11-03
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch Grant 9,129,904 - Lei , et al. September 8, 2	2015-09-08
Laser and plasma etch wafer dicing using physically-removable mask Grant 9,126,285 - Lei , et al. September 8, 2	2015-09-08
Wafer dicing method for improving die packaging quality Grant 9,105,710 - Lei , et al. August 11, 2	2015-08-11
Laser Scribing And Plasma Etch For High Die Break Strength And Clean Sidewall App 20150200119 - EATON; Brad ; et al.	2015-07-16
Multi-step and asymmetrically shaped laser beam scribing Grant 9,054,176 - Lei , et al. June 9, 2	2015-06-09
Uniform masking for wafer dicing using laser and plasma etch Grant 9,048,309 - Chowdhury , et al. June 2, 2	2015-06-02
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film App 20150122419 - Chowdhury; Mohammad Kamruzzaman ; et al.	2015-05-07
Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamber Grant 9,023,227 - Dinev , et al. May 5, 2	2015-05-05
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean Grant 9,018,079 - Lei , et al. April 28, 2	2015-04-28
Laser scribing and plasma etch for high die break strength and clean sidewall Grant 8,993,414 - Eaton , et al. March 31, 2	2015-03-31
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers Grant 8,980,726 - Lei , et al. March 17, 2	2015-03-17
Wafer dicing from wafer backside Grant 8,975,162 - Lei , et al. March 10, 2	2015-03-10
Wafer Dicing Method For Improving Die Packaging Quality App 20150064878 - LEI; Wei-Sheng ; et al.	2015-03-05
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film Grant 8,969,177 - Chowdhury , et al. March 3, 2	2015-03-03
Wafer dicing using hybrid split-beam laser scribing process with plasma etch Grant 8,951,819 - Lei , et al. February 10, 2	2015-02-10
Method And System For Laser Focus Plane Determination In A Laser Scribing Process App 20150037915 - LEI; Wei-Sheng ; et al.	2015-02-05
Laser and plasma etch wafer dicing using UV-curable adhesive film Grant 8,946,057 - Lei , et al. February 3, 2	2015-02-03
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach App 20150028446 - Lei; Wei-Sheng ; et al.	2015-01-29
Laser Scribing And Plasma Etch For High Die Break Strength And Smooth Sidewall App 20150011073 - Lei; Wei-Sheng ; et al.	2015-01-08
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch App 20140377937 - Lei; Wei-Sheng ; et al.	2014-12-25
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20140367041 - Lei; Wei-Sheng ; et al.	2014-12-18
Hybrid laser and plasma etch wafer dicing using substrate carrier Grant 8,912,077 - Singh , et al. December 16, 2	2014-12-16
Laser, Plasma Etch, And Backside Grind Process For Wafer Dicing App 20140363952 - Lei; Wei-Sheng ; et al.	2014-12-11
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach App 20140346641 - Lei; Wei-Sheng ; et al.	2014-11-27
Methods For Etching A Substrate App 20140335679 - LIU; TONG ; et al.	2014-11-13
Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach Grant 8,883,614 - Lei , et al. November 11, 2	2014-11-11
Method of coating water soluble mask for laser scribing and plasma etch Grant 8,859,397 - Lei , et al. October 14, 2	2014-10-14
Wafer dicing using femtosecond-based laser and plasma etch Grant 8,853,056 - Lei , et al. October 7, 2	2014-10-07
Wafer dicing using hybrid multi-step laser scribing process with plasma etch Grant 8,846,498 - Lei , et al. September 30, 2	2014-09-30
Laser, plasma etch, and backside grind process for wafer dicing Grant 8,845,854 - Lei , et al. September 30, 2	2014-09-30
Passive Control For Through Silicon Via Tilt In Icp Chamber App 20140273460 - REYLAND; David ; et al.	2014-09-18
Substrate Laser Dicing Mask Including Laser Energy Absorbing Water-soluble Film App 20140273401 - LEI; Wei-Sheng ; et al.	2014-09-18
Substrate Dicing By Laser Ablation & Plasma Etch Damage Removal For Ultra-thin Wafers App 20140213042 - LEI; Wei-Sheng ; et al.	2014-07-31
Methods For Performing A Via Reveal Etching Process For Forming Through-silicon Vias In A Substrate App 20140199833 - MISHRA; Rohit ; et al.	2014-07-17
Wafer Dicing From Wafer Backside App 20140179084 - Lei; Wei-Sheng ; et al.	2014-06-26
Wafer Edge Protection and Efficiency Using Inert Gas and Ring App 20140179108 - Le; Dung Huu ; et al.	2014-06-26
Water Soluble Mask For Substrate Dicing By Laser And Plasma Etch App 20140174659 - Lei; Wei-Sheng ; et al.	2014-06-26
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier App 20140144585 - Singh; Saravjeet ; et al.	2014-05-29
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20140120697 - Lei; Wei-Sheng ; et al.	2014-05-01
Wafer Dicing Using Hybrid Multi-step Laser Scribing Process With Plasma Etch App 20140120698 - Lei; Wei-Sheng ; et al.	2014-05-01
Water soluble mask for substrate dicing by laser and plasma etch Grant 8,703,581 - Lei , et al. April 22, 2	2014-04-22
Laser And Plasma Etch Wafer Dicing With Partial Pre-curing Of Uv Release Dicing Tape For Film Frame Wafer Application App 20140106542 - CHOWDHURY; Mohammad Kamruzzaman ; et al.	2014-04-17
In-situ Deposited Mask Layer For Device Singulation By Laser Scribing And Plasma Etch App 20140065797 - Yalamanchili; Madhava Rao ; et al.	2014-03-06
Wafer dicing used hybrid multi-step laser scribing process with plasma etch Grant 8,652,940 - Lei , et al. February 18, 2	2014-02-18
Wafer dicing using femtosecond-based laser and plasma etch Grant 8,642,448 - Lei , et al. February 4, 2	2014-02-04
Uniform Masking For Wafer Dicing Using Laser And Plasma Etch App 20140017879 - Chowdhury; Mohammad Kamruzzaman ; et al.	2014-01-16
Laser Scribing And Plasma Etch For High Die Break Strength And Clean Sidewall App 20140017881 - EATON; Brad ; et al.	2014-01-16
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch App 20140017882 - Lei; Wei-Sheng ; et al.	2014-01-16
Laser, Plasma Etch, And Backside Grind Process For Wafer Dicing App 20140017880 - LEI; Wei-Sheng ; et al.	2014-01-16
Multi-step And Asymmetrically Shaped Laser Beam Scribing App 20140011338 - Lei; Wei-Sheng ; et al.	2014-01-09
Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-curable Adhesive Film App 20140004685 - CHOWDHURY; Mohammad Kamruzzaman ; et al.	2014-01-02
In-situ deposited mask layer for device singulation by laser scribing and plasma etch Grant 8,598,016 - Yalamanchili , et al. December 3, 2	2013-12-03
Laser And Plasma Etch Wafer Dicing Using Water-soluble Die Attach Film App 20130299088 - Lei; Wei-Sheng ; et al.	2013-11-14
Methods For Fabricating Dual Damascene Interconnect Structures App 20130288474 - MISHRA; ROHIT ; et al.	2013-10-31
Laser And Plasma Etch Wafer Dicing Using Uv-curable Adhesive Film App 20130280890 - Lei; Wei-Sheng ; et al.	2013-10-24
Multi-step and asymmetrically shaped laser beam scribing Grant 8,557,683 - Lei , et al. October 15, 2	2013-10-15
Wafer Dicing Using Hybrid Multi-step Laser Scribing Process With Plasma Etch App 20130267076 - Lei; Wei-Sheng ; et al.	2013-10-10
Laser and plasma etch wafer dicing using water-soluble die attach film Grant 8,507,363 - Lei , et al. August 13, 2	2013-08-13
Wafer Dicing Using Hybrid Split-beam Laser Scribing Process With Plasma Etch App 20130017668 - Lei; Wei-Sheng ; et al.	2013-01-17
Increased Deposition Efficiency And Higher Chamber Conductance With Source Power Increase In An Inductively Coupled Plasma (icp) Chamber App 20130005152 - DINEV; JIVKO ; et al.	2013-01-03
Water Soluble Mask For Substrate Dicing By Laser And Plasma Etch App 20120322233 - LEI; Wei-Sheng ; et al.	2012-12-20
Laser And Plasma Etch Wafer Dicing Using Water-soluble Die Attach Film App 20120322238 - Lei; Wei-Sheng ; et al.	2012-12-20
Multi-step And Asymmetrically Shaped Laser Beam Scribing App 20120322242 - LEI; Wei-Sheng ; et al.	2012-12-20
Wafer Dicing Using Hybrid Galvanic Laser Scribing Process With Plasma Etch App 20120322235 - Lei; Wei-Sheng ; et al.	2012-12-20
In-situ Deposited Mask Layer For Device Singulation By Laser Scribing And Plasma Etch App 20120322234 - YALAMANCHILI; Madhava Rao ; et al.	2012-12-20
Laser And Plasma Etch Wafer Dicing Using Physically-removable Mask App 20120322237 - Lei; Wei-Sheng ; et al.	2012-12-20
Hybrid Laser And Plasma Etch Wafer Dicing Using Substrate Carrier App 20120322239 - Singh; Saravjeet ; et al.	2012-12-20
Wafer Dicing Using Pulse Train Laser With Multiple-pulse Bursts And Plasma Etch App 20120322236 - Lei; Wei-Sheng ; et al.	2012-12-20
Wafer Dicing Using Femtosecond-based Laser And Plasma Etch App 20110312157 - Lei; Wei-Sheng ; et al.	2011-12-22
Advanced cleaning process using integrated momentum transfer and controlled cavitation App 20090255555 - Gouk; Roman ; et al.	2009-10-15
Ipa Delivery System For Drying App 20080163900 - RICHARDS; DOUGLAS ; et al.	2008-07-10
Tunable Megasonics Cavitation Process Using Multiple Transducers For Cleaning Nanometer Particles Without Structure Damage App 20080163890 - ROSATO; JOHN J. ; et al.	2008-07-10

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