Xue; Yan Xun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xue; Yan Xun.The latest application filed is for "dmos fet chip scale package and method of making the same".

Company Profile

7.135.120

Xue; Yan Xun - Los Gatos CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Level Chip Scale Semiconductor Package App 20220278076 - Xue; Yan Xun ; et al.	2022-09-01
Dmos Fet Chip Scale Package And Method Of Making The Same App 20220278009 - Xue; Yan Xun ; et al.	2022-09-01
Method for semi-wafer level packaging Grant 11,430,762 - Xue , et al. August 30, 2	2022-08-30
Method For Semi-wafer Level Packaging App 20220208724 - Xue; Yan Xun ; et al.	2022-06-30
Semiconductor Package Having Wettable Lead Flank And Method Of Making The Same App 20220199425 - Xue; Yan Xun ; et al.	2022-06-23
Semiconductor package having enlarged gate pad and method of making the same Grant 11,222,858 - Xue , et al. January 11, 2	2022-01-11
Semiconductor Package Having Enlarged Gate Pad And Method Of Making The Same App 20210398926 - Xue; Yan Xun ; et al.	2021-12-23
Semiconductor Package And Method Of Making The Same App 20210343630 - Xue; Yan Xun	2021-11-04
Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the same Grant 11,094,617 - Xue August 17, 2	2021-08-17
Semiconductor package and method of making the same Grant 11,069,604 - Zhang , et al. July 20, 2	2021-07-20
Common source land grid array package Grant 10,991,680 - Xue , et al. April 27, 2	2021-04-27
Common Source Land Grid Array Package App 20210083088 - Xue; Yan Xun ; et al.	2021-03-18
Semiconductor Package And Method Of Making The Same App 20200411422 - Xue; Yan Xun	2020-12-31
Semiconductor Package And Method Of Making The Same App 20200194395 - Zhang; Xiaotian ; et al.	2020-06-18
Semiconductor Package And Method Of Making The Same App 20200194347 - Xue; Yan Xun ; et al.	2020-06-18
Method and structure for wafer level packaging with large contact area Grant 10,141,264 - Xue Nov	2018-11-27
Hybrid packaged lead frame based multi-chip semiconductor device with multiple interconnecting structures Grant 10,043,736 - Yilmaz , et al. August 7, 2	2018-08-07
Method And Structure For Wafer Level Packaging With Large Contact Area App 20180211916 - Xue; Yan Xun	2018-07-26
Semiconductor power device having single in-line lead module and method of making the same Grant 9,966,328 - Xue , et al. May 8, 2	2018-05-08
Method and structure for wafer level packaging with large contact area Grant 9,960,119 - Xue May 1, 2	2018-05-01
Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodes Grant 9,929,076 - Xue , et al. March 27, 2	2018-03-27
Semiconductor Power Device Having Single In-line Lead Module And Method Of Making The Same App 20170372987 - Xue; Yan Xun ; et al.	2017-12-28
Preparation method of a thin power device Grant 9,854,686 - Gong , et al. December 26, 2	2017-12-26
Power semiconductor package device having locking mechanism, and preparation method thereof Grant 9,786,583 - Xue , et al. October 10, 2	2017-10-10
Battery protection package and process of making the same Grant 9,768,146 - Niu , et al. September 19, 2	2017-09-19
Semiconductor power device having single in-line lead module and method of making the same Grant 9,754,864 - Xue , et al. September 5, 2	2017-09-05
Semiconductor package with small gate clip and assembly method Grant 9,679,833 - Xue , et al. June 13, 2	2017-06-13
Semiconductor device with thick bottom metal and preparation method thereof Grant 9,653,383 - Yilmaz , et al. May 16, 2	2017-05-16
Battery Protection Package And Process Of Making The Same App 20170098626 - Niu; Zhiqiang ; et al.	2017-04-06
Battery protection package and process of making the same Grant 9,564,406 - Niu , et al. February 7, 2	2017-02-07
Battery Protection Package And Process Of Making The Same App 20170033060 - Niu; Zhiqiang ; et al.	2017-02-02
Method And Structure For Wafer Level Packaging With Large Contact Area App 20170025356 - Xue; Yan Xun	2017-01-26
Semiconductor Package With Small Gate Clip And Assembly Method App 20160379918 - Xue; Yan Xun ; et al.	2016-12-29
Power Semiconductor Package Device Having Locking Mechanism, And Preparation Method Thereof App 20160379917 - Xue; Yan Xun ; et al.	2016-12-29
Wafer process for molded chip scale package (MCSP) with thick backside metallization Grant 9,520,380 - Xue , et al. December 13, 2	2016-12-13
Method and structure for wafer level packaging with large contact area Grant 9,502,268 - Xue November 22, 2	2016-11-22
Hybrid Packaged Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures App 20160315039 - Yilmaz; Hamza ; et al.	2016-10-27
Semiconductor package with small gate clip and assembly method Grant 9,472,491 - Xue , et al. October 18, 2	2016-10-18
Power device and preparation method thereof Grant 9,431,328 - Yilmaz , et al. August 30, 2	2016-08-30
Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures Grant 9,425,181 - Yilmaz , et al. August 23, 2	2016-08-23
Top exposed semiconductor chip package Grant 9,412,684 - Xue , et al. August 9, 2	2016-08-09
Power semiconductor package device having locking mechanism, and preparation method thereof Grant 9,397,029 - Xue , et al. July 19, 2	2016-07-19
Method for packaging a power device with bottom source electrode Grant 9,391,005 - Xue , et al. July 12, 2	2016-07-12
Method For Packaging A Power Device With Bottom Source Electrode App 20160155688 - Xue; Yan Xun ; et al.	2016-06-02
Power semiconductor device and the preparation method Grant 9,337,131 - Huo , et al. May 10, 2	2016-05-10
A Semiconductor Package Of A Flipped Mosfet App 20160104661 - Xue; Yan Xun ; et al.	2016-04-14
Power semiconductor device and preparation method thereof Grant 9,305,870 - Xue , et al. April 5, 2	2016-04-05
Power Semiconductor Device And The Preparation Method App 20160093560 - Huo; Yan ; et al.	2016-03-31
Semiconductor Package With Small Gate Clip And Assembly Method App 20160093559 - Xue; Yan Xun ; et al.	2016-03-31
Power device and preparation method thereof Grant 9,293,397 - Yilmaz , et al. March 22, 2	2016-03-22
Wafer Process For Molded Chip Scale Package (mcsp) With Thick Backside Metallization App 20160079203 - Xue; Yan Xun ; et al.	2016-03-17
Packaging structure of a semiconductor device Grant 9,281,265 - Ho , et al. March 8, 2	2016-03-08
Method And Structure For Wafer Level Packaging With Large Contact Area App 20160064251 - Xue; Yan Xun	2016-03-03
Power Semiconductor Device And Preparation Method Thereof App 20160056096 - Xue; Yan Xun ; et al.	2016-02-25
Semiconductor Device Employing Aluminum Alloy Lead-frame With Anodized Aluminum App 20160056098 - Xue; Yan Xun ; et al.	2016-02-25
Wafer process for molded chip scale package (MCSP) with thick backside metallization Grant 9,245,861 - Xue , et al. January 26, 2	2016-01-26
Wafer level chip scale package with exposed thick bottom metal Grant 9,224,679 - Xue December 29, 2	2015-12-29
Method and structure for wafer level packaging with large contact area Grant 9,224,669 - Xue December 29, 2	2015-12-29
Combined packaged power semiconductor device Grant 9,214,417 - Ho , et al. December 15, 2	2015-12-15
Power semiconductor device and preparation method thereof Grant 9,214,419 - Xue , et al. December 15, 2	2015-12-15
Method for preparing semiconductor devices applied in flip chip technology Grant 9,196,534 - Xue , et al. November 24, 2	2015-11-24
Stacked dual-chip packaging structure and preparation method thereof Grant 9,184,117 - Ho , et al. November 10, 2	2015-11-10
Semiconductor package with small gate clip and assembly method Grant 9,171,788 - Xue , et al. October 27, 2	2015-10-27
Stacked dual chip package having leveling projections Grant 9,165,866 - Yilmaz , et al. October 20, 2	2015-10-20
Semiconductor Device With Thick Bottom Metal And Preparation Method Thereof App 20150279766 - Yilmaz; Hamza ; et al.	2015-10-01
Multi-die power semiconductor device packaged on a lead frame unit with multiple carrier pins and a metal clip Grant 9,147,648 - Xue , et al. September 29, 2	2015-09-29
Semiconductor package with connecting plate for internal connection Grant 9,147,586 - Lu , et al. September 29, 2	2015-09-29
Semiconductor Device Employing Aluminum Alloy Lead-frame With Anodized Aluminum App 20150262925 - Xue; Yan Xun ; et al.	2015-09-17
Bottom source substrateless power MOSFET Grant 9,136,379 - Ho , et al. September 15, 2	2015-09-15
Power Semiconductor Device And Preparation Method Thereof App 20150249045 - Xue; Yan Xun ; et al.	2015-09-03
Combined Packaged Power Semiconductor Device App 20150243589 - Ho; Yueh-Se ; et al.	2015-08-27
Method of Hybrid Packaging a Lead Frame Based Multi-Chip Semiconductor Device with Multiple Interconnecting Structures App 20150236005 - Yilmaz; Hamza ; et al.	2015-08-20
Semiconductor device with thick bottom metal and preparation method thereof Grant 9,087,828 - Yilmaz , et al. July 21, 2	2015-07-21
Preparation Method Of A Thin Power Device App 20150189764 - Gong; Yuping ; et al.	2015-07-02
Method And Structure For Wafer Level Packaging With Large Contact Area App 20150162257 - Xue; Yan Xun	2015-06-11
Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures Grant 9,054,091 - Yilmaz , et al. June 9, 2	2015-06-09
Semiconductor packaging method using connecting plate for internal connection Grant 9,040,357 - Lu , et al. May 26, 2	2015-05-26
Thin power device and preparation method thereof Grant 9,006,901 - Gong , et al. April 14, 2	2015-04-14
Method For Packaging A Power Device With Bottom Source Electrode App 20150087114 - Xue; Yan Xun ; et al.	2015-03-26
Packaged power semiconductor with interconnection of dies and metal clips on lead frame Grant 8,981,539 - Xue , et al. March 17, 2	2015-03-17
Multi-Die Power Semiconductor Device Packaged On a Lead Frame Unit with Multiple Carrier Pins and a Metal Clip App 20150069590 - Xue; Yan Xun ; et al.	2015-03-12
Stacked multi-chip bottom source semiconductor device and preparation method thereof Grant 8,952,509 - Yilmaz , et al. February 10, 2	2015-02-10
Thin Power Device And Preparation Method Thereof App 20150021780 - Gong; Yuping ; et al.	2015-01-22
Packaging Structure Of A Semiconductor Device App 20150021753 - Ho; Yueh-Se ; et al.	2015-01-22
Double-side exposed semiconductor device Grant 8,933,545 - Gong , et al. January 13, 2	2015-01-13
Stacked power semiconductor device using dual lead frame Grant 8,933,518 - Xue , et al. January 13, 2	2015-01-13
Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors Grant 8,933,550 - Xue , et al. January 13, 2	2015-01-13
Wafer Level Chip Scale Package With Exposed Thick Bottom Metal App 20150001686 - Xue; Yan Xun	2015-01-01
A Semiconductor Package Of A Flipped Mosfet App 20140361418 - Xue; Yan Xun ; et al.	2014-12-11
Hybrid Packaging Multi-chip Semiconductor Device And Preparation Method Thereof App 20140361420 - Yilmaz; Hamza ; et al.	2014-12-11
Power Control Device And Preparation Method Thereof App 20140361419 - Xue; Yan Xun ; et al.	2014-12-11
Wafer level chip scale package Grant 8,890,296 - Ho , et al. November 18, 2	2014-11-18
Flip-chip semiconductor chip packing method Grant 8,877,555 - Shi , et al. November 4, 2	2014-11-04
Bottom Source Substrateless Power Mosfet App 20140319601 - Ho; Yueh-Se ; et al.	2014-10-30
Wafer Process For Molded Chip Scale Package (mcsp) With Thick Backside Metallization App 20140315350 - Xue; Yan Xun ; et al.	2014-10-23
Semiconductor package and fabrication method thereof Grant 8,865,523 - Ho , et al. October 21, 2	2014-10-21
Wafer level chip scale package with thick bottom metal exposed and preparation method thereof Grant 8,853,003 - Xue October 7, 2	2014-10-07
Manufacturing method of a semiconductor package of small footprint with a stack of lead frame die paddle sandwiched between high-side and low-side MOSFET Grant 8,841,167 - Gong , et al. September 23, 2	2014-09-23
Semiconductor Package And Fabrication Method Thereof App 20140264805 - Ho; Yueh-Se ; et al.	2014-09-18
Semiconductor Device with Thick Bottom Metal and Preparation Method Thereof App 20140264802 - Yilmaz; Hamza ; et al.	2014-09-18
Method For Preparing Semiconductor Devices Applied In Flip Chip Technology App 20140242756 - Xue; Yan Xun ; et al.	2014-08-28
Packaging method with backside wafer dicing Grant 8,785,296 - Xue , et al. July 22, 2	2014-07-22
Packaging method of molded wafer level chip scale package (WLCSP) Grant 8,778,735 - Xue , et al. July 15, 2	2014-07-15
Stacked Power Semiconductor Device Using Dual Lead Frame App 20140191334 - Xue; Yan Xun ; et al.	2014-07-10
Flip-chip Semiconductor Chip Packing Method App 20140141567 - Shi; Lei ; et al.	2014-05-22
Semiconductor packaging and fabrication method using connecting plate for internal connection Grant 8,722,466 - Lu , et al. May 13, 2	2014-05-13
Semiconductor encapsulation method Grant 8,722,468 - Xue , et al. May 13, 2	2014-05-13
Method of using bonding ball array as height keeper and paste holder in semiconductor device package Grant 8,722,467 - Shi , et al. May 13, 2	2014-05-13
Semiconductor device employing aluminum alloy lead-frame with anodized aluminum Grant 8,716,069 - Xue , et al. May 6, 2	2014-05-06
Stacked Dual-chip Packaging Structure And Preparation Method Thereof App 20140117523 - Ho; Yueh-Se ; et al.	2014-05-01
Wafer level packaging structure with large contact area and preparation method thereof Grant 8,710,648 - Xue April 29, 2	2014-04-29
Aluminum alloy lead-frame and its use in fabrication of power semiconductor package Grant 8,703,545 - Niu , et al. April 22, 2	2014-04-22
Semiconductor Device Employing Aluminum Alloy Lead-frame With Anodized Aluminum App 20140091446 - Xue; Yan Xun ; et al.	2014-04-03
Combined packaged power semiconductor device Grant 8,686,546 - Ho , et al. April 1, 2	2014-04-01
Semiconductor Packaging Method Using Connecting Plate for Internal Connection App 20140080263 - Lu; Jun ; et al.	2014-03-20
Semiconductor Package with Connecting Plate for Internal Connection App 20140070386 - Lu; Jun ; et al.	2014-03-13
Stacked Dual Chip Package Having Leveling Projections App 20140054758 - Yilmaz; Hamza ; et al.	2014-02-27
Top Exposed Semiconductor Chip Package App 20140035116 - Xue; Yan Xun ; et al.	2014-02-06
Semiconductor wafer level package (WLP) and method of manufacture thereof Grant 8,642,397 - Gong , et al. February 4, 2	2014-02-04
Wafer level package structure and the fabrication method thereof Grant 8,642,385 - Xue , et al. February 4, 2	2014-02-04
Method Of Using Bonding Ball Array As Height Keeper And Paste Holder In Semiconductor Device Package App 20140001617 - Shi; Lei ; et al.	2014-01-02
Semiconductor Encapsulation Method App 20130309816 - Xue; Yan Xun ; et al.	2013-11-21
Top exposed package and assembly method Grant 8,586,414 - Xue , et al. November 19, 2	2013-11-19
Stacked dual chip package and method of fabrication Grant 8,581,376 - Yilmaz , et al. November 12, 2	2013-11-12
Process to form semiconductor packages with external leads Grant 8,575,006 - Xue , et al. November 5, 2	2013-11-05
Bottom source power MOSFET with substrateless and manufacturing method thereof Grant 8,569,169 - Ho , et al. October 29, 2	2013-10-29
Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process Grant 8,563,417 - Lu , et al. October 22, 2	2013-10-22
Packaging method of molded wafer level chip scale package (WLCSP) Grant 8,563,361 - Xue , et al. October 22, 2	2013-10-22
Power device with bottom source electrode Grant 8,564,110 - Xue , et al. October 22, 2	2013-10-22
Aluminum Alloy Lead-frame And Its Use In Fabrication Of Power Semiconductor Package App 20130221507 - Niu; Zhiqiang ; et al.	2013-08-29
Semiconductor encapsulation and method thereof Grant 8,519,525 - Xue , et al. August 27, 2	2013-08-27
Semiconductor package of small footprint with a stack of lead frame die paddle sandwich between high-side and low-side MOSFETs and manufacturing method Grant 8,519,520 - Gong , et al. August 27, 2	2013-08-27
Packaging Method With Backside Wafer Dicing App 20130210215 - Xue; Yan Xun ; et al.	2013-08-15
Packaging Method Of Molded Wafer Level Chip Scale Package (wlcsp) App 20130210195 - Xue; Yan Xun ; et al.	2013-08-15
Semiconductor package of a flipped MOSFET and its manufacturing method Grant 8,481,368 - Xue , et al. July 9, 2	2013-07-09
Metal oxide semiconductor field effect transistor integrating a capacitor Grant 8,482,048 - Xue , et al. July 9, 2	2013-07-09
Package structure for DC-DC converter Grant 8,476,752 - Ho , et al. July 2, 2	2013-07-02
Wafer Level Chip Scale Package App 20130134502 - Ho; Yueh-Se ; et al.	2013-05-30
Double-side exposed semiconductor device and its manufacturing method Grant 8,450,152 - Gong , et al. May 28, 2	2013-05-28
Method For Packaging Ultra-thin Chip With Solder Ball Thermo-compression In Wafer Level Packaging Process App 20130130443 - Lu; Jun ; et al.	2013-05-23
Stacked power semiconductor device using dual lead frame and manufacturing method Grant 8,436,429 - Xue , et al. May 7, 2	2013-05-07
Semiconductor package for forming a leadframe package Grant 8,431,993 - Xue , et al. April 30, 2	2013-04-30
Semiconductor Package With High-side And Low-side Mosfets And Manufacturing Method App 20130075884 - Gong; YuPing ; et al.	2013-03-28
Wafer Level Package Structure And The Fabrication Method Thereof App 20130037935 - Xue; Yan Xun ; et al.	2013-02-14
Wafer Level Chip Scale Package With Thick Bottom Metal Exposed And Preparation Method Thereof App 20130037917 - Xue; Yan Xun	2013-02-14
Wafer Level Packaging Structure With Large Contact Area And Preparation Method Thereof App 20130037962 - Xue; Yan Xun	2013-02-14
Double-side Exposed Semiconductor Device And Its Manufacturing Method App 20130026615 - Gong; Yuping ; et al.	2013-01-31
Wafer level chip scale package Grant 8,362,606 - Ho , et al. January 29, 2	2013-01-29
Chip-exposed semiconductor device Grant 8,344,499 - Gong , et al. January 1, 2	2013-01-01
Power semiconductor device package method Grant 8,338,232 - Shi , et al. December 25, 2	2012-12-25
Stacked Power Semiconductor Device Using Dual Lead Frame And Manufacturing Method App 20120299119 - Xue; Yan Xun ; et al.	2012-11-29
Method of making a copper wire bond package Grant 8,283,212 - Xue , et al. October 9, 2	2012-10-09
Package Structure For Dc-dc Converter App 20120248593 - Ho; Yueh-Se ; et al.	2012-10-04
Power Device With Bottom Source Electrode And Preparation Method App 20120235289 - Xue; Yan Xun ; et al.	2012-09-20
Method of integrating a MOSFET with a capacitor Grant 8,247,288 - Xue , et al. August 21, 2	2012-08-21
Structure of Mixed Semiconductor Encapsulation Structure with Multiple Chips and Capacitors App 20120193695 - Xue; Yan Xun ; et al.	2012-08-02
Chip-Exposed Semiconductor Device App 20120175706 - Gong; Yuping ; et al.	2012-07-12
Package structure for DC-DC converter Grant 8,217,503 - Ho , et al. July 10, 2	2012-07-10
Power Semiconductor Device Package Method App 20120164793 - Shi; Lei ; et al.	2012-06-28
Method Of Making A Copper Wire Bond Package App 20120164794 - Xue; Yan Xun ; et al.	2012-06-28
Top exposed Package and Assembly Method App 20120146202 - Xue; Yan Xun ; et al.	2012-06-14
Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors Grant 8,178,954 - Xue , et al. May 15, 2	2012-05-15
Chip-exposed semiconductor device and its packaging method Grant 8,163,601 - Gong , et al. April 24, 2	2012-04-24
Package Structure for DC-DC Converter App 20120061813 - Ho; Yueh-Se ; et al.	2012-03-15
Semiconductor package for forming a leadframe package App 20120049336 - Xue; Yan Xun ; et al.	2012-03-01
Bottom Source Power Mosfet With Substrateless And Manufacturing Method Thereof App 20120032259 - Ho; Yueh-Se ; et al.	2012-02-09
Semiconductor Encapsulation And Method Thereof App 20120025360 - Xue; Yan Xun ; et al.	2012-02-02
Wafer Level Chip Scale Package App 20120025298 - Ho; Yueh-Se ; et al.	2012-02-02
Combined Packaged Power Semiconductor Device App 20110309454 - Ho; Yueh-Se ; et al.	2011-12-22
Method of attaching an interconnection plate to a semiconductor die within a leadframe package Grant 8,076,183 - Xue , et al. December 13, 2	2011-12-13
Chip-Exposed Semiconductor Device and Its Packaging Method App 20110284997 - Gong; Yuping ; et al.	2011-11-24
Stacked Dual Chip Package And Method Of Fabrication App 20110227207 - Yilmaz; Hamza ; et al.	2011-09-22
Semiconductor Packaging and Fabrication Method Using Connecting Plate for Internal Connection App 20110221008 - Lu; Jun ; et al.	2011-09-15
Semiconductor Package Of A Flipped Mosfet And Its Manufacturing Method App 20110193208 - Xue; Yan Xun ; et al.	2011-08-11
Process to form semiconductor packages with external leads App 20110129961 - Xue; Yan Xun ; et al.	2011-06-02
Method of Attaching an Interconnection Plate to a Semiconductor Die within a Leadframe Package App 20110095409 - Xue; Yan Xun ; et al.	2011-04-28
Metal Oxide Semiconductor Field Effect Transistor Integrating a Capacitor App 20110062506 - Xue; Yan Xun ; et al.	2011-03-17
Method of Integrating a MOSFET with a Capacitor App 20110059593 - Xue; Yan Xun ; et al.	2011-03-10
Structure of Mixed Semiconductor Encapsulation Structure with Multiple Chips and Capacitors App 20110024884 - Xue; Yan Xun ; et al.	2011-02-03