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Patent applications and USPTO patent grants for Xue; Xiaojie.The latest application filed is for "cavity package with composite substrate".
Patent | Date |
---|---|
Cavity package with composite substrate Grant 10,490,510 - Xue , et al. Nov | 2019-11-26 |
Stress isolation features for stacked dies Grant 10,287,161 - Xue , et al. | 2019-05-14 |
Cavity Package With Composite Substrate App 20180047675 - Xue; Xiaojie ;   et al. | 2018-02-15 |
Cavity package with composite substrate Grant 9,728,510 - Xue , et al. August 8, 2 | 2017-08-08 |
Integrated device die and package with stress reduction features Grant 9,698,127 - Goida , et al. July 4, 2 | 2017-07-04 |
Stress Isolation Features For Stacked Dies App 20170022051 - Xue; Xiaojie ;   et al. | 2017-01-26 |
Integrated Device Die And Package With Stress Reduction Features App 20160336297 - Goida; Thomas M. ;   et al. | 2016-11-17 |
Cavity Package With Composite Substrate App 20160300781 - Xue; Xiaojie ;   et al. | 2016-10-13 |
Integrated device die and package with stress reduction features Grant 9,343,367 - Goida , et al. May 17, 2 | 2016-05-17 |
Vertical mount package and wafer level packaging therefor Grant 9,278,851 - Xue March 8, 2 | 2016-03-08 |
Double-sided package Grant 9,209,121 - Goida , et al. December 8, 2 | 2015-12-08 |
Integrated Device Die And Package With Stress Reduction Features App 20150181697 - Goida; Thomas M. ;   et al. | 2015-06-25 |
Vertical Mount Package And Wafer Level Packaging Therefor App 20140374854 - Xue; Xiaojie | 2014-12-25 |
Air-release features in cavity packages Grant 8,853,839 - Gao , et al. October 7, 2 | 2014-10-07 |
Vertical mount package and wafer level packaging therefor Grant 8,836,132 - Xue September 16, 2 | 2014-09-16 |
Double-sided Package App 20140217566 - Goida; Thomas M. ;   et al. | 2014-08-07 |
Apparatus and method for microelectromechanical systems device packaging Grant 8,692,366 - Xue , et al. April 8, 2 | 2014-04-08 |
Vertical mount package for MEMS sensors Grant 8,624,380 - Xue , et al. January 7, 2 | 2014-01-07 |
Vertical Mount Package And Wafer Level Packaging Therefor App 20130256896 - Xue; Xiaojie | 2013-10-03 |
Systems And Methods For Air-release In Cavity Packages App 20130093031 - Gao; Jia ;   et al. | 2013-04-18 |
Vertical Mount Package for MEMS Sensors App 20120235253 - Xue; Xiaojie ;   et al. | 2012-09-20 |
Vertical mount package for MEMS sensors Grant 8,174,111 - Xue , et al. May 8, 2 | 2012-05-08 |
Apparatus And Method For Microelectromechanical Systems Device Packaging App 20120080764 - Xue; Xiaojie | 2012-04-05 |
Vertical Mount Package for MEMS Sensors App 20100078739 - Xue; Xiaojie ;   et al. | 2010-04-01 |
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