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Yajima; Toshikazu Patent Filings

Yajima; Toshikazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yajima; Toshikazu.The latest application filed is for "substrate holder, plating apparatus, and plating method".

Company Profile
1.4.3
  • Yajima; Toshikazu - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate holder, plating apparatus, and plating method
Grant 10,316,425 - Yajima , et al.
2019-06-11
Substrate Holder, Plating Apparatus, And Plating Method
App 20150247253 - YAJIMA; Toshikazu ;   et al.
2015-09-03
Electrical contact for use in a plating apparatus
Grant D719,101 - Kimura , et al. December 9, 2
2014-12-09
Electrical contact for use in a plating apparatus
Grant D717,736 - Kimura , et al. November 18, 2
2014-11-18
Electrical contact for use in a plating apparatus
Grant D706,224 - Kimura , et al. June 3, 2
2014-06-03
Plating apparatus
App 20090218231 - Yajima; Toshikazu ;   et al.
2009-09-03
Plating device
App 20040262150 - Yajima, Toshikazu ;   et al.
2004-12-30

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