Yagoura; Hideya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yagoura; Hideya.The latest application filed is for "semiconductor device".
- Yagoura; Hideya - Itami JP
- Yagoura; Hideya - Hyogo JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 5,412,157 - Yagoura , et al. May 2, 1 | 1995-05-02 |
| Laser OLB apparatus and method of mounting semiconductor device Grant 5,359,203 - Hashii , et al. October 25, 1 | 1994-10-25 |
| Tape automated bonding packaged semiconductor device incorporating a heat sink Grant 5,157,478 - Ueda , et al. October 20, 1 | 1992-10-20 |
| Carrier tape including molten resin flow path element for resin packaged semiconductor devices Grant 5,064,706 - Ueda , et al. November 12, 1 | 1991-11-12 |
| Semiconductor device Grant 5,055,912 - Murasawa , et al. October 8, 1 | 1991-10-08 |
| Semiconductor device housing with laser diode and light receiving element Grant 4,945,391 - Yagoura , et al. July 31, 1 | 1990-07-31 |
| Package structure for semiconductor device Grant 4,839,713 - Teraoka , et al. June 13, 1 | 1989-06-13 |
| Outer lead bonding device utilizing tape carriers Grant 4,826,068 - Yagoura , et al. May 2, 1 | 1989-05-02 |
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