Yakobson; Eric
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yakobson; Eric.The latest application filed is for "method and wet chemical compositions for diffusion barrier formation".
- Yakobson; Eric - East Haven CT
- Yakobson; Eric - Cheshire CT
- Yakobson; Eric - Aliso Viego CA
- Yakobson; Eric - Aliso Viejo CA
- Yakobson; Eric - Irvine CA
- Yakobson; Eric - San Juan Capistrano CA
- Yakobson; Eric - Waterbury CT
| Patent | Date |
|---|---|
| Method and Wet Chemical Compositions for Diffusion Barrier Formation App 20220259724 - Hurtubise; Richard W. ; et al. | 2022-08-18 |
| Cobalt filling of interconnects Grant 11,401,618 - Commander , et al. August 2, 2 | 2022-08-02 |
| Composition and Method for Fabrication of Nickel Interconnects App 20220064811 - Yakobson; Eric ; et al. | 2022-03-03 |
| Cobalt Filling of Interconnects App 20210332491 - Commander; John ; et al. | 2021-10-28 |
| Cobalt filling of interconnects Grant 11,035,048 - Commander , et al. June 15, 2 | 2021-06-15 |
| Cobalt Filling of Interconnects App 20190010624 - Commander; John ; et al. | 2019-01-10 |
| Method for enhancing the solderability of a surface Grant RE45,881 - Redline , et al. February 9, 2 | 2016-02-09 |
| Method for enhancing the solderability of a surface Grant RE45,842 - Redline , et al. January 12, 2 | 2016-01-12 |
| Adhesion promotion in printed circuit boards Grant 9,040,117 - Owei , et al. May 26, 2 | 2015-05-26 |
| Method for enhancing the solderability of a surface Grant RE45,297 - Redline , et al. December 23, 2 | 2014-12-23 |
| High Speed Copper Plating Process App 20140256083 - Yakobson; Eric ; et al. | 2014-09-11 |
| Adhesion Promotion In Printed Circuit Boards App 20130078367 - Owei; Abayomi I. ; et al. | 2013-03-28 |
| Adhesion promotion in printed circuit boards Grant 8,142,840 - Owei , et al. March 27, 2 | 2012-03-27 |
| Adhesion promotion in printed circuit boards Grant 7,682,432 - Owei , et al. March 23, 2 | 2010-03-23 |
| Capping of metal interconnects in integrated circuit electronic devices Grant 7,393,781 - Yakobson , et al. July 1, 2 | 2008-07-01 |
| Cobalt and nickel electroless plating in microelectronic devices Grant 7,332,193 - Valverde , et al. February 19, 2 | 2008-02-19 |
| Capping Of Metal Interconnects In Integrated Circuit Electronic Devices App 20070298609 - Yakobson; Eric ; et al. | 2007-12-27 |
| Adhesion Promotion In Printed Circuit Boards App 20070227625 - Owei; Abayomi I. ; et al. | 2007-10-04 |
| Adhesion Promotion In Printed Circuit Boards App 20070228333 - Owei; Abayomi I. ; et al. | 2007-10-04 |
| Capping of metal interconnects in integrated circuit electronic devices Grant 7,268,074 - Yakobson , et al. September 11, 2 | 2007-09-11 |
| Adhesion promotion in printed circuit boards Grant 7,232,478 - Owei , et al. June 19, 2 | 2007-06-19 |
| Cobalt and nickel electroless plating in microelectronic devices App 20060083850 - Valverde; Charles ; et al. | 2006-04-20 |
| Capping of metal interconnects in integrated circuit electronic devices App 20050275100 - Yakobson, Eric ; et al. | 2005-12-15 |
| Adhesion promotion in printed circuit boards App 20050011400 - Owei, Abayomi I. ; et al. | 2005-01-20 |
| Post-treatment for copper on printed circuit boards Grant 6,294,220 - McGrath , et al. September 25, 2 | 2001-09-25 |
| Method for enhancing the solderability of a surface Grant 5,935,640 - Ferrier , et al. August 10, 1 | 1999-08-10 |
| Process for preparing a non-conductive substrate for electroplating Grant 5,759,378 - Ferrier , et al. June 2, 1 | 1998-06-02 |
| Method for enhancing the solderability of a surface Grant 5,733,599 - Ferrier , et al. March 31, 1 | 1998-03-31 |
| Process for preparing a non-conductive substrate for electroplating Grant 5,632,927 - Ferrier , et al. May 27, 1 | 1997-05-27 |
| Process for preparing a non-conductive substrate for electroplating Grant 5,536,386 - Ferrier , et al. July 16, 1 | 1996-07-16 |
| Composition and method for selective plating Grant 5,518,760 - Ferrier , et al. May 21, 1 | 1996-05-21 |
| Composition and method for selective plating Grant 5,468,515 - Ferrier , et al. November 21, 1 | 1995-11-21 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 