Yabe; Atsushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Yabe; Atsushi.The latest application filed is for "receiving apparatus, transmitting apparatus, receiving method, transmitting method, communications system, and communication method".

Company Profile

0.17.16

Yabe; Atsushi - Kitaibaraki N/A JP
Yabe; Atsushi - Kawasaki N/A JP
Yabe; Atsushi - Ibaraki JP
Yabe; Atsushi - Kitaibaraki-shi JP
Yabe, Atsushi - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate and manufacturing method therefor Grant 8,736,057 - Ito , et al. May 27, 2	2014-05-27
Packet transmission method and nodes Grant 8,537,708 - Yabe , et al. September 17, 2	2013-09-17
Receiving apparatus, transmitting apparatus, receiving method, transmitting method, communications system, and communication method Grant 8,521,098 - Yabe August 27, 2	2013-08-27
Electroless copper plating solution Grant 8,404,035 - Yabe , et al. March 26, 2	2013-03-26
Plated article having metal thin film formed by electroless plating Grant 8,394,508 - Yabe , et al. March 12, 2	2013-03-12
Plated product having copper thin film formed thereon by electroless plating Grant 8,283,051 - Ito , et al. October 9, 2	2012-10-09
Substrate and manufacturing method therefor Grant 8,247,301 - Ito , et al. August 21, 2	2012-08-21
Method for electroless plating and metal-plated article Grant 8,182,873 - Imori , et al. May 22, 2	2012-05-22
Plated article having metal thin film formed by electroless plating, and manufacturing method thereof Grant 8,163,400 - Yabe , et al. April 24, 2	2012-04-24
Receiving Apparatus, Transmitting Apparatus, Receiving Method, Transmitting Method, Communications System, And Communication Method App 20110306309 - YABE; Atsushi	2011-12-15
Packet Transmission Method And Nodes App 20110211471 - YABE; Atsushi ; et al.	2011-09-01
Method of surface treatment using imidazole compound Grant 7,968,150 - Imori , et al. June 28, 2	2011-06-28
Plated Product Having Copper Thin Film Formed Thereon By Electroless Plating App 20110129688 - Ito; Junichi ; et al.	2011-06-02
Metal plating method and pretreatment agent Grant 7,867,564 - Imori , et al. January 11, 2	2011-01-11
Substrate And Manufacturing Method Therefor App 20100244259 - Ito; Junichi ; et al.	2010-09-30
Substrate And Manufacturing Method Therefor App 20100244258 - Ito; Junichi ; et al.	2010-09-30
Plated article having metal thin film formed by electroless plating, and manufacturing method thereof App 20100038111 - Yabe; Atsushi ; et al.	2010-02-18
Plated article having metal thin film formed by electroless plating, and manufacturing method thereof App 20100003539 - Yabe; Atsushi ; et al.	2010-01-07
Method of surface treatment using imidazole compound App 20090068364 - Imori; Toru ; et al.	2009-03-12
Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the method App 20080224313 - Yabe; Atsushi ; et al.	2008-09-18
Electroless copper plating solution and electroless copper plating method App 20070071904 - Yabe; Atsushi ; et al.	2007-03-29
Electroless copper plating solution App 20070042125 - Yabe; Atsushi ; et al.	2007-02-22
Electroless plating method and semiconductor wafer on which metal plating layer is formed Grant 7,179,741 - Imori , et al. February 20, 2	2007-02-20
Method for electroless plating and metal-plated article App 20060233963 - Imori; Toru ; et al.	2006-10-19
Novel imidazole alcohol compound, process for producing the same, and surface-treating agent comprising the same App 20060135584 - Imori; Toru ; et al.	2006-06-22
Method for metal plating and pre-treating agent App 20050147755 - Imori, Toru ; et al.	2005-07-07
Method of electroless plating and semiconductor wafer having metal plating layer formed thereon App 20040235294 - Imori, Toru ; et al.	2004-11-25
Communication control apparatus having a plurality of communication processing cards and controlling data output by polling App 20010013543 - Takashima, Ken ; et al.	2001-08-16

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