loadpatents
name:-0.013818025588989
name:-0.013159036636353
name:-0.0024230480194092
Xue; Xiaojie Patent Filings

Xue; Xiaojie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xue; Xiaojie.The latest application filed is for "cavity package with composite substrate".

Company Profile
2.15.13
  • Xue; Xiaojie - Bedford MA
  • Xue; Xiaojie - Woburn MA
  • Xue; Xiaojie - Woborn MA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cavity package with composite substrate
Grant 10,490,510 - Xue , et al. Nov
2019-11-26
Stress isolation features for stacked dies
Grant 10,287,161 - Xue , et al.
2019-05-14
Cavity Package With Composite Substrate
App 20180047675 - Xue; Xiaojie ;   et al.
2018-02-15
Cavity package with composite substrate
Grant 9,728,510 - Xue , et al. August 8, 2
2017-08-08
Integrated device die and package with stress reduction features
Grant 9,698,127 - Goida , et al. July 4, 2
2017-07-04
Stress Isolation Features For Stacked Dies
App 20170022051 - Xue; Xiaojie ;   et al.
2017-01-26
Integrated Device Die And Package With Stress Reduction Features
App 20160336297 - Goida; Thomas M. ;   et al.
2016-11-17
Cavity Package With Composite Substrate
App 20160300781 - Xue; Xiaojie ;   et al.
2016-10-13
Integrated device die and package with stress reduction features
Grant 9,343,367 - Goida , et al. May 17, 2
2016-05-17
Vertical mount package and wafer level packaging therefor
Grant 9,278,851 - Xue March 8, 2
2016-03-08
Double-sided package
Grant 9,209,121 - Goida , et al. December 8, 2
2015-12-08
Integrated Device Die And Package With Stress Reduction Features
App 20150181697 - Goida; Thomas M. ;   et al.
2015-06-25
Vertical Mount Package And Wafer Level Packaging Therefor
App 20140374854 - Xue; Xiaojie
2014-12-25
Air-release features in cavity packages
Grant 8,853,839 - Gao , et al. October 7, 2
2014-10-07
Vertical mount package and wafer level packaging therefor
Grant 8,836,132 - Xue September 16, 2
2014-09-16
Double-sided Package
App 20140217566 - Goida; Thomas M. ;   et al.
2014-08-07
Apparatus and method for microelectromechanical systems device packaging
Grant 8,692,366 - Xue , et al. April 8, 2
2014-04-08
Vertical mount package for MEMS sensors
Grant 8,624,380 - Xue , et al. January 7, 2
2014-01-07
Vertical Mount Package And Wafer Level Packaging Therefor
App 20130256896 - Xue; Xiaojie
2013-10-03
Systems And Methods For Air-release In Cavity Packages
App 20130093031 - Gao; Jia ;   et al.
2013-04-18
Vertical Mount Package for MEMS Sensors
App 20120235253 - Xue; Xiaojie ;   et al.
2012-09-20
Vertical mount package for MEMS sensors
Grant 8,174,111 - Xue , et al. May 8, 2
2012-05-08
Apparatus And Method For Microelectromechanical Systems Device Packaging
App 20120080764 - Xue; Xiaojie
2012-04-05
Vertical Mount Package for MEMS Sensors
App 20100078739 - Xue; Xiaojie ;   et al.
2010-04-01

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