Yaguchi; Akihiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yaguchi; Akihiro.The latest application filed is for "physical-quantity detection device".
Company Profile
0.43.18
- Yaguchi; Akihiro - Hitachinaka JP
- YAGUCHI; Akihiro - Hitachinaka-shi JP
- Yaguchi; Akihiro - Kasama N/A JP
- Yaguchi; Akihiro - Tsuchiura JP
- Yaguchi; Akihiro - Iwama JP
- Yaguchi; Akihiro - Chiyoda-mura JP
- Yaguchi; Akihiro - Ibaraki-ken JP
- Yaguchi, Akihiro - Niihari-gun JP
- Yaguchi; Akihiro - Iwama-machi JP
- Yaguchi; Akihiro - Chiyoda-machi JP
- Yaguchi; Akihiro - Shimoinayoshi JP
- Yaguchi; Akihiro - Ibaraki JP
- Yaguchi; Akihiro - Niihari JP
- Yaguchi; Akihiro - Chiyoda JP
Patent Activity
| Patent | Date |
|---|---|
| Physical-quantity detection device Grant 11,231,307 - Uenodan , et al. January 25, 2 | 2022-01-25 |
| Physical-quantity Detection Device App 20210239500 - UENODAN; Akira ; et al. | 2021-08-05 |
| Transfer mold type sensor device Grant 9,964,560 - Yaguchi , et al. May 8, 2 | 2018-05-08 |
| Resin-Sealed Sensor Device App 20160146849 - YAGUCHI; Akihiro ; et al. | 2016-05-26 |
| Transfer Mold Type Sensor Device App 20160131678 - YAGUCHI; Akihiro ; et al. | 2016-05-12 |
| Cable connection structure and cable connection method Grant 8,878,062 - Tanaka , et al. November 4, 2 | 2014-11-04 |
| Flat Wiring Material And Mounting Body Using The Same App 20130192887 - YAGUCHI; Akihiro ; et al. | 2013-08-01 |
| Flat cable and connection structure between flat cable and printed wiring board Grant 8,308,503 - Yaguchi , et al. November 13, 2 | 2012-11-13 |
| Flat Cable And Connection Structure Between Flat Cable And Printed Wiring Board App 20120276772 - Yaguchi; Akihiro ; et al. | 2012-11-01 |
| Flat cable and connection structure between flat cable and printed wiring board Grant 8,282,412 - Yaguchi , et al. October 9, 2 | 2012-10-09 |
| Flat cable and connection structure between flat cable and printed wiring board App 20120184130 - Yaguchi; Akihiro ; et al. | 2012-07-19 |
| Cable connection structure and cable connection method App 20110306235 - Tanaka; Kotaro ; et al. | 2011-12-15 |
| Method for manufacturing semiconductor device Grant 7,572,674 - Nagano , et al. August 11, 2 | 2009-08-11 |
| Multi-chip module Grant 7,388,295 - Kazama , et al. June 17, 2 | 2008-06-17 |
| Multi-chip module App 20060125116 - Kazama; Atsushi ; et al. | 2006-06-15 |
| Multi-chip module Grant 7,038,322 - Kazama , et al. May 2, 2 | 2006-05-02 |
| Method for manufacturing semiconductor device App 20050227384 - Nagano, Kouta ; et al. | 2005-10-13 |
| Semiconductor device provided with rewiring layer Grant 6,927,489 - Yaguchi , et al. August 9, 2 | 2005-08-09 |
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Multi-chip module App 20050029674 - Kazama, Atsushi ; et al. | 2005-02-10 |
| Semiconductor device and lead frame therefor Grant 6,844,219 - Kitano , et al. January 18, 2 | 2005-01-18 |
| Multi-chip module Grant 6,777,816 - Kazama , et al. August 17, 2 | 2004-08-17 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Multi-chip Module App 20040108579 - Kazama, Atsushi ; et al. | 2004-06-10 |
| Semiconductor device and mounted semiconductor device structure App 20040087130 - Kazama, Atsushi ; et al. | 2004-05-06 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Multi-chip module Grant 6,696,765 - Kazama , et al. February 24, 2 | 2004-02-24 |
| Semiconductor device and mounted semiconductor device structure Grant 6,639,315 - Kazama , et al. October 28, 2 | 2003-10-28 |
| Semiconductor apparatus having stress cushioning layer Grant 6,621,154 - Satoh , et al. September 16, 2 | 2003-09-16 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Multi-chip module App 20030094702 - Kazama, Atsushi ; et al. | 2003-05-22 |
| Semiconductor device App 20020056561 - Yaguchi, Akihiro ; et al. | 2002-05-16 |
| Lead frame and semiconductor device Grant RE37,690 - Kitano , et al. May 7, 2 | 2002-05-07 |
| Semiconductor device and mounted semiconductor device structure App 20020034872 - Kazama, Atsushi ; et al. | 2002-03-21 |
| Semiconductor device Grant 6,340,793 - Yaguchi , et al. January 22, 2 | 2002-01-22 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Semiconductor device Grant 6,049,128 - Kitano , et al. April 11, 2 | 2000-04-11 |
| Semiconductor device Grant 5,895,965 - Tanaka , et al. April 20, 1 | 1999-04-20 |
| Lead frame and semiconductor device encapsulated by resin Grant 5,637,914 - Tanaka , et al. June 10, 1 | 1997-06-10 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Encapsulated semiconductor device package having holes for electrically conductive material Grant 5,608,265 - Kitano , et al. March 4, 1 | 1997-03-04 |
| Plastic-molded-type semiconductor device Grant 5,539,250 - Kitano , et al. July 23, 1 | 1996-07-23 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Semiconductor leadframe and its production method and plastic encapsulated semiconductor device Grant 5,437,915 - Nishimura , et al. August 1, 1 | 1995-08-01 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Plastic encapsulated semiconductor device and lead frame Grant 5,357,139 - Yaguchi , et al. October 18, 1 | 1994-10-18 |
| Plastic sealed type semiconductor apparatus Grant 5,299,092 - Yaguchi , et al. March 29, 1 | 1994-03-29 |
| Semiconductor device with a plurality of face to face chips Grant 5,296,737 - Nishimura , et al. March 22, 1 | 1994-03-22 |
| Semiconductor device Grant 5,293,068 - Kohno , et al. * March 8, 1 | 1994-03-08 |
| Plastic encapsulated semiconductor device Grant 5,256,903 - Obata , et al. October 26, 1 | 1993-10-26 |
| Semiconductor apparatus and semiconductor package Grant 5,229,643 - Ohta , et al. July 20, 1 | 1993-07-20 |
| Semiconductor device having a particular chip pad structure Grant 5,159,434 - Kohno , et al. October 27, 1 | 1992-10-27 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
| Semiconductor device with heat transfer cap Grant 5,047,837 - Kitano , et al. September 10, 1 | 1991-09-10 |
| Lead frame and semiconductor device using the same Grant 5,041,901 - Kitano , et al. August 20, 1 | 1991-08-20 |
| Semiconductor device and method of manufacturing the same Grant 4,987,474 - Yasuhara , et al. January 22, 1 | 1991-01-22 |
| Lead frame and semiconductor device Grant 4,942,452 - Kitano , et al. July 17, 1 | 1990-07-17 |
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