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Patent applications and USPTO patent grants for YAJIMA; TOSHIYASU.The latest application filed is for "surface plate for polishing device, and polishing device and polishing method".
Patent | Date |
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Surface Plate For Polishing Device, And Polishing Device And Polishing Method App 20220063052 - IIDA; MATSUO ;   et al. | 2022-03-03 |
Method For Polishing Using Polishing Pad Provided With Adsorption Layer App 20200147749 - YAJIMA; TOSHIYASU ;   et al. | 2020-05-14 |
Holding pad Grant 10,449,653 - Yajima , et al. Oc | 2019-10-22 |
Holding Pad App 20170259397 - YAJIMA; TOSHIYASU ;   et al. | 2017-09-14 |
Polishing pad Grant 8,430,719 - Katayama , et al. April 30, 2 | 2013-04-30 |
Polishing Pad App 20120196515 - KATAYAMA; Takashi ;   et al. | 2012-08-02 |
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